Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer
First Claim
1. An electronic device probe for probing an electronic device comprising:
- a first space transformer having a first surface;
said first surface having a first plurality of contact locations;
a first plurality of elongated electrical conductors each having a protuberance at one end thereof;
said protuberance of each of said plurality of elongated conductors is bonded to one of said plurality of contact locations;
each of said plurality of elongated conductors extends outwardly away from said surface to form an array of elongated conductors;
said array of elongated conductors being embedded in a material;
said elongated conductors having exposed probe tip ends at an exposed surface of said material;
said first space transformer has a second surface with a second plurality of contact locations thereon and further including a second space transformer which has a surface with a plurality of third contact thereonsaid first plurality of contact locations are in electrical combination with said second plurality of contact locations by electrically conductive paths through said first space transformer, said second plurality of contact locations on said first space transformer is electrically connected to said third plurality of contact locations on said second space transformer.
2 Assignments
0 Petitions
Accused Products
Abstract
A high density test probe is for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires. The elastomer is cured and the mold is removed, leaving an array of wires disposed in the elastomer and in electrical contact with the space transformer The space transformer can have an array of pins which are on the opposite surface of the space transformer opposite to that on which the elongated conductors are bonded. The pins are inserted into a socket on a second space transformer, such as a printed circuit board to form a probe assembly. Alternatively, an interposer electrical connector can be disposed between the first and second space transformer.
-
Citations
7 Claims
-
1. An electronic device probe for probing an electronic device comprising:
-
a first space transformer having a first surface; said first surface having a first plurality of contact locations; a first plurality of elongated electrical conductors each having a protuberance at one end thereof; said protuberance of each of said plurality of elongated conductors is bonded to one of said plurality of contact locations; each of said plurality of elongated conductors extends outwardly away from said surface to form an array of elongated conductors; said array of elongated conductors being embedded in a material; said elongated conductors having exposed probe tip ends at an exposed surface of said material; said first space transformer has a second surface with a second plurality of contact locations thereon and further including a second space transformer which has a surface with a plurality of third contact thereon said first plurality of contact locations are in electrical combination with said second plurality of contact locations by electrically conductive paths through said first space transformer, said second plurality of contact locations on said first space transformer is electrically connected to said third plurality of contact locations on said second space transformer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
Specification