Apparatus and method for mirror surface grinding and grinding wheel therefore

• US 5,639,363 A
• Filed: 02/14/1995
• Issued: 06/17/1997
• Est. Priority Date: 06/19/1992
• Status: Expired due to Term

• Current Assignee: Rikagaku Kenkyusho
• Original Assignee: Rikagaku Kenkyusho
• Inventors: Nakagawa, Takeo, Ohmori, Hitoshi, Karikomi, Katsuhiko
• Primary Examiner(s): Gorski, Joseph M.
• Application Number:
  US08/388,410
• Time in Patent Office: 854 Days
• Field of Search: 219/69.17, 204/129.43, 205/652, 205/658, 205/663, 205/670, 205/684
• US Class Current: 205/652
• CPC Class Codes: B24B 53/001 involving the use of electric current
• CPC Class Codes: B24D 3/06 metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements

Abstract

An apparatus and a method for mirror surface grinding which enables high quality, stable ELID grinding; and a grinding wheel for electrolytic dressing. The apparatus comprises a grinding wheel 3 having a contact surface 2 for contacting a workpiece 1, an electrode 4 facing the surface 2, nozzles 5 for supplying conductive fluid between the grinding wheel 3 and the electrode 4, and a power source 6 and feeder 7 for applying a voltage between the grinding wheel and the electrode 4. The bond material, which is selected from among iron, ferrous metal, cobalt, nickel and combinations of two or more thereof, along with grains and sintering aid are molded together and sintered to obtain the conductive grinding wheel. Next, a conductive water-soluble grinding fluid containing an alkanolamine and anions is supplied between the grinding wheel and the electrode, and a pulse wave voltage is applied between the grinding wheel and the electrode to dress the grinding wheel electrolytically during grinding.

Claims

1. An apparatus for grinding a mirror surface on a workpiece, comprising:

a conductive grinding wheel comprising non-conductive grains and metal bond material therebetween and having a contact surface for contacting the workpiece, wherein the grinding wheel is formed by sintering, at a high temperature, grains, bond material and sintering aid, wherein the bond material is selected from the group consisting of cast iron, ferrous metal, cobalt, nickel and a combination of two or more members of the group, and wherein the grains are diamond or CBN grains of an average grain size of not more than 6 μ

m;

an electrode opposed to the contact surface without contacting the surface;

a reservoir of conductive fluid, wherein the conductive fluid is water soluble and contains an inorganic salt, an alkanolamine, an anion and a cation, wherein the inorganic salt is an alkaline metal salt of any one of carbonate, silicate, and molybdate, and wherein the cation is selected from molybdenum, sodium and potassium;

a plurality of nozzles for supplying the conductive fluid between the grinding wheel and the electrode; and

an electrical power source and feeder arranged to apply a pulse wave voltage between the grinding wheel and the electrode, wherein said pulse wave is a rippled pulse wave obtained by adding a constant voltage to a pure pulse wave.

2. An apparatus in accordance with claim 1, wherein said anion comprises at least one of chlorine (Cl--), nitrate (NO₃ --) and sulfate (SO₄ ----).

3. An apparatus in accordance with claim 2, wherein said anion is chlorine in a concentration of from 10 ppm to 14 ppm.

4. An apparatus in accordance with claim 3 wherein said constant voltage is about 20 V, and said ripple pulse wave is obtained by adding said constant voltage to a pure pulse wave that varies from about 0 V to about 60 V, whereby said ripple pulse wave varies from about 20 V to about 60 V.

5. An apparatus in accordance with claim 3, wherein said constant voltage is about 20 V, and said ripple pulse wave is obtained by adding said constant voltage to a pure pulse wave that varies from about 0 V to about 60 V, whereby said ripple pulse wave varies from about 20 V to about 60 V.

6. An apparatus in accordance with claim 1, wherein said grinding wheel further comprises a metal oxide exhibiting a mechano-chemical action.

7. An apparatus according to claim 6, wherein said metal oxide is selected from cerium oxide, chromium oxide, zirconium oxide or silicon oxide.

8. An apparatus according to claim 6, wherein said binder is a metal binder selected from iron powder, cast iron powder or cobalt powder.

9. An apparatus according to claim 6, wherein said binder further comprises a sintering aid.

10. An apparatus according to claim 9, wherein said sintering aid is carbonyl iron powder.

11. An apparatus according to claim 6, wherein said metal oxide is a grain concentration of from 50 to 200.

12. An apparatus in accordance with claim 2, wherein said constant voltage is about 20 V, and said ripple pulse wave is obtained by adding said constant voltage to a pure pulse wave that varies from about 0 V to about 60 V, whereby said ripple pulse wave varies from about 20 V to about 60 V.

13. An apparatus in accordance with claim 1, wherein the grinding wheel is electrolytically dressed while the workpiece is ground by the grinding wheel.

14. A method of grinding a mirror surface on a workpiece using an apparatus comprising:

a conductive grinding wheel comprising non-conductive grains and metal bond material therebetween and having a contact surface for contacting the workpiece, wherein the grinding wheel is formed by sintering, at a high temperature, grains, gond material and sintering aid, wherein the bond material is selected from the group consisting of cast iron, ferrous metal, cobalt, nickel and a combination of two or more members of the group, and wherein the grains are diamond or CBN grains of an average grain size of not more than 6 μ

m;

an electrode opposed to the contact surface without contacting the surface;

a reservoir of conductive fluid, wherein the conductive fluid is water soluble and contains an inorganic salt, an alkanolamine, an anion and a cation, wherein the inorganic salt is an alkaline metal salt of any one of carbonate, silicate, and molybdate, and wherein the cation is selected from molybdenum, sodium and potassium;

a plurality of nozzles for supplying the conductive fluid between the grinding wheel and the electrode; and

an electrical power source and feeder arranged to apply a pulse wave voltage between the grinding wheel and the electrode, wherein said pulse wave is a rippled pulse wave obtained by adding a constant voltage to a pure pulse wave;

wherein said method comprises the steps of;

(1) grinding a workpiece with said grinding wheel while supplying said conductive fluid between the grinding wheel and the electrode;

(2) applying said voltage between the grinding wheel and the electrode, whereby the grinding wheel is electrolytically dressed while the workpiece is ground by the grinding wheel; and

(3) controlling the apparatus so that the grinding wheel is electrolytically dressed while the workpiece is ground by the grinding wheel, so that an insulation film is sequentially formed and removed from the grinding wheel, so that dissolution of the bond material is automatically regulated, and so that the protrosuion of grains on the grinding wheel is automatically controlled.

15. A grinding wheel for electrolytic dressing according to claim 14, wherein said metal oxide exhibiting a mechano-chemical action is cerium oxide, chromium oxide, zirconium oxide or silicon oxide.

16. A grinding wheel for electrolytic dressing according to claim 14, wherein said metal bond material is selected from the group consisting of iron powder, cast iron powder and cobalt powder.

17. A grinding wheel for electrolytic dressing according to claim 14, wherein said metal binder comprises a sintering aid.

18. A grinding wheel for electrolytic dressing according to claim 17, wherein said sintering aid is carbonyl iron powder.

19. A grinding wheel for electrolytic dressing according to claim 14, wherein the metal bond material comprises steel and cobalt.

20. A grinding wheel for electrolytic dressing according to claim 14, wherein the grain concentration of said grains exhibiting mechano-chemical action is from 50 to 200.