Shielded electronic component assembly and method for making the same

• US 5,639,989 A
• Filed: 04/19/1994
• Issued: 06/17/1997
• Est. Priority Date: 04/19/1994
• Status: Expired due to Term

• Current Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Higgins, Leo M. III
• Primary Examiner(s): Thomas, Laura
• Application Number:
  US08/229,495
• Time in Patent Office: 1,155 Days
• Field of Search: 174/35 R, 174/260, 174/35 MS, 361/816, 361/818, 257/655, 257/660, 257/728, 257/659
• US Class Current: 174/386
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01025 : Manganese [Mn]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 1/0218 : by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/095 : for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 9/0039 : Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing printed shielding conductors, ground planes or power planes for reduction of cross-talk or noise in printed circuits H05K1/0218
• CPC Class Codes: Y10S 174/34 : PCB in box or housing

Abstract

Electronic components are shielded from electromagnetic interference (EMI) by one or more conformal layers filled with selected filler particulars for attenuate specific EMI frequencies or a general range of frequencies. Shielding is accomplished through the use of a single general purpose shielding layer, or through a series of shielding layers for protecting more specific EMI frequencies. In a multilayer embodiment, a semiconductor device (50) is mounted on a printed circuit board substrate (16) as a portion of an electronic component assembly (10). A conformal insulating coating (24) is applied over the device to provide electrical insulation of signal paths (e.g. leads 54 and conductive traces 18) from subsequently deposited conductive shielding layers. One or more shielding layers (60, 62, and 64) are deposited, and are in electrical contact with a ground ring (56). In a preferred embodiment, the ground connections for the shield layers are separate from those used for power distribution within the devices.

Claims

1. A shielded electronic component assembly comprising:

a wiring substrate having a plurality of conductive signal traces and at least one ground element formed on a surface thereof;

a semiconductor device mounted to the wiring substrate and electrically coupled to the plurality of signal traces;

a conformal insulating layer formed over the semiconductor device and over the signal traces, such that a portion of the at least one ground element is uncovered by the insulating layer; and

a conformal shielding layer deposited over the insulating layer and in contact with the uncovered portion of the ground element, the shielding layer comprising;

a precursor material; and

a first plurality of filler particles selected to attenuate electromagnetic signal frequencies within a first range of frequencies; and

a second plurality of filler particles selected to attenuate electromagnetic signal frequencies within a second range of frequencies;

wherein the first and second ranges of frequencies are at least partially exclusive.

2. The electronic assembly of claim 1 wherein the insulating layer comprises a compliant silicone gel.

3. The electronic assembly of claim 1 wherein the first plurality of filler particles attenuate E-field radiation and the second plurality of filler particles attenuate H-field radiation.

4. The electronic assembly of claim 3 wherein the first plurality of filler particles are selected from a group consisting:

copper, copper alloys, silver, silver alloys, cobalt, cobalt alloys, titanates, niobates, and zirconates.

5. The electronic assembly of claim 3 wherein the second plurality of filler particles are selected from a group consisting of:

iron, iron alloys, silver, silver alloys, nickel, nickel alloys, ferrites, and magnetic oxides.

6. The electronic assembly of claim 1 wherein the at least one ground element comprises a ground ring which surrounds the semiconductor device.

7. The electronic assembly of claim 1 wherein the semiconductor device comprises a device selected from a group consisting of:

a direct chip attach semiconductor die, a encapsulated semiconductor die, and a wire-bonded semiconductor die.

8. The electronic assembly of claim 1 further comprising a plurality of semiconductor devices and wherein the insulating layer and shielding layer is formed over each of the plurality of semiconductor devices.

9. The electronic assembly of claim 1 wherein the shielding layer further comprises a third plurality of filler particles selected to attenuate electromagnetic signal frequencies within a third range of frequencies;

wherein the third range of frequencies is at least partially exclusive from the first and second ranges of frequencies.

10. The electronic assembly of claim 1 wherein the at least one ground element comprises a first ground element and a second ground element electrically isolated from the first, and wherein the first ground element is electrically connected to the semiconductor device and the second ground element is electrically connected to the conformal shielding layer.

11. A shielded electronic component assembly comprising:

a wiring substrate having a plurality of signal members and a ground member;

a semiconductor device mounted on the substrate and electrically coupled to the plurality of signal members;

an insulative conformal coating formed over the semiconductor device and the plurality of signal members;

a first conformal shielding layer formed over the insulating layer and electrically coupled to a first portion of the ground member, wherein the first conformal shielding layer comprises a polymer precursor material filled with particles selected to attenuate a first range of electromagnetic signal frequencies; and

a second conformal shielding layer formed over the first conformal shielding layer and electrically coupled to the ground member, wherein the second conformal shielding layer comprises a polymer precursor material filled with particles selected to attenuate a second range of electromagnetic signal frequencies, wherein the first and second ranges of frequencies are at least partially exclusive.

12. The electronic assembly of claim 11 wherein the semiconductor device comprises a device selected from a group consisting of:

an exposed semiconductor die and a packaged semiconductor die.

13. The electronic assembly of claim 11 further comprising a third conformal shielding layer formed over the second conformal shielding layer and electrically coupled to the ground member.

14. The electronic assembly of claim 11 wherein the first range of electromagnetic frequencies comprise predominately H-field frequencies and the second range of electromagnetic frequencies comprise predominately E-field frequencies.

15. The electronic assembly of claim 11 wherein the ground member comprises a ground ring which surrounds the semiconductor device.

16. The electronic assembly of claim 11 wherein the ground member comprises a first ground member and a second ground member electrically isolated from the first, and wherein the first ground member is electrically connected to the semiconductor device and the second ground member is electrically connected to the first conformal shielding layer.

17. The electronic assembly of claim 11 wherein the second conformal shielding layer is electrically coupled to the ground member through the first shielding layer.

18. The electronic assembly of claim 11 wherein the second conformal shielding layer is electrically coupled to the ground member by a direct connection between the second shielding layer and the ground member.

19. The electronic assembly of claim 11 wherein the ground member is a first ground member, and further comprising a second ground member electrically independent from the first ground member, and wherein the first shielding layer is electrically connected to the first ground member and the second shielding layer is electrically connected to the second ground member.

20. A shielded electronic component assembly comprising:

a semiconductor device to be shielded from a range of electromagnetic frequencies;

a reference potential source;

a housing enclosing the semiconductor device within the assembly, the housing having a plurality of interior surfaces;

a conformal shielding layer formed on all interior surfaces of the housing and electrically connected to the reference potential source, the conformal shielding layer comprising;

a first polymer precursor material; and

a first plurality of filler particles of a first material within the precursor material which attenuate a first portion of the range of the electromagnetic frequencies; and

a second plurality of filler particles of a second material within the precursor material which attenuate a second portion of the range of electromagnetic frequencies.

21. The electronic assembly of claim 20 wherein the second portion of the range of frequencies is at least partially exclusive of the first portion of the range.

22. The electronic assembly of claim 20 wherein the first plurality of filler particles attenuate E-field radiation and the second plurality of filler particles attenuate H-field radiation.

23. The electronic assembly of claim 20 wherein the shielding layer is a first conformal shielding layer, and further comprising a second conformal shielding layer formed on the first conformal shielding layer, wherein the second shielding layer comprises:

a second precursor material;

a third plurality of filler particles of a third material within the second precursor material which attenuates a third portion of the range of electromagnetic frequencies which is at least partially exclusive of the first and second portions.

24. A method for shielding an electronic component from a range of electromagnetic frequencies comprising the steps of:

providing a wiring substrate having a plurality of signal traces and at least one ground element formed on a surface thereof;

providing an electronic component;

mounting the electronic component to the wiring substrate such that the component is electrically coupled to the plurality of signal traces;

depositing an insulative coating over the electronic component and the plurality of signal traces;

providing a first shielding material, wherein the first shielding material comprises;

a first precursor material; and

a first plurality of filler particles selected to attenuate at least a first portion of the range of electromagnetic frequencies; and

depositing the first shielding material on the insulative coating and over the electronic component such that the shielding layer is in electrical contact with the at least one ground element.

25. The method of claim 24 wherein the step of providing a first shielding material comprises providing a first shielding material further comprising a second plurality of filler particles of a different material than the first plurality of filler particles, wherein the second plurality of filler particles is selected to attenuate at least a second portion of the range of electromagnetic frequencies, and wherein the second portion of the range of electromagnetic frequencies is at least partially exclusive of the first portion.

26. The method of claim 24 further comprising the steps of:

providing a second shielding material, wherein the second shielding material comprises;

a second precursor material; and

a second plurality of filler particles selected to attenuate at least a second portion of the range of electromagnetic frequencies; and

depositing the second shielding material over the first shielding layer.

27. The method of claim 26 wherein the step of providing a second shielding material comprises providing a second shielding material wherein the second plurality of filler particles attenuate a second portion of the range of electromagnetic frequencies which is at least partially exclusive of the first portion.