Apparatus for plasma-assisted high rate electron beam vaporization

• US 5,635,087 A
• Filed: 06/12/1995
• Issued: 06/03/1997
• Est. Priority Date: 10/19/1992
• Status: Expired due to Fees

• Current Assignee: Fraunhofer Gesellschaft Zur Foerderung Der Angewandten Forsching E.V.
• Original Assignee: Fraunhofer Gesellschaft Zur Foerderung Der Angewandten Forsching E.V.
• Inventors: Neumann, Manfred, Schiller, Siegfried, Morgner, Henry
• Primary Examiner(s): Paschall, Mark H.
• Application Number:
  US08/416,869
• Time in Patent Office: 722 Days
• Field of Search: 219/121.43, 219/121.47, 219/76.16, 219/121.15, 219/121.21, 219/123, 204/298.01, 204/298.16, 427/509, 427/535, 427/497
• US Class Current: 219/121.43
• CPC Class Codes: C23C 14/10 Glass or silica
• CPC Class Codes: C23C 14/32 by explosion; by evaporation and subsequent ionisation of the vapours , e.g. ion-platingC23C14/34 - C23C14/48 take precedence
• CPC Class Codes: H01J 2237/3137 Plasma-assisted co-operation
• CPC Class Codes: H01J 37/3053 for evaporating or etching
• CPC Class Codes: H01J 37/3266 Magnetic control means

Abstract

It is known that improved coating properties can be obtained by plasma action in vacuum deposition, especially by vaporization. Substantially higher coating rates can be attained in vapor deposition, but, with high plasma densities, they result in excessive scattering of the electron beam and reduce the power density. According to the invention, a plasma source, preferably a hollow cathode are source, is arranged in the immediate vicinity of the substrate. Between the evaporator and the substrate there is a device for generating a magnetic field so that the region of high plasma density is separated from the evaporator and the electron beam by the magnetic field. The boundary field lines of this magnetic field run along an arc curving with respect to the substrate.

Claims

1. An apparatus for plasma-assisted high rate electron beam vaporization having a vaporizer containing a vaporizing material and an associated electron gun producing an electron beam, as well as a plasma source for producing a high density plasma, the apparatus comprising:

a magnetic field-generating device having pole pieces producing a magnetic field, said magnetic field-generating device being positioned between the vaporizer and the substrate such that a high plasma density area produced by a plasma source located in an immediate vicinity of the substrate to be coated is separated from the vaporizing material and the electron beam acting on the vaporizing material by said magnetic field;

wherein said magnetic field is mainly oriented parallel to the substrate, said high plasma density area being guided along marginal field lines of the magnetic field in an arc curved towards the substrate.

2. Apparatus according to claim 1, wherein said magnetic field-generating device is constructed and positioned such that a maximum field strength of the magnetic field between the high plasma density area and the vaporizer or the electron beam is 1 to 10 kA/m.

3. Apparatus according to claim 1, wherein the magnetic field-generating device is a magnetic trap for shielding backscattered electrons.

4. Apparatus according to claim 1, wherein as the plasma source and as a function of a width of the substrate to be coated, at least one hollow cathode is placed between one of said pole pieces of the magnetic filed-generating device and the substrate, and that on an inside surface of another of said pole pieces which faces said one pole piece, an anode is positioned, said anode having an elongated length corresponding with a spatial arrangement of a number of hollow cathodes.

5. Apparatus according to claim 4, wherein said number of hollow cathodes are located in openings of the one-pole piece.

6. Apparatus according to claim 4, wherein at the location of an arc exit from the hollow cathodes, coils are provided for generating an alternating magnetic field for a fan-like deflection of an arc parallel to a surface of the substrate.

7. Apparatus according to claim 4, wherein the anode belonging to the hollow cathodes is inclined.

8. Apparatus according to claim 4, wherein a vapor shield is fitted to the underside of the anode.

9. Apparatus according to claim 7, wherein the anode is a water-cooled metal plate.

10. Apparatus according to claim 9, wherein the anode is a water-cooled metal plate.

11. Apparatus according to claim 7, wherein holes are arranged in the plate-like anode for introducing one of reactive gas and inert gas.

12. Apparatus according to claim 9, wherein holes are arranged in the plate-like anode for introducing one of reactive gas and inert gas.

13. Apparatus according to claim 4, wherein the anode is made from heat resistant material, if fixed in a heat insulating manner to the other pole piece, and that radiation shielding plates are located on a back of the anode.

14. Apparatus according to claim 7, wherein the anode comprises heat resistant bars.

15. Apparatus according to claim 8, wherein the anode comprises heat resistant bars.

16. Apparatus according to claim 7, wherein the anode is additionally heated by current passage, and wherein power supplies for the heating are positioned inside and outside the anode in such a manner that external magnetic fields produced by a current flow are substantially compensated in a vicinity of the discharge arc.

17. Apparatus according to claim 8, wherein the anode is additionally heated by current passage, and wherein power supplies for the heating are positioned inside and outside the anode in such a manner that external magnetic fields produced by a current flow are substantially compensated in a vicinity of the discharge arc.

18. Apparatus according to claim 2, wherein the maximum field strength is between 2 to 5 kA/m.

19. Apparatus according to claim 9, wherein the anode is made of copper.

20. Apparatus according to claim 14, wherein the anode consists of one of the group of tungsten, tantalum or molybdenum.

21. An apparatus according to claim 1, wherein said plasma-assisted high rate electron beam vaporization has evaporation rates of from a few μ

m/s to 50 μ

m/s.