Electronic component cooling unit

• US 5,632,158 A
• Filed: 03/19/1996
• Issued: 05/27/1997
• Est. Priority Date: 03/20/1995
• Status: Expired due to Fees

• Current Assignee: Calsonic Kansei Corporation
• Original Assignee: Calsonic Kansei Corporation
• Inventors: Tajima, Makoto
• Primary Examiner(s): DOERRLER, WILLIAM CHARLES
• Application Number:
  US08/617,556
• Time in Patent Office: 434 Days
• Field of Search: 62/259.1, 165/104.26, 165/104.33, 361/700
• US Class Current: 62/259.2
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

In an electronic component cooling unit, one surface of a cold plate, on the other surface of which an electronic component is mounted, is covered with a cover to form a tank section in which a refrigerant is stored, a container pipe is extended from the cover in such a manner that the container pipe is communicated with the tank section, a wick pole is fitted in the container pipe so that a plurality of axial passageways are formed in the container pipe, and air is removed from the tank section and the axial passageways.

Claims

1. An electronic component cooling unit, comprising:

a cold plate, an electronic component being mounted on one surface of said cold plate;

a cover member covering the other surface of said cold plate to constitute a tank section in which a refrigerant is stored;

a container pipe extending from said cover member in such a manner that said container pipe is communicated with said tank section; and

a wick pole being fitted in said container pipe, said wick pole including an axial portion extending along a central longitudinal axis of said container pipe, and a plurality of radial protrusions extending outwardly from said axial portion, so that a plurality of axial passageways are formed in said container pipe, said tank section and said axial passageways being evacuated into a vacuum.

2. An electronic component cooling unit as claimed in claim 1, wherein said other surface of said cold plate has a recess which constitutes said tank section.

3. An electronic component cooling unit as claimed in claim 2, wherein a bottom of said recess has fine roughness.