Microaccelerometer package with integral support braces

• US 5,644,081 A
• Filed: 09/28/1995
• Issued: 07/01/1997
• Est. Priority Date: 09/28/1995
• Status: Expired due to Fees

• Current Assignee: Delco Electronics Corporation (General Motors Company)
• Original Assignee: Delco Electronics Corporation (General Motors Company)
• Inventors: Maki, William Martin, Wilson, Richard Allen, Schwarz, Dwight Lance
• Primary Examiner(s): NOT, DEFINED
• Assistant Examiner(s): NOT, DEFINED
• Application Number:
  US08/535,679
• Time in Patent Office: 642 Days
• Field of Search: 73/493, 73/497, 73/431, 73/866.5, 73/756, 73/514.16
• US Class Current: 73/493
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/08 with conversion into electric or magnetic values

Abstract

A microaccelerometer package is provided for housing a microaccelerometer and its associated signal conditioning circuitry. The microaccelerometer package is constructed to be suitably rugged for use in on-board automotive safety control and navigational systems, so as to be capable of isolating the microaccelerometer from extraneous vibrations and package-induced stresses, yet also be small, lightweight, and amenable to mass production techniques. To achieve the above, the microaccelerometer package employs a leadframe which is initially a one-piece strip frame that is integrally molded with a plastic housing to form the primary structure of the package. The leadframe enhances the rigidity of the package so as to result in a high natural frequency of the package, thereby enabling the microaccelerometer to properly respond to the frequency range of interest, while also minimizing the influence of extraneous road and vehicle vibrations on the microaccelerometer. Use of the leadframe also results in a compact microaccelerometer package that imposes minimal package-induced stresses on the microaccelerometer. As a result, a more reliable signal output is provided by the microaccelerometer for indicating an automobile'"'"'s acceleration or deceleration.

Claims

1. An accelerometer assembly comprising:

a unitary metal leadframe including a flat backplate defining a mounting plane for an acceleration sensor and circuit, a pair of brace elements extending from opposing sides of said backplate, and an electrical terminal having a first end disposed in proximity to said backplate, said acceleration sensor and circuit being mounted on said backplate and electrically coupled to said first end of said electrical terminal;

a plastic housing overmolded on said backplate such that said acceleration sensor and circuit and the first end of said terminal are disposed within a central cavity of said housing, and such that said brace elements and a second end of said electrical terminal protrude through said plastic housing; and

said brace elements being bent substantially perpendicular to said mounting plane defined by said backplate so as to form a circuit board mount for said accelerometer assembly.

2. An accelerometer assembly as set forth in claim 1, wherein a ground terminal of said acceleration sensor and circuit is electrically coupled to said backplate so that said acceleration sensor and circuit are electrically grounded to a circuit board through said brace elements.

3. An accelerometer assembly as set forth in claim 1, wherein said backplate includes an integral metal flange extending substantially perpendicular to said mounting plane defined by said backplate and disposed within a peripheral wall of said plastic housing so as to anchor said metal leadframe to said plastic housing.