Metal ball grid array package with improved thermal conductivity

• US 5,629,835 A
• Filed: 07/19/1994
• Issued: 05/13/1997
• Est. Priority Date: 07/19/1994
• Status: Expired due to Fees

• Current Assignee: Advanced Technology Incubator Incorporated
• Original Assignee: OLIN Corporation
• Inventors: Mahulikar, Deepak, Braden, Jeffrey S., Hoffman, Paul R.
• Primary Examiner(s): SPARKS, DONALD ALAN
• Application Number:
  US08/277,387
• Time in Patent Office: 1,029 Days
• Field of Search: 174/52.1, 174/52.4, 174/256, 174/257, 174/258, 174/260, 174/252, 361/760, 361/761, 361/762, 361/820, 361/708, 361/709, 361/710, 361/713, 361/714, 361/715, 361/718, 361/719, 361/720, 361/723, 427/96, 427/388.1, 427/388.2-388.4, 427/431, 427/433, 428/901, 428/341, 228/180.21, 257/678, 257/692, 257/697, 257/924, 257/707, 257/709, 257/711, 257/712, 257/713, 257/717
• US Class Current: 361/719
• CPC Class Codes: H01L 21/4828 Etching etching for cleaning without patterning H01L21/4835
• CPC Class Codes: H01L 2221/68377 with parts of the auxiliary support remaining in the finished device
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/0652 Bump or bump-like direct electrical connections from substrate to substrate
• CPC Class Codes: H01L 2225/06541 Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
• CPC Class Codes: H01L 2225/06572 Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 2225/06582 Housing for the assembly, e.g. chip scale package [CSP]
• CPC Class Codes: H01L 2225/06586 Housing with external bump or bump-like connectors
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 2225/1076 Shape of the containers
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/142 Metallic substrates having insulating layers
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/15331 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/163 : Connection portion, e.g. seal
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

There is disclosed components for electronic packaging applications having integral bumps. A leadframe is formed by etching a metallic strip from one side to form outwardly extending, substantially perpendicular integral bumps. The metallic strip is then etched from the opposite side to form individual leads. When the integrally bumped component is an package base, fatigue of solder balls is reduced.

Claims

1. A ball grid array electronic package having improved thermal conductivity and reduced solder member creep, comprising:

a base selected from the group consisting of aluminum and aluminum alloys having first and second opposing sides;

an anodization layer coating at least a portion of said base;

a cavity formed in said first surface;

a semiconductor device bonded to the base in said cavity;

a metallized circuit trace directly on said anodization layer extending from said cavity to a peripheral portion of said first surface of said base, said metallized circuit trace electrically interconnected to said semiconductor device and bonded to a solder member; and

a cover sealing said cavity and encapsulating said semiconductor device and an inner portion of said metallized circuit trace.

2. The electronic package of claim 1 wherein that portion of said anodization layer underlying said potting compound is contains pores and that portion of said anodization layer underlying said metallized circuit trace is sealed.

3. The electronic package of claim 1 wherein said anodization layer contains a uniform dispersion of pores.

4. The electronic package of claim 3 wherein said pores have an average diameter of from 50 angstroms to 500 angstroms.

5. The electronic package of claim 3 wherein said solder member is solder balls bonded to a peripheral portion of said metallized circuit trace.

6. The electronic package of claim 3 wherein said solder member is solder pads bonded to a peripheral portion of said metallized circuit trace.

7. The electronic package of claim 3 wherein said cover is discrete and adhesively sealed to said base.

8. The electronic package of claim 3 wherein said cover is a potting compound filling said cavity.

9. A component for a ball grid array electronic package having improved thermal conductivity and reduced solder member creep, comprising:

a base selected from the group consisting of aluminum and aluminum alloys having first and second opposing sides;

an anodization layer coating at least a portion of said base;

a cavity formed in said first surface; and

a metallized circuit trace directly on said anodization layer extending from said cavity to a peripheral portion of said first surface of said base, said metallized circuit trace electrically interconnected to said semiconductor device and bonded to a solder member.

10. The component of claim 9 wherein said anodization layer contains a uniform dispersion of pores.

11. The component of claim 10 wherein said pores have an average diameter of from 50 angstroms to 500 angstroms.

12. The component of claim 10 wherein said solder member is solder balls bonded to a peripheral portion of said metallized circuit trace.

13. The component of claim 10 wherein said solder member is solder pads bonded to a peripheral portion of said metallized circuit trace.