On-chip temperature sensing system
First Claim
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1. An on-chip temperature sensing system comprising in combination;
- a first and a second thermal sensing diodes formed on a semiconductor chip whose temperature is to be monitored, said first and second thermal sensing diodes interconnect with a common cathode to form a differential sensing pair;
a power supply disposed apart from said semiconductor chip;
a first precision resistor disposed apart from said semiconductor chip, said first precision resistor coupling said power supply to said first thermal sensing diode to provide a first current of a predetermined magnitude to said first thermal sensing diode, said first current maintaining said first thermal sensing diode in its normal operating range;
a second precision resistor disposed apart from said semiconductor chip, said second precision resistor coupling said power supply to said second thermal sensing diode, to provide a second current of a predetermined magnitude to said second thermal sensing diode, said second current maintaining said first thermal sensing diode in its normal operating range; and
said first current of a predetermined magnitude being on the order of one hundred times as large as said second current of a predetermined magnitude; and
means to couple the anode of said first thermal sensing diode and means to couple the anode of said second thermal sensing diode as differential inputs to a high impedance amplifier.
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Abstract
A pair of on-chip thermal sensing diodes are formed together and interconnected with a common cathode to form a differential sensing pair. A pair of precision resistors external to the chip generates two constant currents, one for each diode, with a ratio of one to the other on the order of 100 to 1. The precision resistor values are selected so that variations about the nominal values of metal and via resistances between the diode contacts and the chip contact pads (e.g. C4 contacts) are negligible compared to the precision resistor values. Leads, connected respectively to two pads on the chip, couple a differential output of the anode voltages of the diode pair to the input of a high impedance amplifier.
87 Citations
3 Claims
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1. An on-chip temperature sensing system comprising in combination;
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a first and a second thermal sensing diodes formed on a semiconductor chip whose temperature is to be monitored, said first and second thermal sensing diodes interconnect with a common cathode to form a differential sensing pair; a power supply disposed apart from said semiconductor chip; a first precision resistor disposed apart from said semiconductor chip, said first precision resistor coupling said power supply to said first thermal sensing diode to provide a first current of a predetermined magnitude to said first thermal sensing diode, said first current maintaining said first thermal sensing diode in its normal operating range; a second precision resistor disposed apart from said semiconductor chip, said second precision resistor coupling said power supply to said second thermal sensing diode, to provide a second current of a predetermined magnitude to said second thermal sensing diode, said second current maintaining said first thermal sensing diode in its normal operating range; and said first current of a predetermined magnitude being on the order of one hundred times as large as said second current of a predetermined magnitude; and means to couple the anode of said first thermal sensing diode and means to couple the anode of said second thermal sensing diode as differential inputs to a high impedance amplifier. - View Dependent Claims (2, 3)
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Current AssigneeInternational Business Machines Corporation
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Original AssigneeInternational Business Machines Corporation
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InventorsBosco, Francis Edward, Vakirtzis, Charles Kyriakos, Davidson, Evan Ezra
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Primary Examiner(s)GUTIERREZ, DIEGO F
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Application NumberUS08/339,056Time in Patent Office946 DaysField of Search374/172, 374/175, 374/178, 327/512, 257/467US Class Current374/178CPC Class CodesG01K 7/01 using semiconducting elemen...
