High density integrated ultrasonic phased array transducer and a method for making

• US 5,644,085 A
• Filed: 04/03/1995
• Issued: 07/01/1997
• Est. Priority Date: 04/03/1995
• Status: Expired due to Fees

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Venkataramani, Venkat Subramaniam, Lorraine, Peter William
• Primary Examiner(s): Williams, Hezron E.
• Assistant Examiner(s): Finley, Rose M.
• Application Number:
  US08/415,895
• Time in Patent Office: 820 Days
• Field of Search: 73/642, 73/625, 73/641, 73/628, 73/632, 29/25.35, 29/840, 310/334, 310/326, 310/327, 310/336, 310/365, 310/366, 310/367, 310/368, 367/153, 367/155
• US Class Current: 73/641
• CPC Class Codes: B06B 1/0629 Square array
• CPC Class Codes: Y10T 29/42 Piezoelectric device making

Abstract

The present invention discloses a high density integrated ultrasonic phased array transducer and method for making. The high density integrated ultrasonic phased array includes a backfill material having an array of holes formed therein. Each of the holes are separated a predetermined distance apart from each other and have a predetermined hole depth. Each of the holes contain a conducting material deposited therein forming a high density interconnect with uniaxial conductivity. A piezoelectric ceramic material is bonded to the backfill material at a surface opposite the array of conducting holes. Matching layers are bonded to the piezoelectric ceramic material. The surface opposite the array of conducting holes is cut through a portion of the matching layers, the piezoelectric ceramic material, and the backfill material, forming an array of isolated individual elements each having multiple electrical connections therein.

Claims

1. A method for forming a high density ultrasonic phased array transducer, the method comprising the steps of:

forming a backfill material;

forming an array of unidirectional holes in the backfill material, each of the holes separated a predetermined distance apart from each other and having a predetermined depth within the backfill material;

depositing a conducting material in the array of holes forming a high density interconnect with uniaxial conductivity;

bonding a piezoelectric ceramic material and matching layers to the backfill material, the piezoelectric ceramic material and the matching layers bonding to the backfill material on a surface opposite the array of conducting holes; and

cutting at the surface opposite the array of conducting holes through a portion of the matching layers, the piezoelectric ceramic material, and the backfill material, forming an array of isolated individual elements each having multiple electrical connections therein.

2. A method according to claim 1, wherein the backfill material comprises an epoxy loaded with particles of dense metal or metal oxide imbedded in silicone rubber.

3. A method according to claim 1, wherein each of the holes in the backfill have a diameter of about 10 μ

m.

4. A method according to claim 3, wherein the array of holes are formed from at least one of laser machining or direct molding.

5. A method according to claim 1, wherein the conducting material is deposited in the array of holes by one of flowing, electrodeless chemical deposition, chemical vapor deposition, or electroplating.

6. A method according to claim 1, further comprising the step of metallizing a surface opposite the array of conducting holes prior to bonding the piezoelectric ceramic material and the matching layers.

7. A method according to claim 1, wherein the step of cutting is made with at least one of a laser or a dicing saw.

8. A method according to claim 1, further comprising the step of patterning solder pads on the array of conducting holes.

9. A method according to claim 8, further comprising the step of attaching electronics to the solder pads.

10. A method for forming a high density ultrasonic phased array transducer, the method comprising the steps of:

forming a backfill material;

forming an array of unidirectional holes in the backfill material, each of the holes separated a predetermined distance apart from each other and having a predetermined depth within the backfill material;

depositing a conducting material in the array of holes forming a high density interconnect with uniaxial conductivity;

metallizing a surface opposite the array of conducting holes;

bonding a piezoelectric ceramic material and matching layers to the backfill material, the piezoelectric ceramic material and the matching layers bonding to the backfill material on the metallized surface;

cutting at the surface opposite the array of conducting holes through a portion of the matching layers, the piezoelectric ceramic material, and the backfill material, forming an array of isolated individual elements each having multiple electrical connections therein; and

patterning solder pads on the array of conducting holes.

11. A method according to claim 10, wherein the backfill material comprises an epoxy loaded with particles of dense metal or metal oxide imbedded in silicone rubber.

12. A method according to claim 10, wherein each of the holes in the backfill have a diameter of about 10 μ

m.

13. A method according to claim 12, wherein the array of holes are formed by at least one of laser machining or direct molding.

14. A method according to claim 10, wherein the conducting material is deposited in the array of holes by one of flowing, electrodeless chemical deposition, chemical vapor deposition, or electroplating.

15. A method according to claim 10, wherein the step of cutting is made by at least one of a laser or a dicing saw.

16. A method according to claim 10, further comprising the step of attaching electronics to the solder pads.

17. A high density ultrasonic phased array transducer, comprising:

a backfill material having an array of holes formed therein, each of the holes separated a predetermined distance apart from each other and having a predetermined hole depth, each of the holes containing a conducting material deposited therein forming a high density interconnect with uniaxial conductivity;

a piezoelectric ceramic material bonded to the backfill material at a surface opposite the array of conducting holes; and

matching layers bonded to the piezoelectric ceramic material, the surface opposite the array of conducting holes having been cut through a portion of the matching layers, the piezoelectric ceramic material, and the backfill material, forming an array of isolated individual elements each having multiple electrical connections therein.

18. A high density ultrasonic phased array transducer according to claim 17, wherein the backfill material comprises an epoxy loaded with particles of dense metal or metal oxide imbedded in silicone rubber.

19. A high density ultrasonic phased array transducer according to claim 17, wherein each of the holes in the backfill have a diameter of about 10 μ

m.

20. A high density ultrasonic phased array transducer according to claim 17, further comprising solder pads patterned on the array of conducting holes for attaching electronics thereto.