Micromechanical angular accelerometer with auxiliary linear accelerometer

• US 5,635,739 A
• Filed: 04/25/1995
• Issued: 06/03/1997
• Est. Priority Date: 02/14/1990
• Status: Expired due to Term

• Current Assignee: Charles Stark Draper Laboratory Incorporated
• Original Assignee: Charles Stark Draper Laboratory Incorporated
• Inventors: Grieff, Paul, Weinberg, Marc S., Boxenhorn, Burton
• Primary Examiner(s): MINTEL, WILLIAM A
• Application Number:
  US08/428,531
• Time in Patent Office: 770 Days
• Field of Search: 257/418, 257/420, 257/417, 257/254, 73/514.22, 73/514.23, 73/514.24, 73/514.36, 73/514.37, 73/DIG. 1
• US Class Current: 257/254
• CPC Class Codes: G01C 19/5719 using planar vibrating masses driven in a translation vibration along an axis
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/0888 for indicating angular acceleration
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type
• CPC Class Codes: G01P 2015/0831 the mass being of the paddle type having the pivot axis between the longitudinal ends of the mass, e.g. see-saw configuration
• CPC Class Codes: Y10S 73/01 Vibration

Abstract

A micromechanical accelerometer comprises a mass of monocrystalline silicon in which a substantially symmetrical plate attached to a silicon frame by flexible linkages is produced by selective etching. The plate has a plurality of apertures patterned and etched therethrough to speed further etching and freeing of the plate and flexible linkages, suspending them above a void etched beneath. The plate is capable of limited motion about an axis created by the flexible linkages. An accelerometer comprised of a substantially symmetrical, linkage supported plate configuration is implemented as an angular accelerometer paired with an auxiliary linear accelerometer, which is used to compensate for the linear sensitivity of the angular sensor, to achieve an instrument that is insensitive to linear acceleration and responds to angular acceleration.

Claims

1. A semiconductor micromechanical device comprising:

at least one generally rigid structural element comprising a first boron diffusion region of a substrate, said first boron diffusion region having a first depth, and said at least one structural element mechanically free from said substrate;

at least one pair of flexures having first and second ends comprising a second boron diffusion region of said substrate, said second boron diffusion region having a second depth smaller than said first depth, a first end of said flexures mechanically free from said substrate and supporting said at least one structural element, a second end of said flexures connected to said substrate, said flexures controlling a drive or response motion of said at least one structural element; and

at least one electrode for sensing or exciting said motion of said at least one structural element, said at least one electrode being located vertically proximate said at least one structural element.

2. The semiconductor micromechanical device recited in claim 1 further comprising a proof mass mounted on said at least one structural element.