Solder ball array and method of preparation

• US 5,637,832 A
• Filed: 01/11/1996
• Issued: 06/10/1997
• Est. Priority Date: 10/26/1993
• Status: Expired due to Fees

• Current Assignee: Pacific Microelectronics Corporation
• Original Assignee: Pacific Microelectronics Corporation
• Inventors: Danner, Paul A.
• Primary Examiner(s): TSO, LAURA K
• Application Number:
  US08/586,193
• Time in Patent Office: 516 Days
• Field of Search: 174/260, 174/261, 174/262, 361/767, 361/770, 361/760, 439/50, 439/68, 439/69, 439/74, 228/180.1, 228/180.21, 228/180.22, 257/737, 257/738
• US Class Current: 174/260
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2201/017 Glass ceramic coating, e.g. formed on inorganic substrate inorganic, non-metallic substrates H05K1/0306
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2203/041 Solder preforms in the shape of solder balls soldering leadless components having an array of bottom contacts H05K3/3436
• CPC Class Codes: H05K 2203/043 Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
• CPC Class Codes: H05K 2203/063 of preperforated insulating layer
• CPC Class Codes: H05K 2203/066 Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern transferring an insulating pattern H05K2203/0537
• CPC Class Codes: H05K 3/3452 Solder masks
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49149 by metal fusion bonding

Abstract

A method for manufacturing an electronic module comprising a substrate carrying circuitry and one or more integrated circuits and having an array of closely spaced solder balls electrically connected with terminals of the circuitry to connect the module to an array of terminals, as on printed circuit board. The array of solder balls is fabricated on the substrate by preparing the substrate to include an array of terminal pads, perforating a sheet of dielectric tape to create precise and uniform holes, and thereafter fusing the tape onto the substrate so that the holes are aligned over the substrate'"'"'s terminal pads. Solder balls are then placed in the holes and heated to reflow them, so that part of the solder fills a volume defined by the holes in the dielectric tape and bonds to the terminal pads on the substrate, while the solder balls remain generally spherical above the dielectric tape. The module can then be connected to an array of terminal pads on a circuit board by positioning the ball grid array on the circuit board and again reflowing the solder balls so that they bond with the terminal pads on the circuit board.

Claims

1. An electronic circuit module, including electrical circuit elements connected to an array of conductive terminal pads and a ball grid array assembly for electrically interconnecting said array of conductive terminal pads with an array of terminals, said circuit module comprising:

(a) a plurality of said conductive terminal pads, each of which is in electrical communication with a respective one of said circuit elements;

(b) material defining a top surface of said module and a plurality of holes, said holes communicating with said top surface and being aligned with respective ones of said terminal pads, each of said holes having a hole diameter, an upright cylindrical interior wall, and a bottom and a respective one of said conductive terminal pads being located at said bottom of each of said holes and each of said holes defining a similar volume bounded by said interior wall and said respective one of said terminal pads; and

(c) an array of solder balls each having a diameter that is larger than said hole diameter, each of said solder balls being located partially within a respective one of said holes and each said solder ball having integrally attached thereto a quantity of solder filling the respective one of said holes and bonding said solder ball to the respective one of said terminal pads, and a major portion of each said solder ball standing above said top surface in a substantially spherical shape.

2. The circuit module of claim 1 wherein said material defining said holes is a ceramic material.

3. The circuit module of claim 1 wherein said top surface is free from solder originating from said plurality of solder balls.