High density, three-dimensional, intercoupled circuit structure

• US 5,634,194 A
• Filed: 06/06/1995
• Issued: 05/27/1997
• Est. Priority Date: 12/31/1991
• Status: Expired due to Term

• Current Assignee: Sterling Investments LC
• Original Assignee: Sarcos Group
• Inventors: Jacobsen, Stephen C.
• Primary Examiner(s): PASCAL, LESLIE C
• Application Number:
  US08/466,227
• Time in Patent Office: 721 Days
• Field of Search: 455/40-41, 455/66, 455/90, 455/344, 375/256, 340/870.28, 340/870.29
• US Class Current: 455/41.1
• CPC Class Codes: B23K 15/002 Devices involving relative movement between electronbeam and workpiece
• CPC Class Codes: B23K 17/00 Use of the energy of nuclear particles in welding or related techniques
• CPC Class Codes: B23K 26/08 Devices involving relative movement between laser beam and workpiece
• CPC Class Codes: G01P 15/08 with conversion into electric or magnetic values
• CPC Class Codes: G01P 15/0922 of the bending or flexing mode type
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G02B 6/12002 Three-dimensional structures
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: G03C 7/24 combined with sound-recording sound recording in general G11B
• CPC Class Codes: G03F 7/70691 Handling of masks or workpieces
• CPC Class Codes: G05B 19/186 Generation of screw- or gearlike surfaces
• CPC Class Codes: G09F 9/33 being semiconductor devices, e.g. diodes
• CPC Class Codes: G12B 1/00 Sensitive elements capable of producing movement or displacement for purposes not limited to measurement; Associated transmission mechanisms therefor
• CPC Class Codes: H01L 21/4846 Leads on or in insulating or insulated substrates, e.g. metallisation H01L21/4821 takes precedence; metallisation of ceramics in general C04B41/51; printed circuits H05K3/00
• CPC Class Codes: H01L 21/67011 Apparatus for manufacture or treatment processes H01L21/30, H01L21/46; for production or after-treatment of single crystals or homogeneous polycrystalline material C30B35/00
• CPC Class Codes: H01L 21/68 for positioning, orientation or alignment
• CPC Class Codes: H01L 2225/1005 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1064 Electrical connections provided on a side surface of one or more of the containers
• CPC Class Codes: H01L 2225/1076 Shape of the containers
• CPC Class Codes: H01L 2225/1082 : for improving alignment between containers, e.g. interlocking features
• CPC Class Codes: H01L 25/065 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/162 : the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 29/0657 : characterised by the shape of the body
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A three-dimensional circuit structure includes a plurality of elongate cylindrical substrates positioned in parallel and in contact with one another. Electrical components are formed on the surfaces of the substrates, along with electrical conductors coupled to those components. The conductors are selectively positioned on each substrate so as to contact conductors on adjacent substrates to allow for the transfer of electrical signals between substrates. The conductor patterns on the substrates may be helical, circumferential, or longitudinal, in such a fashion that substrates may be added to or removed from the bundle so that the bundle will continue to operate as needed. The cylindrical nature of the substrates leaves gaps or channels between the substrates to which cooling fluid may be supplied for cooling the circuitry.

Claims

1. Circuit coupling apparatus comprising:

a plurality of elongate base elements arranged generally in a spaced-apart, parallel configuration;

a plurality of electrical components disposed on the base elements, said components including

at least one electric signal emitter means on at least one base element for producing a coupling electric signal whose magnitude varies in response to control signals,

means on said at least one base element for supplying control signals to said signal emitter means,

at least one coupling electric signal detector means on at least another base element disposed to intercept coupling signals produced by the signal emitter means and for producing actuation signals representing the magnitude of coupling signals intercepted by the signal detector means, wherein said signal emitter means comprises an electric field emitter means, wherein said coupling signals comprise electric field signals, and wherein said signal detector means comprises electric field detector means,

means on said at least another base element for receiving the actuation signals; and

means for supplying a fluid dielectric medium to circulate between the field emitter means and field detector means, and means for selectively varying the dielectric constant of the dielectric medium to thereby vary the electric field coupling between the field emitter means and the field detector means.

2. Circuit coupling apparatus comprising

a plurality of elongate base elements, each element having a continuous circumferential surface, said elements arranged generally in a parallel configuration, and

a plurality of electrical components disposed on the surface of said base element, said components including

at least one electric signal emitter means on at least one base element for producing a coupling electric signal whose magnitude varies in response to control signals,

means on said at least one base element for supplying control signals to said signal emitter means,

at least one coupling electric signal detector means on at least another base element disposed to intercept coupling signals produced by the signal emitter means and for producing actuation signals representing the magnitude of coupling signals intercepted by the signal detector means, and

means on said at least another base element for receiving the actuation signals.

3. Circuit coupling apparatus as in claim 2 wherein said signal emitter means comprises a radio frequency signal transmitter means, wherein said coupling signals comprise radio frequency signals, and wherein said signal detector means comprises radio frequency receiver means.

4. Circuit coupling apparatus as in claim 2 wherein said signal emitter means comprises an electric field emitter means, wherein said coupling signals comprise electric field signals, and wherein said signal detector means comprises electric field detector means.

5. Circuit coupling apparatus as in claim 4 further including means for supplying a fluid dielectric medium to circulate between the field emitter means and field detector means, and means for selectively varying the dielectric constant of the dielectric medium to thereby vary the electric field coupling between the field emitter means and the field detector means.