Modular soldering nozzle

• US 5,642,850 A
• Filed: 04/30/1996
• Issued: 07/01/1997
• Est. Priority Date: 04/11/1995
• Status: Expired due to Term

• Current Assignee: VLT Incorporated (Vicor Corporation)
• Original Assignee: VLT Incorporated (Vicor Corporation)
• Inventors: Vinciarelli, Patrizio, Sadler, Steven P.
• Primary Examiner(s): Ramsey, Kenneth J.
• Application Number:
  US08/640,018
• Time in Patent Office: 427 Days
• Field of Search: 228/6.2, 228/37, 228/180.1
• US Class Current: 228/37
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 1/203 Fluxing, i.e. applying flux onto surfaces
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: H05K 3/34 by soldering

Abstract

The invention features soldering parts (e.g., printed circuit boards) by indexing the parts sequentially and continuously through a series of processing stations. Each of the series of processing stations includes at least one processing position, and the indexer indexes the parts from processing position to processing position. At different processing stations, the parts indexed into those processing stations are simultaneously processed.

Claims

1. A solder fountain comprising

a solder manifold for containing solder, the solder manifold having a first aperture,

a solder well plate having second apertures, the solder well plate being mounted above the solder manifold with the second apertures above the first aperture,

modular solder well plates mounted above the second apertures, and

a solder chimney mounted to each of the modular solder well plates, the solder chimneys providing passageways from the solder manifold to a top of the solder chimneys where solder is applied to the parts,

wherein the parts are of different part types, and

wherein each of the modular solder well plates corresponds to one of the different part types.

2. The solder fountain of claim 1, wherein the passageway is an unrestricted passageway.

3. The solder fountain of claim 1, further including

another solder chimney mounted to each of the modular solder well plates.

4. The solder fountain of claim 1, further comprising

a rough part locator that roughly locates a part within the solder fountain, and

a precise part locator that precisely locates the part.

5. The solder fountain of claim 4, wherein the rough part locator includes

a stopper arm having an end that provides a datum point, and

a pusher arm for pushing the part against the stopper arm.

6. The solder fountain of claim 4, wherein the precise part locator includes

a datum bushing and a slotted bushing on the part, and

a datum pin and an expansion pin for respectively engaging the datum bushing and the slotted bushing.

7. The solder fountain of claim 4, further comprising

a guide rail for supporting the part, and

a mechanism for raising and lowering the guide rail.