Method and circuit board structure for leveling solder balls in ball grid array semiconductor packages

• US 5,641,946 A
• Filed: 01/18/1996
• Issued: 06/24/1997
• Est. Priority Date: 07/05/1995
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Electronics, Inc. (Amkor Technology Incorporated), Anam Industrial Co., Ltd.
• Inventors: Shim, Il Kwon
• Primary Examiner(s): Thomas, Laura
• Application Number:
  US08/588,482
• Time in Patent Office: 523 Days
• Field of Search: 174/260, 174/261, 361/767, 361/768, 361/760, 228/180.22, 228/180.21, 29/840, 29/832, 257/737, 257/738
• US Class Current: 174/261
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 2924/1532 the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/3511 Warping
• CPC Class Codes: H05K 1/111 Pads for surface mounting, e.g. lay-out
• CPC Class Codes: H05K 2201/094 Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads using different types of conductors H05K2201/0391
• CPC Class Codes: H05K 2201/099 Coating over pads, e.g. solder resist partly over pads
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2203/043 Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
• CPC Class Codes: H05K 2203/0465 Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/3452 Solder masks
• CPC Class Codes: H05K 3/3457 Solder materials or compositions; Methods of application thereof
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

Method and circuit board structure for leveling the tops of solder balls of a BGA semiconductor package is disclosed. In order to level the solder balls, the sizes of solder ball lands used for welding the solder balls to the circuit board are controlled in accordance with portions of the circuit board. The invention thus achieves the coplanarity of the solder balls regardless of thermal bending of the plastic body and circuit board of the BGA semiconductor package. In an embodiment, a plurality of solder ball lands having different sizes are formed on the circuit board prior to forming the solder balls on the lands. In another embodiment, a plurality of solder ball lands having the same size are formed on the circuit board prior to forming an insulating mask on the circuit board in order to form differently-sized exposed inside portions of solder ball lands.

Claims

1. A method for forming a solder ball array on a ball grid array semiconductor package, said package having a curved bent circuit board, comprising the steps of:

forming a plurality of electrically conductive solder ball lands on a surface of the circuit board, said solder ball lands having areas of graduated size, wherein the size of an area of each solder ball land depends upon the bend of the circuit board and the location of each solder ball land on the surface of said circuit board;

forming a solder mask on said circuit board, said mask having openings corresponding to the size and location of the solder ball lands;

forming a solder ball in each opening and on each of said solder ball lands; and

reflowing the solder balls on the solder ball lands, and deforming said solder balls to different heights in accordance with the size of the area of the solder ball land on which each solder ball is formed.

2. A method for forming a solder ball array on a ball grid array semiconductor package, said package having a circuit board, comprising the steps of:

forming a plurality of metallic solder ball lands on a surface of the circuit board, said solder ball lands having areas of graduated size, wherein the size of an area of each solder ball land depends upon the location of each solder ball land on the surface of said circuit board;

forming a solder mask on said circuit board, said mask having openings corresponding to the size and location of the solder ball lands;

forming a solder ball in each opening and on each of said solder ball lands;

reflowing the solder balls on the solder ball lands, and deforming said solder balls to different heights in accordance with the size of the area of the solder ball land on which each solder ball is formed; and

wherein the areas of different size of said solder ball lands increase gradually from a periphery of the circuit board to an inner area of the circuit board such that an outermost solder ball land has a smallest diameter, while an innermost solder ball land has a largest diameter.

4. The method according to claim 2 or 3, wherein the heights of the solder balls formed on said solder ball lands differ in such a manner that a solder ball formed on a larger solder ball land is lower than a solder ball formed on a smaller solder ball land.

3. A method for forming a solder ball array on a ball grid array semiconductor package, said package having a circuit board, comprising the steps of:

forming a plurality of metallic solder ball lands on a surface of the circuit board, said solder ball lands having areas of graduated size, wherein the size of an area of each solder ball land depends upon the location of each solder ball land on the surface of said circuit board;

forming a solder mask on said circuit board, said mask having openings corresponding to the size and location of the solder ball lands;

forming a solder ball in each opening and on each of said solder ball lands;

reflowing the solder balls on the solder ball lands, and deforming said solder balls to different heights in accordance with the size of the area of the solder ball land on which each solder ball is formed; and

wherein the size of said areas of said solder ball lands increase gradually from the inner area of the circuit board to the periphery of the circuit board such that an innermost solder ball land has a smallest diameter, while an outermost solder ball land has a largest diameter.

5. A circuit board structure for improving coplanarity of a solder ball array on a ball grid array package, said package having a curved bent circuit board, comprising:

a plurality of electrically conductive solder ball lands formed on said circuit board;

a plurality of solder balls on said solder ball lands, said solder ball lands having areas of different size depending on the location of the solder ball lands on said circuit board and the bend of said circuit board;

a solder mask formed on the circuit board exposing the solder ball lands; and

wherein said solder balls each having a different height depending on the size of a corresponding solder ball land and exposed ends of the solder balls are coplanar.

6. The circuit board structure for improving coplanarity of a solder ball array on a ball grid array package, said package having a circuit board, comprising:

a plurality of metallic solder ball lands formed on said circuit board;

a plurality of solder balls on said solder ball lands, said solder ball lands having areas of different size depending on the location of the solder ball lands on said circuit board;

a solder mask formed on the circuit board exposing the solder ball lands; and

wherein said size of said areas of said solder ball lands formed on the circuit board increases gradually from the periphery of the circuit board to the inner area of the circuit board such that an outermost solder ball land has a smallest area, while an innermost solder ball land has a largest area.

8. The circuit board structure according to claim 6 or 7, wherein said solder ball lands are formed of at least one member selected from the group consisting of gold, nickel and copper.

7. The circuit board structure for improving coplanarity of a solder ball array on a ball grid array package, said package having a circuit board, comprising:

a plurality of metallic solder ball lands formed on said circuit board;

a plurality of solder balls on said solder ball lands, said solder ball lands having areas of different size depending on the location of the solder ball lands on said circuit board;

a solder mask formed on the circuit board exposing the solder ball lands; and

wherein said size of said areas of said solder ball lands formed on the circuit board increases gradually from an inner area of the circuit board to a periphery of the circuit board such that an innermost solder ball land has a smallest size, while an outermost solder ball land has a largest size.

9. A method for forming a solder ball array in a ball grid array semiconductor package for improving coplanarity of a solder ball array of the package, said package having a circuit board, comprising the steps of:

forming a plurality of metallic solder ball lands on the circuit board;

forming an insulating mask on said circuit board, said insulating mask having a plurality of holes, each hole aligned with a solder ball land and exposing a portion of a corresponding solder ball land to form a plurality of exposed areas of said land, each of said exposed areas having a graduated size depending on the location of the lands on the circuit board;

forming a solder ball on each solder ball land; and

reflowing each solder ball to a graduated height dependent on the size of the exposed area of the solder ball land.

10. The method according to claim 9, wherein said insulating mask is formed of at least one member selected from the group consisting of a solder resist ink and polyimide tape.

11. The method according to claim 9 or 10, wherein the sizes of the exposed areas of said solder ball lands increase gradually from the periphery of the circuit board to the inner area of the circuit board such that an outermost solder ball land has a smallest diameter, while an innermost solder ball land has a largest diameter.

12. The method according to claim 9 or 10, wherein the sizes of the exposed areas of said solder ball lands increases gradually from the inner area of the circuit board to the periphery of the circuit board such that an innermost solder ball land has a smallest size, while an outermost solder ball land has a largest size.

13. The method according to claim 11, wherein the heights of the solder balls formed on the exposed areas of said solder ball lands differ in such a manner that a solder ball on a solder ball land having a larger exposed area is lower than a solder ball on a solder ball land having a smaller exposed area.

14. A circuit board structure for improving coplanarity of a solder ball array on a ball grid array package, said package having a circuit board, comprising:

a plurality of metallic solder ball lands formed on the circuit board, and adapted for welding a plurality of solder balls to said circuit board; and

an insulating mask formed on said circuit board, said insulating mask having a plurality of holes, each hole corresponds to a solder ball land and exposing a portion of the corresponding solder ball land to form a plurality of exposed areas, each of the exposed areas having a graduated size depending on the location of the lands on the circuit board.

15. The circuit board structure according to claim 14, wherein said insulating mask is formed of at least one member selected from the group consisting of a solder resist ink and a polyimide tape.

16. The circuit board structure according to claim 14 or 15, wherein the sizes of the exposed area of said solder ball lands increase gradually from a periphery of the circuit board to an inner area of the circuit board such that the exposed area of an outermost solder ball land has a smallest size, while the exposed are of an innermost solder ball land has a largest size.

17. The circuit board structure according to claim 14 or 15, wherein the sizes of the exposed area of said solder ball lands increases gradually from the inner area of the circuit board to the periphery of the circuit board such that an innermost solder ball land has a smallest size, while an outermost solder ball land has a largest size.

18. The circuit board structure according to claim 14, wherein said solder ball lands are formed of at least one member selected from the group consisting of gold, nickel and copper.

19. The circuit board structure according to claim 16, wherein said solder ball lands are formed of at least one member selected from the group consisting of gold, nickel and copper.

20. The circuit board structure according to claim 17, wherein said solder ball lands are formed of at least one member selected from the group consisting of gold, nickel and copper.