Planarization of insulation film using low wettingness surface
First Claim
1. A method for planarizing an insulation film formed on an uneven surface, comprising:
- a first step of forming said insulation film on said uneven surface, said insulation film having a lowered wettingness at least on a surface of said insulation film;
a second step of coating a hydrophilic hardenable solution on said insulation film formed by the first step;
a third step of hardening said hydrophilic hardenable solution to form a hardened film on said insulation film; and
a fourth step of etching back said hardened film toward said insulation film.
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Abstract
A planarization method comprises forming on an uneven surface an silicon oxide film having a low wettingness at least on its surface. The low wettingness of the silicon oxide film is obtained by increasing the silicon/oxygen atom ratio by means of argon sputtering or plasma CVD method. A silica solution is subsequently spin-coated onto the silicon oxide film. Since the surface of the silicon oxide film has a low wettingness, more of the coated silica solution stands on recessed portions than on raised portions, resulting in a flat surface of the coated solution. After the coated silica solution has been hardened, etching-back can be carried out until the coated silica solution is completely removed, thereby achieving the planarized surface of the silicon oxide film.
43 Citations
11 Claims
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1. A method for planarizing an insulation film formed on an uneven surface, comprising:
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a first step of forming said insulation film on said uneven surface, said insulation film having a lowered wettingness at least on a surface of said insulation film; a second step of coating a hydrophilic hardenable solution on said insulation film formed by the first step; a third step of hardening said hydrophilic hardenable solution to form a hardened film on said insulation film; and a fourth step of etching back said hardened film toward said insulation film. - View Dependent Claims (2, 3, 4, 5)
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6. A method for planarizing an insulation film formed on an uneven surface, comprising:
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a first step of forming a silicon oxide film on said uneven surface, said silicon oxide film having a lowered wettingness at least on the surface of said silicon oxide film; a second step of coating a hydrophilic silica solution on said silicon oxide film; a third step of hardening said silica solution to form a hardened film on said silicon oxide film; and a fourth step of etching back said hardened film toward said silicon oxide film until said hardened film is completely removed. - View Dependent Claims (7, 8, 9, 10, 11)
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Specification