Probe apparatus for inspecting electrical characteristics of a microelectronic element

• US 5,644,245 A
• Filed: 11/23/1994
• Issued: 07/01/1997
• Est. Priority Date: 11/24/1993
• Status: Expired due to Term

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron FE Ltd (Tokyo Electron Limited), Tokyo Electron Limited
• Inventors: Terada, Akihiro, Saitoh, Satoshi
• Primary Examiner(s): Nguyen, Vinh P.
• Application Number:
  US08/347,138
• Time in Patent Office: 951 Days
• Field of Search: 324/750, 324/765, 324/757, 324/758, 324/754, 324/73.1, 324/158.1, 437/8, 348/141, 348/126, 348/135, 348/87, 348/94, 382/8
• US Class Current: 324/750.18
• CPC Class Codes: G01R 1/06794 Devices for sensing when probes are in contact, or in position to contact, with measured object
• CPC Class Codes: G01R 31/2887 involving moving the probe head or the IC under test; docking stations moving single probes G01R1/06705; moving individual probes in multiple probes G01R1/07392
• CPC Class Codes: G01R 31/2891 related to sensing or controlling of force, position, temperature G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05

Abstract

A probe apparatus for inspecting electrical characteristics of a microelectronic element formed on a substrate and having a plurality of pads including a probe card having a plurality of probe needles, an image pick-up device for picking up images of the pads and the probe needles, a registration device which previously stores pad position information indicating pad positions of at least specified of the pads and needle position information indicating needle positions of at least specified of the plurality of probe needles, the needle positions being obtained by an actual measurement based on the images picked up by the image pick-up device, and a control processor for executing a task for detecting imaginary needle marks formed on the pads by imaginarily bringing the specified probe needles and the pads corresponding thereto into contact with each other, by overlapping the first position information and the pad position information of the microelectronic element, a task for detecting positional deviation information indicating a positional deviation between the needle marks and the pads, and a task for correcting a positional deviation between the pads and the probe needles in accordance with the positional deviation information.

Claims

1. A probe apparatus comprising:

means for holding a microelectronic element formed on a substrate and having a plurality of pads;

a probe card having a plurality of probe needles;

means for holding said probe card;

image pick-up means for picking up images of the pads and the probe needles;

registration means for previously storing pad position information indicating pad positions of at least specified pads of said pads and needle position information indicating needle positions of at least specified probe needles of said plurality of probe needles, the needle positions being obtained by an actual measurement based on the images picked up by said image pick-up means;

a control processor for executing a task for forming imaginarily needle marks on said pads by overlapping said needle position information and the pad position information of the microelectronic element to obtain imaginary needle mark information, and a task for detecting a positional deviation between said needle marks and said pads on the basis of the imaginary needle mark information and the pad positions.

2. An apparatus according to claim 1, wherein said registration means stores another needle position information indicating positions, which are actually measured, of arbitrary probe needles other than said specified probe needles, said control processor detects another imaginary needle marks formed on said pads by imaginarily bringing said arbitrary probe needles and said pads corresponding thereto into contact with each other, by overlapping said another needle position information and the pad position information, and detects another positional deviation information indicating a positional deviation between said another imaginary needle marks and said pads corresponding to said arbitrary probe needles, and corrects a positional deviation between said pads and said arbitrary probe needles in accordance with the another positional deviation information.

3. An apparatus according to claim 2, which further includes a driving unit for moving said microelectronic element to said probe card in order to bring said pads of said microelectronic element and said probe needles actually into contact with each other and forming actual needle marks on said pads, and said control processor detects said actual needle marks formed on said pads of the microelectronic element on the basis of the image signal of said image pick-up means, detects positional deviation information indicating a positional deviation between said actual needle marks and said pads, and corrects a positional deviation between said pads and said probe needles in accordance with the positional deviation information.

4. An apparatus according to claim 3, wherein said control processor fixes said holding means holding said probe card and drives said driving unit for making the microelectronic element rotate, to perform θ

correction of positions of said pads.

5. An apparatus according to claim 4, wherein said control processor corrects the positions of said pads with respect to said probe needles such that a sum of squares of positional deviation amounts between said needle marks and said pads becomes minimum.

6. An apparatus according to claim 1, wherein said image pick-up means has auto-focus means for focusing on distal ends of said probe needles by auto-focus, and said registration means stores coordinates corresponding to focussed ones of said probe needles as the needle position information.

7. An apparatus according to claim 6, which further includes means for automatically exchanging said probe card with another probe card.

8. An apparatus according to claim 7, wherein said means for automatically exchanging executes automatic exchange of said probe card under control of said control processor when said control processor detects that the positional deviation between said needle marks and said pads are outside a predetermined range.

9. An apparatus according to claim 1, wherein said microelectronic element includes one of a plurality of integrated circuit chips formed on a semiconductor wafer as said substrate.

10. An apparatus according to claim 1, wherein:

said image pick up means includes an image sensor for image-picking up needle marks formed on said probe needles when said probe needles touch said pads to output an image signal; and

said control processor includes a discrimination section for discriminating a contact state between said probes and said electrode pads on the basis of the image signal from said image sensor, said discrimination section including a calculator for calculating an area of each of the needle marks and a position thereof on the basis of the image signal from said image sensor to obtain needle mark area data and needle mark position data, a comparator for comparing the needle mark area data and needle mark position data obtained by said calculator with reference data, and a decision circuit for deciding a contact state between said probes and said electrode pads on the basis of at least one of the needle mark position reformation and the needle mark area data stored in said storage means.

11. An apparatus according to claim 10, wherein said calculator calculates a centroid position of the area of each of the needle marks, and said decision circuit decides whether or not the calculated area exceeds a predetermined value and the area centroid is included in a predetermined range.

12. An apparatus according to claim 10, wherein said calculator subtracts the previously formed needle mark including one overlapping portion from the sum of the area of the previously formed needle mark and the area of the needle mark formed the last time and said decision circuit decides the contact state on the basis of a result of said calculator.

13. An apparatus according to claim 10, wherein said discrimination section has an interpolating circuit for subjecting the image signal to an interpolation processing to compensate a partial lost of the needle mark.

14. An apparatus according to claim 1, wherein said control processor executes a task for correcting the positional deviation between said pads and said probe needles on the basis of positional deviation information corresponding to the positional deviation.

15. A probe apparatus comprising:

means for holding a microelectronic element formed on a substrate and having a plurality of pads;

a probe card having a plurality of probe needles;

means for holding said probe card;

image pick-up means for picking up images of the pads and the probe needles;

registration means for previously storing pad position coordinate data indicating pad positions of at least specified pads of said pads and needle position coordinate data indicating needle positions of at least specified probe needles of said plurality of probe needles, the needle positions being obtained by an actual measurement based on the images picked up by said image pick-up means;

a control processor for executing a task for forming imaginary needle marks on said pads by overlapping the needle position coordinate data and the pad position coordinate data to obtain imaginary needle mark coordinate data, and a task for detecting a positional deviation between said needle marks and said pads on the basis of the imaginary needle mark coordinate data and the pad position coordinate data to obtain positional deviation information.

16. An apparatus according to claim 15, wherein said control processor executes a task for correctly the positional deviation between said pads and said probe needles on the basis of the positional deviation information.

17. An apparatus according to claim 15, wherein said registration means stores another pad position coordinate data indicating positions, which are actually measured, of arbitrary probe needles other than said specified probe needles, said control processor detects another imaginary needle marks formed on said pads by overlapping said another needle position coordinated data and the pad position coordinate data, and detects another positional deviation information indicating a positional deviation between said another imaginary needle marks and said pads corresponding to said arbitrary probe needles, and corrects a positional deviation between said pads and said arbitrary probe needles on the basis of the another positional deviation information.