Package for a flat electrochemical device

• US 5,637,418 A
• Filed: 02/08/1996
• Issued: 06/10/1997
• Est. Priority Date: 02/08/1996
• Status: Expired due to Term

• Current Assignee: Amperex Technology Limited (TDK Corporation)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Pendalwar, Shekhar L., Louie, Edmond, Brown, Stephanie D.
• Primary Examiner(s): Kalafut, Stephen
• Assistant Examiner(s): KRUEGAR, JONATHAN
• Application Number:
  US08/598,779
• Time in Patent Office: 488 Days
• Field of Search: 429/127, 429/162, 429/163, 429/178, 429/181, 429/185
• US Class Current: 429/127
• CPC Class Codes: H01M 50/105 Pouches or flexible bags
• CPC Class Codes: H01M 50/119 Metals
• CPC Class Codes: H01M 50/121 Organic material
• CPC Class Codes: H01M 50/1243 characterised by the internal coating on the casing
• CPC Class Codes: H01M 50/129 with two or more layers of only organic material
• CPC Class Codes: H01M 50/136 Flexibility or foldability
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: Y02E 60/10 Energy storage using batteries

Abstract

A package for a flat electrochemical device comprises a flexible circuit board. Building from a base layer (62), the flexible circuit board has a conductor layer disposed on the outermost side of the base layer providing a first and second contact portion (56 and 58), a cover coat layer (50) is disposed over the conductor layer and the base layer over the outermost side of the base layer, a first collector (64) is disposed on the first half (47) on the innermost side of the base layer, and a second collector (66) is disposed on the second half (48) on the innermost side of the base layer. The first collector is electrically connected to a runner by a first plated through-hole (70), and the second collector is electrically connected to the second contact portion through a second plated through-hole (72). And finally, a fringe portion (68) is provided by the base layer about the periphery of the first and second halves. Upon assembly, an electrochemical cell stack is place on one half of the circuit board, the other half is folded over the cell stack, and the fringe portion of the first half is sealed to the fringe portion of the second half.

Claims

1. A package for a flat electrochemical device, said flat electrochemical device comprising a cell stack having first and second electrodes, said package comprising:

a flexible circuit board having a first half and a second half, said flexible circuit board comprised of;

a base layer fabricated of polymeric material having an outermost side and an innermost side;

a conductor layer disposed on said base layer on said outermost side providing a first contact portion and a second contact portion on said second half, and a runner extending from said first contact portion to said second half;

a cover coat layer fabricated of polymeric material disposed on said conductor layer and said base layer on said outermost side of said base layer, and having a first opening for exposing said first contact portion and a second opening for exposing said second contact portion;

a first collector disposed on said base layer on said innermost side on said first half;

a second collector disposed on said base layer on said innermost side on said second half;

wherein said first collector is electrically connected to said runner by a first plated through-hole in said first half, said second collector is electrically connected to said second contact portion by a second plated through-hole in said second half; and

wherein said flexible circuit board has a periphery and a fringe portion extending around said periphery, said flexible circuit board is folded over said cell stack such that said first half is adjacent to said first electrode and said second half is adjacent said second electrode, said first collector is in intimate contact with said first electrode, said second collector is in intimate contact with said second electrode, and said fringe portion of said first half is sealed to said fringe portion of said second half.

2. A package as defined by claim 1, wherein said conductor layer further comprises circuit interconnections.

3. A package as defined by claim 2, wherein electrical components are disposed on said package, and interconnected by said circuit interconnections.

4. A package as defined by claim 1, wherein said first contact portion and said second contact portion are disposed on said base layer at an edge of said base layer, thereby providing a card edge connector.

5. A package as defined by claim 4, wherein a stiffener is disposed on said package for supporting said card edge connector.

6. A package as defined by claim 1, wherein said base layer and said cover coat layer are fabricated of materials selected from the group consisting of polyimide, polyester, polyethylene, fluoroplastics, and combinations thereof.

7. A package as defined by claim 1, wherein said conductor layer and said first and second collectors are fabricated of materials selected from the group consisting of copper, tin, aluminum, nickel, gold, silver, conductive polymers, and combinations thereof.

8. A package for a flat electrochemical device, said flat electrochemical device comprising a cell stack having first and second electrodes, said package comprising:

a flexible circuit board having a first half and a second half, said flexible circuit board comprised of;

a base layer fabricated of polymeric material having an outermost side and an innermost side;

a conductor layer disposed on said base layer on said outermost side providing first and second contact portions on said second half at an edge of said base layer, a runner extending from said first contact portion to said second half, and circuit interconnections having conductor pads, at least one of said circuit interconnections depending from said runner;

a cover coat layer fabricated of polymeric material disposed on said conductor layer and said base layer on said outermost side having a first opening for exposing said first contact portion and a second opening for exposing said second contact portion, and openings for exposing said conductor pads;

a first collector disposed on said base layer on said innermost side on said first half;

a second collector disposed on said base layer on said innermost side on said second half;

wherein said first collector is electrically connected to at least one of said circuit interconnections by a first plated through-hole in said first half, said second collector is electrically connected to said second contact portion by a second plated through-hole in said second half;

a stiffener disposed on said edge for supporting said first and second contact portions, thereby providing a card edge connector; and

wherein said flexible circuit board has a periphery and a fringe portion extending around said periphery, said flexible circuit board is folded over said cell stack such that said first half is adjacent to said first electrode and said second half is adjacent said second electrode, said first collector is in intimate contact with said first electrode, said second collector is in intimate contact with said second electrode, and said fringe portion of said first half is sealed to said fringe portion of said second half.

9. A package as defined by claim 8, wherein electrical components are disposed on said package, and interconnected by said circuit interconnections.

10. A package as defined by claim 8, wherein said base layer and said cover coat layer are fabricated of materials selected from the group consisting of polyimide, polyester, polyethylene, fluoroplastics, and combinations thereof.

11. A package as defined by claim 8, wherein said conductor layer and said first and second collectors are fabricated of materials selected from the group consisting of copper, tin, aluminum, nickel, gold, silver, conductive polymers, and combinations thereof.