Three dimensional microfabrication by localized electrodeposition and etching

• US 5,641,391 A
• Filed: 05/15/1995
• Issued: 06/24/1997
• Est. Priority Date: 05/15/1995
• Status: Expired due to Fees

• Current Assignee: Ian W. Hunter, Madden, John D., Serge R. Lafontaine
• Original Assignee: Ian W. Hunter, Madden, John D., Serge R. Lafontaine
• Inventors: Hunter, Ian W., Madden, John D., Lafontaine, Serge R.
• Primary Examiner(s): Gorgos, Kathryn L.
• Assistant Examiner(s): Wong, Edna
• Application Number:
  US08/440,949
• Time in Patent Office: 771 Days
• Field of Search: 205/80, 205/118, 205/133, 205/137, 205/138, 205/139, 205/140, 205/141, 205/142, 205/640, 205/652, 205/668, 205/670, 205/672, 205/686, 205/654, 204/129.1, 204/129.5
• US Class Current: 205/80
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 70/00 Materials specially adapted for additive manufacturing
• CPC Class Codes: C25D 1/003 3D structures, e.g. superposed patterned layers
• CPC Class Codes: C25D 5/02 Electroplating of selected surface areas
• CPC Class Codes: C25D 5/026 using locally applied jets of electrolyte
• CPC Class Codes: C25D 5/04 Electroplating with moving electrodes
• CPC Class Codes: C25F 3/02 Etching
• CPC Class Codes: Y10S 977/856 including etching/cutting
• CPC Class Codes: Y10S 977/857 including coating
• CPC Class Codes: Y10S 977/888 Shaping or removal of materials, e.g. etching
• CPC Class Codes: Y10S 977/89 Deposition of materials, e.g. coating, cvd, or ald

Abstract

Embodiments of the present invention provide a new method for producing a three dimensional object, particularly suited to microfabrication applications. The method includes the steps of providing a substrate with a conducting interface, an electrode having a feature or features that are small relative to the substrate, and a solution. The solution has a reactant that will either etch the substrate or deposit a selected material in an electrochemical reaction. The electrode feature is placed close to but spaced from the interface. A current is passed between the electrode and the interface, through the solution, inducing a localized electrochemical reaction at the interface, resulting in either the deposition of material or the etching of the substrate. Relatively moving the electrode and the substrate along a selected trajectory, including motion normal to the interface, enables the fabrication of a three dimensional object. In an alternative embodiment, current is passed through an orifice placed close to but spaced from the substrate surface, and may be accompanied by forced convection through the orifice. The method provides the potential to fabricate using many materials, including metals, alloys, polymers and semiconductors in three dimensional forms and with sub-micrometer spatial resolution.

Claims

1. A method for producing a three dimensional object comprising the steps of

(a) providing a substrate having an outer conducting surface defining an interface;

(b) providing an electrode having at least a feature having at least a dimension that is small relative to the dimensions of the interface;

(c) providing a solution having a selected reactant that will, in an electrochemical reaction, deposit a desired product;

(d) positioning the feature at a starting distance from the substrate such that the feature is close to but spaced from the interface;

(e) selecting a trajectory for relatively moving the electrode and the substrate, at least part of the trajectory having a directional component normal to the substrate surface, such that when the trajectory is followed a feature to substrate separation of at least several times the starting distance is generated somewhere along the trajectory;

(f) depositing the product by passing a current between the electrode and the substrate and through the solution to induce a spatially localized electrochemical reaction at the interface;

(g) relatively moving the electrode and the substrate along the trajectory; and

(h) repeating step (f) along the trajectory;

where the depositing of the product along the trajectory, including at one or more locations several times the starting distance away from the substrate, forms the three dimensional object.

2. The method of claim 1, further comprising the step of providing further reactants in step (c) that will, in an electrochemical reaction, deposit a desired product.

3. The method of claim 1, wherein the deposited product is at least in part selected from the group consisting of comprising electrodepositable metals, alloys, polymers and semiconductors.

4. The method of claim 1, wherein the electrode provided in step (b) is a sharp conducting wire having a tip having a diameter between about 5 and 200 000 nm, the tip providing the feature in step (b).

5. The method of claim 1, wherein the smaller feature dimension provided in step (b) is a distance, d;

and wherein step (d) in claim 1 is performed such that the smaller dimension of the feature provided in step (b) is placed within about a distance, d, of the surface defined by the interface.

6. The method of claim 1 wherein the electrode is approximately disk-shaped or hemispherical having a diameter between about 5 and 200 000 nm.

7. The method of claim 1, further comprising the steps of providing a plurality of electrodes in step (b) each having at least a feature having at least a dimension that is small relative to the dimensions of the interface;

and wherein each electrode is subject to the remaining steps of claim 1.

8. The method of claim 1, further comprising the steps of providing an orifice;

and generating a flow of the solution provided in step (c) of claim 1 directed by the orifice to the region between the electrode and the interface.

9. A method for producing a three dimensional object comprising the steps of

(a) providing a substrate having an outer conducting surface defining an interface;

(b) providing an electrode having at least a feature having at least a dimension that is small relative to the dimensions of the interface;

(c) providing a solution having a selected reactant that will, in an electrochemical reaction, etch the substrate;

(d) positioning the feature at a starting distance from the substrate such that the feature is close to but spaced from the interface;

(e) selecting a trajectory for relatively moving the electrode and the substrate, at least part of the trajectory having a directional component normal to the substrate surface, such that when the trajectory is followed while etching the electrode feature penetrates at least several times the starting distance into the etched substrate somewhere along the trajectory;

(f) etching the substrate by passing a current between the electrode and the substrate and through the solution to induce a spatially localized electrochemical reaction at the interface;

(g) relatively moving the electrode and the substrate along the trajectory; and

(h) repeating step (f) along the trajectory;

where the etching of the substrate along the trajectory, including at one or more locations penetrating several times the starting distance into the substrate, forms the object.

10. The method of claim 9, wherein the substrate material is at least in part a material selected from the group consisting of metals, alloys, polymers and semiconductors.

11. The method of claim 9, wherein the electrode provided in step (b) is a sharp conducting wire having a tip having a diameter between about 5 and 200 000 nm, the tip providing the feature in step (b).

12. The method of claim 9, further comprising the steps of defining the smaller feature dimension provided in step (b) as a distance, d;

and

placing the smaller dimension of the feature provided in step (b) within about a distance, d, of the surface defined by the interface.

13. The method of claim 9, wherein the electrode is approximately disk-shaped or hemispherical having a diameter between about 5 and 200 000 nm.

14. The method of claim 9, further comprising the steps of providing a plurality of electrodes in step (b) each having at least a feature having at least a dimension that is small relative to the dimensions of the interface;

and wherein each electrode is subject to the remaining steps of claim 9.

15. The method of claim 9, further comprising the steps of providing an orifice;

and generating a flow of the solution provided in step (c) of claim 9 directed by the orifice to the region between the electrode and the interface.

16. A method for producing a three dimensional object comprising the steps of

(a) providing a substrate having an outer conducting surface defining and interface;

(b) providing an electrode;

(c) providing an orifice that is electrically isolated from the electrode and the substrate;

(d) providing a solution having at least a selected reactant that will, in an electrochemical reaction, deposit a desired product;

(e) placing the orifice in the solution and between the electrode and the interface such that current between the electrode and the interface will pass through the orifice;

(f) positioning the orifice at a starting distance from the substrate such that the feature is close to but spaced from the interface;

(g) generating a flow of solution through the orifice sufficient to greatly increase mass transport of the reactant to the surface;

(h) selecting a trajectory for relatively moving the orifice and the substrate, at least part of the trajectory having a directional component normal to the substrate surface, such that when the trajectory is followed an orifice to substrate separation of at least several times the starting distance is generated somewhere along the trajectory.;

(i) depositing the product by passing a current between the electrode and the substrate and through the solution to induce a spatially localized electrochemical reaction at the interface; and

(j) repeating step (i) along the trajectory;

where the depositing of the product along the trajectory, including at one or more locations several times the starting distance away from the substrate, forms the three dimensional object.

17. A method for producing a three dimensional object comprising the steps of

(a) providing a substrate having an outer conducting surface defining and interface;

(b) providing an electrode;

(c) providing an orifice that is electrically isolated from the electrode and the substrate;

(d) providing a solution having at least a selected reactant that will, in an electrochemical reaction, etch the substrate;

(e) placing the orifice in the solution and between the electrode and the interface such that current between the electrode and the interface will pass through the orifice;

(f) positioning the orifice at a starting distance from the substrate such that the feature is close to but spaced from the interface;

(g) generating a flow of solution through the orifice sufficient to greatly increase mass transport of the reactant to the surface;

(h) selecting a trajectory for relatively moving the orifice and the substrate, at least part of the trajectory having a directional component normal to the substrate surface, such that when the trajectory is followed while etching the orifice penetrates at least several times the starting distance into the etched substrate somewhere along the trajectory;

(i) etching the substrate by passing a current between the electrode and the substrate and through the solution to induce a spatially localized electrochemical reaction at the interface; and

(j) repeating step (i) along the trajectory;

whereby the etching of the substrate along the trajectory, including at one or more locations penetrating several times the starting distance into the substrate, forms the object.