High performance bipolar devices with plurality of base contact regions formed around the emitter layer

• US 5,631,495 A
• Filed: 11/29/1994
• Issued: 05/20/1997
• Est. Priority Date: 11/29/1994
• Status: Expired due to Fees

• Current Assignee: Card Guard Technologies Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Johnson, Eric D., Hulvey, Michael D., Schmidt, Nicholas T., Lanpher, Albert E., Kieft, Kenneth K. III, Dunn, James S., Kertis, Robert A.
• Primary Examiner(s): Crane, Sara W.
• Assistant Examiner(s): Abraham, Fetsum
• Application Number:
  US08/346,122
• Time in Patent Office: 903 Days
• Field of Search: 257/576, 257/587, 257/592, 257/655
• US Class Current: 257/587
• CPC Class Codes: H01L 23/4824 Pads with extended contours, e.g. grid structure, branch structure, finger structure
• CPC Class Codes: H01L 29/42304 Base electrodes for bipolar transistors
• CPC Class Codes: H01L 29/66272 Silicon vertical transistors H01L29/66242, H01L29/66257 and H01L29/66265 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10S 148/01 Bipolar transistors-ion implantation

Abstract

High-performance bipolar transistors with improved wiring options and fabrication methods therefore are set forth. The bipolar transistor includes a base contact structure that has multiple contact pads which permit multiple device layouts when wiring to the transistor. For example, a first device layout may comprise a collector-base-emitter device layout, while a second device layout may comprise a collector-emitter-base device layout. More specifically, the base contact structure at least partially surrounds the emitter and has integral contact pads which extend away from the emitter. Further, sections of the base contact structure are disposed on an insulating layer outside of the perimeter of the base region of the transistor, while other sections directly contact the base region. Specific details of the bipolar transistor, and fabrication methods therefore are also set forth.

Claims

1. A base contact structure for a transistor having a base region, an emitter region and a collector region, said base contact structure comprising:

a unitary electrical contact structure at least partially disposed above, and electrically connected to, said base region of said transistor, said unitary electrical contact structure at least partially surrounding three sides of said emitter region of said transistor; and

wherein said unitary electrical contact structure includes a plurality of contact regions, each contact region of said plurality of contact regions extending away from said emitter region, said plurality of contact regions facilitating selective electrical contact to said base region of said transistor through said unitary electrical contact structure.

2. The base contact structure of claim 1, wherein said emitter region has four sides, and wherein said unitary electrical contact structure has at least three sides, each side of said at least three sides of said unitary electrical contact structure being adjacent to a different side of said four sides of said emitter region.

3. The base contact structure of claim 2, wherein each side of said unitary electrical contact structure has at least one contact region therein.

4. The base contact structure of claim 2, wherein said unitary electrical contact structure encircles said emitter region and has four sides, each side of said four sides of said unitary electrical contact structure having at least one contact pad integral therewith.

5. A transistor having a base region, an emitter region and a collector region, said transistor further comprising:

a substrate;

an insulating layer disposed above said substrate, said insulating layer having a discontinuity therein, said base region residing within said discontinuity in said insulating layer;

a unitary base contact structure in electrical contact with said base region, said unitary base contact structure at least partially surrounding three sides of said emitter region, said base contact structure having at least three planar legs, said at least three planar legs being electrically connected, each planar leg of said at least three planar legs being adjacent to a different side of said emitter region;

a first planar leg of said at least three planar legs of said unitary base contact structure being disposed at least partially above said base region; and

a second planar leg of said at least three planar legs of said base contact structure being disposed completely above said insulating layer so as not to reside over said base region.

6. The transistor of claim 5, wherein said emitter region has four sides, and wherein said first planar leg of said at least three planar legs of said unitary base contact structure is adjacent to a first side of said four sides of said emitter region, and said second planar leg of said at least three planar legs of said unitary base contact structure is adjacent to a second side of said four sides of said emitter region, said first side of said emitter region and said second side of said emitter region being substantially perpendicular.

7. The transistor of claim 6, wherein said unitary base contact structure encircles said emitter region and has four sides, a first side of said four sides of said base contact structure comprising said first planar leg of said at least three planar legs of said unitary base contact structure, and a second side of said four sides of said unitary base contact structure comprising said second planar leg of said at least three planar legs of said unitary base contact structure.

8. The transistor of claim 7, wherein said unitary base contact structure further includes a third planar leg disposed at least partially above said base region of said transistor and comprising a third side of said four sides of said unitary base contact structure, said third side of said unitary base contact region being adjacent to a third side of said emitter region and parallel to said first planar leg of said unitary base contact structure.

9. The transistor of claim 8, wherein said unitary base contact structure further includes a fourth planar leg disposed completely above said insulating layer so as not to reside over said base region, said fourth planar leg comprising a fourth side of said four sides of said unitary base contact structure, said fourth side of said unitary base contact structure being adjacent to a fourth side of said emitter region and parallel to said second planar leg of said unitary base contact structure.

10. A transistor having a base region, an emitter region and a collector region, said transistor further comprising:

a first metallization layer including a unitary base contact structure, said unitary base contact structure being electrically connected to said base region, and said unitary base contact structure at least partially surrounding three sides of said emitter region and having at least two contact pads on an upper surface thereof;

a second metallization layer disposed above said first metallization layer, said second metallization layer having a first post electrically coupled to a first contact pad of said at least two contact pads of said unitary base contact structure; and

an insulating layer disposed over a second contact pad of said at least two contact pads of said unitary base contact structure to electrically insulate said second contact pad of said unitary base contact structure.

11. The transistor of claim 10, wherein said first metallization layer further includes a collector contact structure and an emitter contact structure, said collector contact structure being electrically connected to said collector region of said transistor and said emitter contact structure being electrically connected to said emitter region of said transistor.

12. The transistor of claim 11, wherein said second metallization layer further includes a second post electrically coupled to said emitter contact structure, and a third post electrically coupled to said collector contact structure for facilitating electrical contact to said collector region through said collector contact structure and to said emitter region through said emitter contact structure.

13. The transistor of claim 12, further including a third metallization layer, said third metallization layer having a first section electrically coupled to said first post of said second metallization layer for facilitating electrical connection to said base region of said transistor.

14. The transistor of claim 12, further including a third metallization layer, said third metallization layer having a second section electrically coupled to said second post of said second metallization layer, a portion of said second section of said third metallization layer being disposed above said second contact pad of said unitary base contact structure.

15. A transistor having a base region, an emitter region and a collector region, said transistor further comprising:

an emitter contact structure disposed above, and electrically connected to, said emitter region;

a unitary base contact structure partially disposed above, and electrically connected to, said base region, said unitary base contact structure at least partially surrounding said emitter contact structure, and said unitary base contact structure having a plurality of planar legs, said plurality of planar legs being electrically interconnected;

a first contact pad integral with said unitary base contact structure and positioned within a first planar leg of said plurality of planar legs of said unitary base contact structure; and

a second contact pad integral with said unitary base contact structure and positioned within a second planar leg of said plurality of planar legs of said unitary base contact structure, wherein electrical connection to said first contact pad facilitates a first contact layout and electrical connection to said second contact pad facilitates a second contact layout, said first contact layout and said second contact layout being different contact layouts viewed from a plan view of said transistor.

16. The transistor of claim 15, wherein said first contact layout comprises a collector-base-emitter contact layout and wherein said second contact layout comprises a collector-emitter-base contact layout.

17. The transistor of claim 15, wherein said first contact pad of said unitary base contact structure is positioned such that said first contact pad, said collector region and said emitter contact structure are disposed in a triangular orientation viewed from a plan view of the transistor.

18. The transistor of claim 17, wherein said triangular orientation comprises a substantially right triangular orientation, and wherein said collector region and said first contact pad define endpoints of a hypotenuse of said substantially right triangular orientation viewed from said plan view of the transistor.