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Electrically heated optoelectronic device for detecting moisture on a transparent pane

  • US 5,639,393 A
  • Filed: 12/12/1994
  • Issued: 06/17/1997
  • Est. Priority Date: 09/02/1993
  • Status: Expired due to Fees
First Claim
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1. An optoelectronic sensor device for detecting moisture on a transparent pane in the form of drop-shaped precipitation, wherein the front surface of a beam guide element which is exposed to the heat of a heating device and which is coupled to the inner surface of the pane not exposed to the precipitation in the region of a wiping area covered by a motor-driven windscreen wiper device, the beam guide element being located in a spaced disposition to at least one beam transmitter and at least one beam receiver by a support part fixed in the inner chamber of a housing so that beams emitted by the beam transmitter are reflected dependent upon the precipitation on the pane and directed to the beam receiver, which supplies a signal dependent upon the associated quantity of precipitation, the optoelectronic device including:

  • an electrical printed circuit board attached on a side of the support part remote from the beam guide element, the electrical printed circuit board being connected to connection contact parts necessary for electrical connection of the beam transmitter,the heating device comprising at least one heat conducting and transmitting plate (8) fixed on the support part (5), the plate having at least one main area (24) adjacent the beam guide element (1), whereby the surface area of the plate extends parallel to the pane and is provided in the center region of the beam guide element in such way that the plate is located outside the incident and emergent beams;

    at least one connecting arm (21) connected to the electrical printed circuit board (9), each arm being formed as an integral part of the heat conducting and transmitting plate (8);

    the heating device comprising at least one heating element (25) which produces heat and which is surface-mounted directly on the electrical printed circuit board (9) in the proximity of the at least one connection arm (21), thereby forming a sub-assembly in which all necessary material connections can be carried out in one automated procedure, and for the purpose of communicating heat into the heat conducting plate (8), the at least one heating element being connected at least through the application of additional heat conducting material to the at least one associated connection arm (21), so that heat is communicated directly to the heat conducting and transmitting plate (8).

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