Structure and method for intergrating microwave components on a substrate

• US 5,639,683 A
• Filed: 12/01/1994
• Issued: 06/17/1997
• Est. Priority Date: 12/01/1994
• Status: Expired due to Term

• Current Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Reyes, Adolfo Canuto
• Primary Examiner(s): Niebling, John
• Assistant Examiner(s): Dutton, Brian K.
• Application Number:
  US08/347,931
• Time in Patent Office: 929 Days
• Field of Search: 437/209, 437/60, 437/205, 333/246, 333/247, 228/180.21, 228/180.22, 257/728, 257/735, 257/736, 257/737, 257/738, 257/777, 257/778
• US Class Current: 438/107
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 27/02 including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/10329 Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1423 Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/157 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2924/207 Diameter ranges

Abstract

A component integration structure (10) for a microwave system includes a silicon substrate (12) having a resistivity greater than about 2,000 ohm-cm. A first die (14) is disposed on the silicon substrate, and a first passive element (20) is disposed on the silicon substrate and electrically coupled to the first die. In addition, a second passive element (22) and a second die (16) may be disposed on the silicon substrate. The second passive element is electrically coupled to the first passive element. An integration method sorts each of a plurality of active devices for placement on either the first die or the substrate depending on which of two different processing flows has the most favorable characteristics for fabricating each particular device.

Claims

1. A method for integrating microwave system components, comprising the steps of:

providing a silicon substrate having a resistivity greater than about 2,000 ohm-cm and less than about 7,000 ohm-cm;

forming a passive element on said silicon substrate; and

attaching a first die to said silicon substrate wherein said first die is electrically coupled to said passive element.

2. The method of claim 1 further comprising the step of attaching a second die to said silicon substrate wherein said first die corresponds to a first manufacturing process and said second die corresponds to a second manufacturing process.

3. A method for integrating microwave system components, comprising the steps of:

providing a silicon substrate having a resistivity greater than about 2,000 ohm-cm;

forming a passive element on said silicon substrate; and

attaching a first die to said silicon substrate wherein said first die is electrically coupled to said passive element wherein said step of attaching includes forming bumps on said first die and bonding said bumps to said silicon substrate using a flip-chip technique.

4. The method of claim 3 further comprising the step of attaching a second die to said silicon substrate wherein said first die corresponds to a first manufacturing process and said second die corresponds to a second manufacturing process.

5. The method of claim 3 wherein said resistivity is between about 3,000 and 7,000 ohm-cm.

6. The method of claim 5 wherein said passive element transmits a signal having a frequency greater than about 500 MHz.

7. The method of claim 6 further comprising the step of attaching a second die to said silicon substrate wherein said first die is a gallium arsenide die and said second die is a silicon die.

8. The method of claim 7 wherein:

a digital device is disposed on said second die;

an active device having a gate width greater than five microns is disposed in a first circuit region of said silicon substrate; and

said active device is electrically coupled to said passive element.

9. A method of integrating a microwave system including a plurality of active devices, comprising the steps of:

providing a silicon substrate having a resistivity greater than about 2,000 ohm-cm;

selecting a first manufacturing process having a first characteristic and a second manufacturing process having a second characteristic;

sorting said plurality of active devices into a first group and a second group wherein said first group corresponds to said first characteristic and said second group corresponds to said second characteristic;

forming a first active device from said first group on said silicon substrate;

forming a second active device from said second group on a die; and

attaching said die to said silicon substrate.

10. The method of claim 9 further comprising the step of forming a passive element on said silicon substrate wherein said passive element is electrically coupled to said first active device.

11. The method of claim 10 wherein said passive element carries a signal having a frequency greater than about 500 MHz.

12. The method of claim 11 wherein said step of attaching includes bonding said die to said silicon substrate using a flip-chip technique.

13. The method of claim 9 wherein said first characteristic is a first wafer yield, said second characteristic is a second wafer yield, and said first wafer yield is greater than said second wafer yield.

14. The method of claim 9 wherein said first characteristic is a first manufacturing cost per die, said second characteristic is a second manufacturing cost per die, and said second manufacturing cost per die is greater than said first manufacturing cost per die.

15. The method of claim 9 wherein said first characteristic is a first total number of processing steps corresponding to said first active device, said second characteristic is a second total number of processing steps corresponding to said second active device, and said second total number of processing steps is greater than said first total number of processing steps.