Placement system using a split imaging system coaxially coupled to a component pickup means

• US 5,627,913 A
• Filed: 01/26/1996
• Issued: 05/06/1997
• Est. Priority Date: 08/27/1990
• Status: Expired due to Fees

• Current Assignee: Genrad Incorporated (Teradyne Incorporated)
• Original Assignee: Sierra Research and Technology Incorporated (Analog Devices, Inc.)
• Inventors: Spigarelli, Donald J., Pinette, Bryan R., LaFleur, Ernest, DeCarlo, John M.
• Primary Examiner(s): JOHNS, ANDREW W
• Application Number:
  US08/592,599
• Time in Patent Office: 466 Days
• Field of Search: 382/146, 382/151, 382/294, 382/295, 395/155, 395/161, 348/87, 29/740
• US Class Current: 382/151
• CPC Class Codes: H05K 13/0815 Controlling of component placement on the substrate during or after manufacturing

Abstract

A placement apparatus for placing and mounting circuit components or devices in aligned combination with circuit boards. The apparatus includes an imaging system, a first stage moveable in first and second opposite directions between first and second predetermined positions, for positioning the circuit board onto which the component is to be placed within a field of view of the imaging system. A second stage, for holding the circuit component, is movably coupled to the first stage. The apparatus further includes a component pick-up system disposed about the first stage for picking up the circuit component from the second stage and placing the circuit component in a predetermined position on the first stage. The imaging system is coupled to a graphical user interface system for providing a position indicator on a monitor screen, wherein the position indicator identifies the location of a particular feature of the circuit board or the circuit component.

Claims

1. A placement system for placing a circuit component on a circuit board, said placement system comprising:

a viewing system providing a single optical perspective via a split imaging system;

a first stage, for positioning the circuit board onto which the component is to be placed within the field of view of said viewing system;

a second stage, coupled to said first stage, for holding the circuit component, said second stage moveable in at least first and second different directions;

a component pick-up system disposed about said first stage, said component pick-up system for picking up components from said second stage and placing the component in a predetermined position on said first stage wherein said viewing system is coaxially coupled to said component pick-up system;

a monitor having a display screen, coupled to said viewing system, wherein said viewing system provides an image within a predetermined field of view on said monitor display screen; and

a graphical user interface coupled to said monitor, said user interface for providing a position indicator on said monitor display screen, wherein said position indicator identifies the location of a particular feature of said circuit board.

2. The system of claim 1 wherein said component pick-up system comprises a vacuum tube.

3. The system of claim 2 wherein said position indicator identifies the position of a pad on the circuit board.

4. The system of claim 3 wherein said position indicator is a first one of a first plurality of symbols, each of said symbols indicating the position of a corresponding one of a second plurality of pads disposed on the circuit board.

5. The system of claim 4 wherein said position indicator is provided having a shape selected from the group consisting of:

a crosshair;

a square;

a rectangle;

a triangle;

a circle; and

a moire pattern.

6. A method for placing a circuit component on a particular site of a circuit board, said method comprising the steps of:

a) positioning a circuit board at a first predetermined location generally within the field of view of a split imaging system providing a single optical perspective;

b) restricting the movement of the circuit board such that the circuit board is only able to move in one linear direction relative to the imaging system;

c) identifying the position of a particular feature of the circuit board with a position indicator;

d) displaying the position indicator on a graphical display;

e) positioning the circuit component at a second predetermined location within the field of view of the imaging system by manipulation of a component pick-up system, the split imaging system coaxially coupled to the component pick-up system; and

f) aligning a feature of the circuit component with the position indicator displayed on the graphical display.

7. The method of claim 6 further comprising steps of:

verifying that the feature of the circuit component is aligned with the feature of the circuit board; and

placing the circuit component on the placement site of the circuit board.

8. The method of claim 7 wherein:

the circuit board feature corresponds to a pad; and

the circuit component feature corresponds to a lead.

9. The method of claim 8 wherein the step of identifying includes the step of using a graphical user interface to provide the position indicator on the graphical display.

10. A method for placing a circuit component on a particular site of a circuit board, said method comprising the steps of:

moving a first stage in at least one of first and second directions to position the circuit board at a first predetermined location generally within a field of view of a split imaging system coaxially coupled to said first stage and providing a single optical perspective;

b) restricting the movement of the first stage such that the circuit board is only able to move in a first one of said first and second directions;

c) marking, with a graphical position indicator, the locations of a particular feature of said circuit board;

d) displaying the graphical position indicator on a graphical display;

e) moving the first stage to a second predetermined position such that a circuit component is located at a second predetermined location within the field of view of the imaging system; and

f) moving a second stage, said second stage coupled to said first stage, in at least one direction to align a feature of the circuit component with the graphical position indicator displayed on the graphical display.

11. The method of claim 10 further comprising steps of:

moving the first stage back to the first predetermined position such that the circuit component is aligned with said printed circuit board; and

placing the circuit component at the placement site of the printed circuit board.

12. The method of claim 11 wherein before the step of placing the circuit component at the placement site of the printed circuit board the method further comprises the step of verifying that a particular feature of said circuit component is aligned with a particular feature of said circuit board.

13. The method of claim 12 further comprising the step of displaying a split image of the circuit board placement site on the graphical display and wherein the marking step includes marking at least one pads in the placement site.

14. The method of claim 13 further comprising the step of displaying a split image of the circuit component site on the graphical display and wherein a circuit component lead is aligned with the alignment indicators displayed on the graphical display.