Unitary lens semiconductor device

• US 5,633,527 A
• Filed: 02/06/1995
• Issued: 05/27/1997
• Est. Priority Date: 02/06/1995
• Status: Expired due to Term

• Current Assignee: Sandia Corporation (Martin Marietta Corporation)
• Original Assignee: Sandia Corporation (Martin Marietta Corporation)
• Inventors: Lear, Kevin L.
• Primary Examiner(s): JACKSON JR, JEROME
• Application Number:
  US08/384,089
• Time in Patent Office: 841 Days
• Field of Search: 257/432, 257/98, 257/101, 257/191, 257/184, 372/44, 372/50, 372/101
• US Class Current: 257/432
• CPC Class Codes: G02B 2006/12102 Lens
• CPC Class Codes: G02B 2006/12121 Laser
• CPC Class Codes: G02B 6/12004 Combinations of two or more optical elements
• CPC Class Codes: H01L 31/02327 the optical elements being integrated or being directly associated to the device, e.g. back reflectors optical coatings H01L31/0216
• CPC Class Codes: H01L 33/02 characterised by the semiconductor bodies
• CPC Class Codes: H01L 33/105 with a resonant cavity structure
• CPC Class Codes: H01S 5/0267 Integrated focusing lens H01S5/18388 takes precedence
• CPC Class Codes: H01S 5/18311 using selective oxidation
• CPC Class Codes: H01S 5/18327 Structure being part of a DBR H01S5/18391 takes precedence
• CPC Class Codes: H01S 5/18333 only above the active layer
• CPC Class Codes: H01S 5/18372 by native oxidation
• CPC Class Codes: H01S 5/18388 Lenses
• CPC Class Codes: H01S 5/2205 comprising special burying or current confinement layers

Abstract

A unitary lens semiconductor device and method. The unitary lens semiconductor device is provided with at least one semiconductor layer having a composition varying in the growth direction for unitarily forming one or more lenses in the semiconductor layer. Unitary lens semiconductor devices may be formed as light-processing devices such as microlenses, and as light-active devices such as light-emitting diodes, photodetectors, resonant-cavity light-emitting diodes, vertical-cavity surface-emitting lasers, and resonant cavity photodetectors.

Claims

1. A unitary lens semiconductor device comprising:

(a) a transparent substrate having at least one semiconductor layer thereon, the semiconductor layer having a composition varying Continuously or in discrete steps in a direction normal to an upper surface of the substrate; and

(b) a lower-refractive-index portion formed in the semiconductor layer and extending downward below the upper surface of the semiconductor layer to form a lens having a curved shape defined, at least in part, by the variation in composition of the semiconductor layer for redirecting or focusing light rays.

3. The unitary lens semiconductor device of claim 1 wherein the lens shape is further defined by a patterned mask layer above the lower-refractive-index portion.

4. The unitary lens semiconductor device of claim 1 wherein the semiconductor layer comprises an aluminum alloy, and the lower-refractive-index portion is an oxide of aluminum.

5. The unitary lens semiconductor device of claim 4 wherein the aluminum alloy includes at least one element selected from the group consisting of As, Ga, In, and P.

2. A unitary lens semiconductor device comprising:

(a) a transparent substrate having an upper surface;

(b) at least one semiconductor layer above the substrate, the semiconductor layer having a composition varying continuously or stepwise in a direction normal to the upper surface; and

(c) a mesa formed within the semiconductor layer, the mesa having at least one sidewall wherefrom a lower-refractive-index portion of the semiconductor layer extends laterally inward to form a lens having a curved shape defined, at least in part, by the variation in composition of the semiconductor layer.

6. The unitary lens semiconductor device of claim 2 wherein the lens shape is further defined by a shape of the mesa sidewall.

7. The unitary lens semiconductor device of claim 2 wherein the semiconductor layer comprises an aluminum alloy, and the lower-refractive-index portion is an oxide of aluminum.

8. The unitary lens semiconductor device of claim 7 wherein the aluminum alloy includes at least one element selected from the group consisting of As, Ga, In, and P.

9. The unitary lens semiconductor device of claim 2 wherein at least one of the semiconductor layers comprises a plurality of sub-layers, and the semiconductor composition is different in adjacent sub-layers.

10. The unitary lens semiconductor device of claim 9 wherein the sub-layers are separated by spacer layers.

11. A unitary lens semiconductor device comprising:

(a) a semiconductor substrate;

(b) a plurality of semiconductor layers grown above the substrate further comprising a light-active region having a semiconductor junction therein and at least one lens-forming region, the lens-forming region having a semiconductor composition varying continuously or stepwise in the growth direction and including a lower-refractive-index portion having a curved shape to define a unitary lens; and

(c) electrodes above and below the semiconductor junction for electrically activating the light-active region.

12. The unitary lens semiconductor device of claim 11 further comprising a mesa extending downward at least partially into the lens-forming region, the mesa having at least one sidewall wherefrom the lower-refractive-index portion extends laterally inward, the inward lateral extent of the lower-refractive-index portion varying in the growth direction.

13. The unitary lens semiconductor device of claim 12 wherein the inward lateral extent of the lower-refractive-index portion is defined at least in part by the semiconductor composition in the lens-forming region.

14. The unitary lens semiconductor device of claim 11 wherein the lens-forming region comprises an aluminum alloy, and the lower-refractive-index portion is an oxide of aluminum.

15. The unitary lens semiconductor device of claim 14 wherein the aluminum alloy includes at least one element selected from the group consisting of As, Ga, In, and P.

16. The unitary lens semiconductor device of claim 11 wherein the lens-forming region comprises at least two of the plurality of semiconductor layers, with the semiconductor layers of the lens-forming region each having a fixed semiconductor composition therein, and the semiconductor composition varying from one layer to an adjacent layer.

17. The unitary lens semiconductor device of claim 11 wherein one of the electrodes is located on a top surface of the unitary lens, and the unitary lens defines a current channel from the electrode to the light-active region.

18. The unitary lens semiconductor device of claim 17 wherein the current channel defines a light-active area of the light-active region.

19. The unitary lens semiconductor device of claim 11 whereto the semiconductor junction is formed from a pair of cladding layers surrounding an active layer, one of the cladding layers having a p-type dopant, and the other cladding layer having an n-type dopant.

20. The unitary lens semiconductor device of claim 19 wherein the active layer comprises at least one quantum-well layer.

21. The unitary lens semiconductor device of claim 20 wherein the quantum-well layer is comprised of a compound semiconductor selected from the group consisting of III-V compound semiconductors anti II-VI compound semiconductors.

22. The unitary lens semiconductor device of claim 21 wherein the quantum-well layer is comprised of a III-V compound semiconductor selected from the group consisting of InGaAs, GaAs, AlGaAs, AlGalnP, InGaP, InGaAsP, AlGaAsP, and InAlGaAs.

23. The unitary lens semiconductor device of claim 11 wherein the semiconductor junction is forward-biased for generating light therein.

24. The unitary lens semiconductor device of claim 23 wherein the unitary lens collimates the light generated in the semiconductor junction.

25. The unitary lens semiconductor device of claim 23 wherein the unitary lens focuses the light generated in the semiconductor junction at a focal point therefrom.

26. The unitary lens semiconductor device of claim 23 further comprising a pair of stack mirrors surrounding the semiconductor junction forming a resonant cavity.

27. The unitary lens semiconductor device of claim 26 wherein the resonant cavity surrounding the semiconductor junction in combination with the light active region forms a resonant-cavity light-emitting diode.

28. The unitary lens semiconductor device of claim 26 wherein the resonant cavity surrounding the semiconductor junction in combination with the light-active region forms a vertical-cavity surface-emitting laser.

29. The unitary lens semiconductor device or claim 26 wherein the unitary lens is located outside the resonant cavity.

30. The unitary lens semiconductor device of claim 26 wherein the unitary lens is located within the resonant cavity.

31. The unitary lens semiconductor device of claim 30 wherein the unitary lens provides means for defining a lateral mode for the light.

32. The unitary lens semiconductor device of claim 11 wherein the semiconductor junction is reverse-biased for detecting light therein.

33. The unitary lens semiconductor device of claim 32 further comprising a pair of stack mirrors surrounding the active region and forming in combination a resonant-cavity photodetector.

34. A unitary lens semiconductor device comprising:

(a) a transparent substrate having an upper surface and a lower surface;

(b) at least one semiconductor layer above the upper surface of the substrate, the semiconductor layer having a composition varying continuously or stepwise along an optical axis normal to the upper surface and a lower-refractive-index portion extending downward into the semiconductor layer to provide a curved surface that defines at least one unitary lens for redirecting light rays;

(c) a light-active region formed below the lower surface of the substrate and having a semiconductor junction therein, the light-active region having at least one light-active area centered about an optical axis of each unitary lens; and

(d) electrodes above and below the semiconductor junction for electrically activating the light-active region.

35. The unitary lens semiconductor device of claim 34 further comprising at least one mesa extending downward at least partially into the semiconductor layer, each mesa having at least one sidewall wherefrom the lower-refractive-index portion extends laterally inward to further define the unitary lens.

36. The unitary lens semiconductor device of claim 35 wherein the inward lateral extent of the lower-refractive-index portion is defined by the composition of the semiconductor layer.

37. The unitary lens semiconductor device of claim 34 wherein the downward extent of the lower-refractive-index portion is defined by the composition of the semiconductor layer.

38. The unitary lens semiconductor device of claim 34 wherein the semiconductor layer comprises an aluminum alloy, and the lower-refractive-index portion is an oxide of aluminum.

39. The unitary lens semiconductor device of claim 38 wherein the aluminum alloy includes at least one element selected from the group consisting of As, Ga, In, and P.

40. The unitary lens semiconductor device of claim 34 wherein the semiconductor junction is forward-biased for generating light.

41. The unitary lens semiconductor device of claim 34 wherein the semiconductor junction is reverse-biased for detecting light.

42. A unitary lens semiconductor device comprising:

(a) a transparent substrate having a semiconductor layer thereon; and

(b) a lens formed in the semiconductor layer below a substantially planar outer surface of the layer and further having a curved shape defined, at least in part, by a continuous or stepwise variation in composition of the layer in a direction normal to the outer surface of the layer.

43. The unitary lens semiconductor device of claim 42 wherein the shape of the lens is further defined by a patterned mask layer provided above the semiconductor layer.

44. The unitary lens semiconductor device of claim 42 wherein the lens is a positive lens.

45. The unitary lens semiconductor device of claim 42 wherein the lens is a negative lens.

46. A unitary lens semiconductor device comprising:

(a) a transparent substrate; and

(b) a semiconductor layer disposed on the substrate and including a lower-refractive-index portion therein, the lower-refractive-index portion having an outer surface that is substantially planar and an inner surface that is curved to define a lens within the semiconductor layer.

47. The unitary lens semiconductor device of claim 46 wherein a curvature of the inner surface is continuous.

48. The unitary lens semiconductor device of claim 46 wherein a curvature of the inner surface comprises a plurality of steps.

49. The unitary lens semiconductor device of claim 46 wherein the semiconductor layer comprises an aluminum alloy, and the lower-refractive-index portion comprises an oxide of aluminum.

50. The unitary lens semiconductor device of claim 49 wherein the aluminum alloy includes at least one element selected from the group consisting of As, Ga, In and P.