Multi-function differential pressure sensor with thin supporting base
First Claim
Patent Images
1. A multi-function differential pressure sensor comprising:
- a single semiconductor chip including a thin wall portion, said thin wall portion having a differential pressure detection means mounted thereon for detecting a differential pressure, and a thick wall portion formed around said thin wall portion, said thick wall portion having a static pressure detection means mounted thereon for detecting a static pressure;
a stationary base having a joining base portion where said stationary base is joined to said semiconductor chip, said joining base portion being larger in area than said thick wall portion of said semiconductor chip and smaller in thickness than said thick wall portion of said semiconductor chip, and a thin wall portion arranged within said thin wall portion of said semiconductor chip as viewed in a plan view; and
a housing joined to said stationary base.
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Abstract
A multi-function differential pressure sensor includes a semiconductor chip, a stationary base having a joining portion joined to a thick wall portion of the semiconductor chip, and a housing joined to the stationary base. The semiconductor chip is provided with a differential pressure detection unit, a static pressure detection unit, and a temperature detection unit. The joining portion of the stationary base is not thicker than the semiconductor chip. The stationary base has one or more thin wall portions located, in a plan view, within a circular pressure sensitive diaphragm of the semiconductor chip.
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Citations
15 Claims
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1. A multi-function differential pressure sensor comprising:
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a single semiconductor chip including a thin wall portion, said thin wall portion having a differential pressure detection means mounted thereon for detecting a differential pressure, and a thick wall portion formed around said thin wall portion, said thick wall portion having a static pressure detection means mounted thereon for detecting a static pressure; a stationary base having a joining base portion where said stationary base is joined to said semiconductor chip, said joining base portion being larger in area than said thick wall portion of said semiconductor chip and smaller in thickness than said thick wall portion of said semiconductor chip, and a thin wall portion arranged within said thin wall portion of said semiconductor chip as viewed in a plan view; and a housing joined to said stationary base. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A multi-function differential pressure sensor comprising:
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a semiconductor chip of a single chip substrate including a thick wail portion, said substrate having thereon a differential pressure detection means for detecting a differential pressure, a temperature detection means for detecting a temperature and a static pressure detection means for detecting a static pressure, said differential pressure detection means including a pressure sensitive diaphragm; a first stationary base having a joining base portion joined to said thick wail portion of said semiconductor chip and being equal to or less in thickness than said thick wall portion of said semiconductor chip, said joining base portion being larger in area than said thick wall portion of said semiconductor chip; a second stationary base of a thin wail structure having an outer periphery arranged within a recess formed in said semiconductor chip for defining said pressure sensitive diaphragm of said differential pressure detection means as viewed in a plan view and a surface joined to said first stationary base; and a housing having a means for taking out signals of said semiconductor chip, said housing being joined to another surface of said second stationary base. - View Dependent Claims (9, 10, 11)
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12. A multi-function differential pressure sensor comprising:
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a semiconductor chip of a single chip substrate including a thick wall portion, said substrate having thereon a differential pressure detection means for detecting a differential pressure, a temperature detection means for detecting a temperature and a static pressure detection means for detection a static pressure, said differential pressure detection means including a pressure sensitive diaphragm; a stationary base having a joining base portion joined to said semiconductor chip and being equal to or less in thickness than, said thick wall portion of said semiconductor chip, said joining base portion being larger in area than said thick wall portion of said semiconductor chip; and a housing including a means for taking out output signals of said semiconductor chip and a joining portion of a thin wall structure joined to said stationary base, said joining portion having an outer periphery arranged within a recess formed in said semiconductor chip for defining said pressure sensitive diaphragm of said differential pressure detection means as viewed in a plan view. - View Dependent Claims (13, 14, 15)
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Specification