Capacitive thin films using diamond-like nanocomposite materials

• US 5,638,251 A
• Filed: 10/03/1995
• Issued: 06/10/1997
• Est. Priority Date: 10/03/1995
• Status: Expired due to Term

• Current Assignee: Sulzer Metaplas GmbH
• Original Assignee: Advanced Refractory Technologies, Inc.
• Inventors: Martin, Steven C., Blakely, Keith A., Bray, Donald J., Goel, Arvind
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Dinkins, Anthony
• Application Number:
  US08/538,475
• Time in Patent Office: 616 Days
• Field of Search: 361/313, 361/311, 361/321.3, 361/306.3, 361/321.4, 361/317, 361/318, 361/319, 361/312, 361/287, 427/528, 427/531, 427/530, 427/527, 427/79, 427/249, 427/577, 427/573, 427/574, 427/580
• US Class Current: 361/313
• CPC Class Codes: H01G 4/08 Inorganic dielectrics
• CPC Class Codes: Y10S 427/103 Diamond-like carbon coating, i.e. DLC
• CPC Class Codes: Y10T 29/435 Solid dielectric type

Abstract

A method of making capacitors comprising, providing as the dielectric and/or conductive layers, a material made from a diamond-like nanocomposite solid-state material having interpenetrating atomic scale networks of carbon in a diamond-like carbon network stabilized by hydrogen, a glass-like silicon network stabilized by oxygen, and optionally at least one additional network of dopant elements or dopant compounds having elements from Groups 1-7b and 8 of the periodic table.

Claims

1. A method of making a capacitor comprising:

providing multiple conductive layers; and

providing a dielectric layer between adjacent conductive layers, said dielectric layer made from a diamond-like solid state material having interpenetrating networks comprising a diamond-like carbon network stabilized by hydrogen, a glass-like silicon network stabilized by oxygen, and optionally at least one network of non-conductive dopant elements or non-conductive dopant compounds containing elements from Groups 1 to 7b and 8 of the periodic table.

2. The method according to claim 1, wherein the carbon, hydrogen, silicon and oxygen are obtained from the decomposition of an organosiloxane having from about 1 to about 10 silicon atoms.

3. The method according to claim 2, wherein the organosiloxane is polyphenylmethylsiloxane.

4. The method according to claim 1, wherein the carbon content of the diamond-like material is from about 40 wt. % to about 98 wt. %.

5. The method according to claim 1, wherein the carbon content of the diamond-like material is from about 50 wt. % to about 98 wt. %.

6. The method according to claim 1, wherein the carbon to silicon weight ratio of the diamond-like material is from about 2:

1 to about 8;

1.

7. The method according to claim 1, wherein the silicon to oxygen weight ratio of the diamond-like material is from about 0.5:

1 to about 3;

1.

8. The method according to claim 1, wherein the coating is deposited on a metal substrate.

9. The method according to claim 1, wherein the coating is deposited on a non-metal substrate.

10. The method according to claim 1, wherein the dopant elements are selected from the group consisting of B, Li, Na, Si, Ge, Te, O, Mo, W, Ta, Nb, Pd, Ir, Pt, V, Fe, Co, Mg, Mn, Ni, Ti, Zr, Cr, Re, Hf, Cu, Al, N, Ag, and Au.

11. The method according to claim 1, wherein the carbon content is greater than about 40 atomic % of the coating, the hydrogen content is from about 1 atomic % up to about 40 atomic % of the carbon, and the sum of the silicon, oxygen and dopants together is greater than about 2 atomic % of the coating.

12. The method according to claim 1, wherein the dielectric material is deposited to a thickness of from about 0.05 to about 5 micrometers.

13. The method according to claim 1 wherein the dielectric material is deposited to a thickness of from about 0.1 to about 2.0 micrometers.

14. The method according to claim 1, wherein the conductive layers are made from a material comprising a diamond-like solid state material having interpenetrating networks comprising a diamond-like carbon network stabilized by hydrogen, a glass-like silicon network stabilized by oxygen, and at least one network of non-conductive dopant elements or non-conductive dopant compounds containing elements from Groups 1 to 7b and 8 of the periodic table.

15. A capacitor comprising layers of electrically conductive materials and dielectric materials, wherein a layer of dielectric material is placed between adjacent layers of electrically conductive materials, said dielectric material made from a diamond-like solid state material formed from interpenetrating networks comprising a diamond-like carbon network stabilized by hydrogen, a glass-like silicon network stabilized by oxygen and, optionally, at least one network of dopant elements or dopant compounds having elements from Groups 1-7b and 8 of the periodic table.

16. The capacitor according to claim 15 wherein the carbon content is greater than about 0 atomic % of the coating, the hydrogen content is from about 1 atomic % up to about 40 atomic % of the carbon, and the sum of the silicon, oxygen and dopants together is greater than about 2 atomic % of the coating.

17. The capacitor according to claim 15, wherein the carbon, hydrogen, silicon and oxygen are obtained from the decomposition of an organosiloxane having from about 1 to about 10 silicon atoms.

18. The capacitor according to claim 17, wherein the organosiloxane is polyphenylmethylsiloxane.

19. The capacitor according to claim 15, wherein the carbon content of the diamond-like material is from about 40 wt. % to about 98 wt. %.

20. The capacitor according to claim 15, wherein the carbon to silicon weight ratio of the diamond-like material is from about 2:

1 to about 8;

1.

21. The capacitor according to claim 15, wherein the silicon to oxygen weight ratio of the diamond-like material is from about 0.5:

1 to about 3;

1.

22. The capacitor according to claim 15, wherein the dopant elements are selected from the group consisting of B, Li, Na, Si, Ge, Te, O, Mo, W, Ta, Nb, Pd, Ir, Pt, V, Fe, Co, Mg, Mn, Ni, Ti, Zr, Cr, Re, Hf, Cu, Al, N, Ag and Au.

23. The capacitor according to claim 15, wherein said layer is deposited in a thickness of from about 0.05 to about 5 micrometers.

24. The capacitor according to claim 15 wherein said layer is deposited in a thickness of from about 0.1 to about 2.0 micrometers.

25. The capacitor according to claim 15, wherein the conductive layers are made from a material comprising a diamond-like material having interpenetrating networks comprising a diamond-like carbon network stabilized by hydrogen, a glass-like silicon network stabilized by oxygen, and at least one network of non-conductive dopant elements or non-conductive dopant compounds containing elements from Groups 1 to 7b and 8 of the periodic table.

26. A method of controlling the charge-holding capacity of a substrate surface comprising:

providing a substrate surface; and

coating the substrate surface with at least one dielectric layer, said dielectric layer made from a diamond-like solid state material having interpenetrating networks comprising a diamond-like carbon network stabilized by hydrogen, a glass-like silicon network stabilized by oxygen, and optionally at least one network of dopant elements or dopant compounds containing elements from Groups 1 to 7b and 8 of the periodic table.

27. A component capable of holding a charge on a component surface, said component comprising:

at least one layer of dielectric material made from a diamond-like solid-state material formed from interpenetrating networks comprising a diamond-like carbon network stabilized by hydrogen, a glass-like silicon network stabilized by oxygen and, optionally, at least one network of dopant elements or dopant compounds having elements from Groups 1-7b and 8 of the periodic table;

and optionally, at least one conductive layer.