Semiconductor processing method of forming complementary N-type doped and P-type doped active regions within a semiconductor substrate
First Claim
1. A semiconductor processing method of forming complementary n-type doped and p-type doped active regions within a semiconductor substrate, the method comprising the following steps:
- providing a semiconductor substrate;
masking a desired n-type region of the substrate while conducting p-type conductivity doping into a desired p-type active region of the substrate;
providing an insulating layer over the substrate over the desired n-type region and the p-type doped region;
patterning the insulating layer to provide a void therethrough to the desired n-type region;
filling the void with an n-type conductively doped polysilicon plug, the plug having an n-type dopant impurity concentration of at least 1×
1020 ions/cm3, the desired n-type region having an n-type dopant concentration prior to the filling step which is in the range of from 0 ions/cm3 to 1×
1019 ions/cm3 ; and
annealing the substrate for a period of time effective to out-diffuse n-type dopant impurity from the n-type conductively doped polysilicon plug into the substrate to form the desired n-type active region having an n-type dopant impurity concentration of at least 1×
1020 ions/cm3 in the substrate.
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Abstract
A semiconductor processing method of forming complementary first conductivity type doped and second conductivity type doped active regions within a semiconductor substrate includes, a) providing a semiconductor substrate; b) masking a desired first conductivity type region of the substrate while conducting second conductivity type doping into a desired second conductivity type active region of the substrate; c) providing an insulating layer over the substrate over the desired first conductivity type region and the second conductivity type doped region; d) patterning the insulating layer to provide a void therethrough to the desired first conductivity type region; e) filling the void with a first conductivity type doped polysilicon plug, the plug having a first conductivity type dopant impurity concentration of at least 1×1020 ions/cm3, the desired first conductivity type region having a first conductivity type dopant concentration prior to the filling step which is in the range of from 0 ions/cm3 to 1×1019 ions/cm3 ; and f) annealing the substrate for a period of time effective to out-diffuse first conductivity type dopant impurity from the first conductivity type doped polysilicon plug into the substrate to form the desired first conductivity type active region having a first conductivity type dopant impurity concentration of at least 1×1020 ions/cm3 in the substrate. Methods of forming CMOS FET transistors, and SRAM and DRAM CMOS circuitry are also disclosed.
140 Citations
26 Claims
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1. A semiconductor processing method of forming complementary n-type doped and p-type doped active regions within a semiconductor substrate, the method comprising the following steps:
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providing a semiconductor substrate; masking a desired n-type region of the substrate while conducting p-type conductivity doping into a desired p-type active region of the substrate; providing an insulating layer over the substrate over the desired n-type region and the p-type doped region; patterning the insulating layer to provide a void therethrough to the desired n-type region; filling the void with an n-type conductively doped polysilicon plug, the plug having an n-type dopant impurity concentration of at least 1×
1020 ions/cm3, the desired n-type region having an n-type dopant concentration prior to the filling step which is in the range of from 0 ions/cm3 to 1×
1019 ions/cm3 ; andannealing the substrate for a period of time effective to out-diffuse n-type dopant impurity from the n-type conductively doped polysilicon plug into the substrate to form the desired n-type active region having an n-type dopant impurity concentration of at least 1×
1020 ions/cm3 in the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A semiconductor processing method of forming CMOS dynamic random access memory within a semiconductor substrate, the memory comprising an array area and an area peripheral to the array, the peripheral area comprising complementary n-type field effect transistors and p-type field effect transistors, the method comprising the following steps:
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providing a semiconductor substrate having a defined memory array area and a defined peripheral area; providing first and second field effect transistor gates in the peripheral substrate area, the first gate to be utilized for formation of an n-type field effect transistor, the second gate to be utilized for formation of a p-type field effect transistor, the first gate defining opposing peripheral substrate regions for formation of desired opposing n-type substrate active regions, the second gate defining opposing peripheral substrate regions for formation of desired opposing p-type substrate active regions; masking the first gate and the desired n-type regions of the peripheral substrate area while conducting p-type conductivity doping into the desired p-type regions of the peripheral substrate area; providing an insulating layer over the peripheral substrate area over the desired n-type regions and the p-type doped regions; patterning the insulating layer to provide a void therethrough to each desired n-type region; filling the respective voids with an n-type conductively doped polysilicon plug, the plugs having an n-type dopant impurity concentration of at least 1×
1020 ions/cm3 the desired n-type regions having an n-type dopant concentration prior to the filling step which is in the range of from 0 ions/cm3 to 1×
1019 ions/cm3 ;annealing the substrate for a period of time effective to out-diffuse n-type dopant impurity from the n-type conductively doped polysilicon plugs into the substrate to form the desired n-type active regions having an n-type dopant impurity concentration of at least 1×
1020 ions/cm3 in the substrate; andproviding a series of dynamic random access memory cells within the array, the memory cells comprising a series of n-type field effect transistors and associated capacitors. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A semiconductor processing method of forming CMOS static random access memory within a semiconductor substrate, the method comprising the following steps:
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providing a semiconductor substrate; providing first, second, third and fourth field effect transistor gates on the substrate, the first and second gates to be utilized for formation of cross-coupled SRAM n-type field effect driver transistors, the third and fourth gates to be utilized for formation of SRAM p-type field effect load transistors, the first and second gates defining respective opposing substrate regions for formation of desired opposing n-type substrate active regions, the third and fourth gates defining respective opposing substrate regions for formation of desired opposing p-type substrate active regions; masking the first gate, the second gate and the desired n-type regions while conducting p-type conductivity doping into the desired p-type regions of the substrate; providing an insulating layer over the substrate over the desired n-type regions and the p-type doped regions; patterning the insulating layer to provide a void therethrough to each desired n-type region; filling the respective voids with an n-type conductively doped polysilicon plug, the plugs having an n-type dopant impurity concentration of at least 1×
1020 ions/cm3 the desired n-type regions having an n-type dopant concentration prior to the filling step which is in the range of from 0 ions/cm3 to 1×
1019 ions/cm3 ;annealing the substrate for a period of time effective to out-diffuse n-type dopant impurity from the n-type conductively doped polysilicon plugs into the substrate to form the desired n-type active regions having an n-type dopant impurity concentration of at least 1×
1020 ions/cm3 in the substrate;electrically interconnecting one of the conductive plugs of the first driver transistor to one of the conductive plugs of the second driver transistor; electrically interconnecting the other conductive plug of the first driver transistor with the second gate and with one of the p-type regions of one of the load transistors; and electrically interconnecting the other conductive plug of the second driver transistor with the first gate and with one of the p-type regions of the other load transistor. - View Dependent Claims (16, 17, 18, 19)
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20. A semiconductor processing method of forming complementary first conductivity type doped and second conductivity type doped active regions within a semiconductor substrate, the method comprising the following steps:
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providing a semiconductor substrate; masking a desired first conductivity type region of the substrate while conducting second conductivity type doping into a desired second conductivity type active region of the substrate; providing an insulating layer over the substrate over the desired first conductivity type region and the second conductivity type doped region; patterning the insulating layer to provide a void therethrough to the desired first conductivity type region; filling the void with a first conductivity type doped polysilicon plug, the plug having a first conductivity type dopant impurity concentration of at least 1×
1020 ions/cm3 the desired first conductivity type region having a first conductivity type dopant concentration prior to the filling step which is in the range of from 0 ions/cm3 to 1×
1019 ions/cm3 ; andannealing the substrate for a period of time effective to out-diffuse first conductivity type dopant impurity from the first conductivity type doped polysilicon plug into the substrate to form the desired first conductivity type active region having a first conductivity type dopant impurity concentration of at least 1×
1020 ions/cm3 in the substrate. - View Dependent Claims (21, 22, 23, 24, 25, 26)
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Specification