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Multilayer wiring structure for attaining high-speed signal propagation

  • US 5,633,479 A
  • Filed: 07/25/1995
  • Issued: 05/27/1997
  • Est. Priority Date: 07/26/1994
  • Status: Expired due to Fees
First Claim
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1. A multilayer wiring structure for use in a semiconductor device, comprising:

  • a potential supply layer including a plurality of parallel strip-shaped conductors, each of which has a predetermined potential; and

    a signal wiring layer provided on said potential supply layer, with an insulating layer interposed therebetween, said signal wiring layer including wires which are arranged in parallel with the parallel strip-shaped conductors.

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