Personal digital assistant module implemented as a low-profile printed circuit assembly having a rigid substrate wherein IC devices are mounted within openings wholly between opposite plane surfaces of the rigid substrate
First Claim
1. A digital assistant module, comprising:
- an enclosure for enclosing and supporting internal elements;
a plurality of integrated circuit (IC) chips within the enclosure. including a CPU chip, interconnected by electrically conductive traces, the IC chips for performing management, calculation, display, and storage functions for the digital assistant module;
a substantially rigid substrate within the enclosure forming a support structure for the IC chips mounted wholly within cavities opening to one or both opposite parallel surfaces of the substantially rigid substrate, providing thereby a low-profile assembly; and
a touchscreen combination display and input device implemented on a surface of the enclosure.
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Accused Products
Abstract
A personal digital assistant module with a local CPU, memory, and I/O interface has a host interface comprising a bus connected to the local CPU and a connector at a surface of the personal digital assistant for interfacing to a bus connector of a host general-purpose computer, providing direct bus communication between the personal digital assistant and the host general-purpose computer. In an embodiment, the personal digital assistant also stores a security code. The personal digital assistant according to the invention forms a host/satellite combination with a host computer having a docking bay, wherein upon docking a docking protocol controls access by the host to memory of the personal digital assistant based on one or more passwords provided by a user to the host. In another embodiment the personal digital assistant also has an expansion port connected to the local CPU, and expansion peripheral devices may be connected and operated through the expansion port. In yet another embodiment a low-profile construction technique is used wherein discrete elements are assembled wholly enclosed within openings in a rigid substrate having interconnects on a surface of the substrate.
98 Citations
20 Claims
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1. A digital assistant module, comprising:
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an enclosure for enclosing and supporting internal elements; a plurality of integrated circuit (IC) chips within the enclosure. including a CPU chip, interconnected by electrically conductive traces, the IC chips for performing management, calculation, display, and storage functions for the digital assistant module; a substantially rigid substrate within the enclosure forming a support structure for the IC chips mounted wholly within cavities opening to one or both opposite parallel surfaces of the substantially rigid substrate, providing thereby a low-profile assembly; and a touchscreen combination display and input device implemented on a surface of the enclosure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A digital assistant module, comprising:
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an enclosure for enclosing and supporting internal elements; a plurality of integrated circuit (IC) chips within the enclosure, including a CPU chip, for performing management, calculation, display, and storage functions for the digital assistant module, the IC chips encapsulated within a polymeric material forming a substantially rigid substrate with bonding pads of the IC chips exposed on a surface of the substrate; and one or more flexible-film substrates having conductive traces provided thereon, overlying the substantially rigid substrate, the conductive traces bonded to the bonding pads of the encapsulated IC chips, thereby providing electrical interconnection between the encapsulated IC chips; and a touchscreen combination display and input device implemented on a surface of the enclosure. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification