Method of making suspended microstructures

• US 5,627,112 A
• Filed: 11/13/1995
• Issued: 05/06/1997
• Est. Priority Date: 11/13/1995
• Status: Expired due to Term

• Current Assignee: DRS Network & Imaging Systems, LLC (Leonardo S.p.A.)
• Original Assignee: Rockwell International Corporation
• Inventors: Seabury, Charles W., Gergis, Isoris S., Tennant, William E.
• Primary Examiner(s): TRINH, MICHAEL MANH
• Application Number:
  US08/555,668
• Time in Patent Office: 540 Days
• Field of Search: 437/228, 437/228 O, 437/229, 437/227, 437/901, 437/921, 437/974, 437/7, 148/DIG. 12, 148/DIG. 135
• US Class Current: 438/113
• CPC Class Codes: G01J 5/20 using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
• CPC Class Codes: G03F 7/00 Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor using photoresist structures for special production processes, see the relevant places, e.g. B44C, H01L, e.g. H01L21/00, H05K
• CPC Class Codes: H01L 2224/11 Manufacturing methods

Abstract

A suspended microstructure process assembly includes a first microstructure assembly, with a temporary substrate having a first surface and a first microstructure fabricated on the first surface; a second microstructure assembly, including a final substrate having a second surface and a second microstructure fabricated on the second surface; connecting elements for joining the first microstructure assembly to the second microstructure assembly with a predetermined separation and alignment; and a removable bond temporarily securing the first microstructure assembly to the second microstructure assembly until the temporary substrate is removed. The connecting elements may be electrically conductive contacts or electrically nonconductive spacers. Electrically conductive contacts may be supplied to the first microstructure from a back side of the first microstructure assembly. The first microstructure fabricated on the first surface may incorporate a removable layer to enable multiple level suspended structures.

Claims

1. A method of making a suspended microstructure, comprising the steps of:

providing a temporary substrate having a first surface;

fabricating a first microstructure on the first surface to form a first microstructure assembly;

providing a final substrate having a second surface;

fabricating a second microstructure on the second surface to form a second microstructure assembly;

forming at least one connecting element joining the first microstructure assembly and the second microstructure assembly such that the first and second surfaces are opposed with a predetermined separation and alignment between the first and second microstructures;

introducing a removable bonding medium into the separation between the first and second microstructures to temporarily secure the first microstructure assembly to the second microstructure assembly;

removing the temporary substrate after introducing the removable bonding medium; and

removing the bonding medium, thereby leaving;

the first micro, structure affixed to the final substrate while preserving the separation and alignment between the first and second microstructures.

2. The method of claim 1, wherein the step of forming at least one connecting element comprises the step of:

attaching at least one electrically conductive contact between the first microstructure assembly and the second microstructure assembly such that the first and second surfaces are opposed with a predetermined separation and alignment between the first and second microstructures and such that an electrical connection is established between the first and second microstructures.

3. The method of claim 2, wherein the step of attaching at least one electrically conductive contact comprises the step of:

attaching at least one electrically conductive contact of material selected from the group consisting of alloys of indium, tin, lead, bismuth, and gallium between the first microstructure assembly and the second microstructure, assembly such that the first and second surfaces are opposed with a predetermined separation and alignment between the first and second microstructures and such that an electrical connection is established between the first and second microstructures.

4. The method of claim 1, wherein the step of forming at least one connecting element comprises the step of:

attaching at least one electrically nonconductive spacer between the first microstructure assembly and the second microstructure assembly such that the first and second surfaces are opposed with a predetermined separation and alignment between the first and second microstructures.

5. The method of claim 4, further comprising, after the step of removing the temporary substrate, the step of:

forming at least one electrically conductive contact to the first microstructure from a back side of the first microstructure assembly opposite the connecting element between the first microstructure assembly and the second microstructure assembly.

6. The method of claim 1, wherein the step of fabricating a first microstructure comprises the step of:

fabricating a first microstructure, including a removable layer to enable multiple level suspended structures, on the first surface to form a first microstructure assembly.

7. The method of claim 1, wherein the step of introducing a removable bonding medium further comprises the step of:

injecting an organic bonding medium between the first and second microstructures to temporarily secure the first microstructure assembly to the second microstructure assembly.

8. The method of claim 7, wherein the step of removing the bonding medium further comprises the step of:

removing the organic bonding medium by dry etching with an oxygen plasma, thereby leaving the first micro structure affixed to the final substrate while preserving the separation and alignment between the first and second microstructures.

9. The method of claim 1, further comprising, prior to the step of removing the bonding medium, the step of:

dicing the affixed first microstructure, second microstructure, and final substrate assembly to facilitate, after the step of removing the bonding medium, separating the assembly into a plurality of suspended microstructure devices.

10. The method of claim 1, further comprising, after the step of removing the bonding medium, the step of:

dicing the affixed first microstructure, second microstructure, and final substrate assembly to separate the assembly into a plurality of suspended microstructure devices.