Electrically conductive pressure sensitive adhesives
First Claim
1. A composition of matter of an electrically conducting admixture of an organic solvent soluble or water soluble pressure sensitive adhesive formulation selected from the group consisting of polyisoprenes, styrene-diolefin triblock copolymers, styrene-butadiene copolymers, polyisobutylenes, ethylene-vinylacetate copolymers, acrylics, poly(vinyl alkyl ethers) precursors and subsequently cured silicones and urethanes and between about 0.3% and 40% by weight of an electrically conducting polymer wherein said electrically conductive polymer is substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophenes, substituted and unsubstituted polyphenylene sulfides and substituted and unsubstituted polyacetylenes formed from soluble precursors, blends of said substituted and unsubstituted polymers, and copolymers made from the monomers used to form said polymers and wherein the constituents comprising said admixture do not phase separate, and said glass transition temperature of said blend is below 30°
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1 Assignment
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Accused Products
Abstract
An electrically conductive pressure sensitive adhesive containing electrically conductive polymers used as an alternative to metallic solder in interconnect electronic applications.
61 Citations
29 Claims
- 1. A composition of matter of an electrically conducting admixture of an organic solvent soluble or water soluble pressure sensitive adhesive formulation selected from the group consisting of polyisoprenes, styrene-diolefin triblock copolymers, styrene-butadiene copolymers, polyisobutylenes, ethylene-vinylacetate copolymers, acrylics, poly(vinyl alkyl ethers) precursors and subsequently cured silicones and urethanes and between about 0.3% and 40% by weight of an electrically conducting polymer wherein said electrically conductive polymer is substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophenes, substituted and unsubstituted polyphenylene sulfides and substituted and unsubstituted polyacetylenes formed from soluble precursors, blends of said substituted and unsubstituted polymers, and copolymers made from the monomers used to form said polymers and wherein the constituents comprising said admixture do not phase separate, and said glass transition temperature of said blend is below 30°
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2. A composition of matter of an electrically conducting admixture of an organic solvent soluble or water soluble pressure sensitive adhesive formulation selected from the group consisting of polyisoprenes, styrene-diolefin triblock copolymers, styrene-butadiene copolymers, polyisobutylenes, ethylene-vinylacetate copolymers, acrylics, poly(vinyl alkyl ethers) precursors and subsequently cured silicones and urethanes and between about 0.3% and 40% by weight of an electrically conducting polymer wherein said electrically conductive polymer is substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophenes, substituted and unsubstituted polyphenylene sulfides and substituted and unsubstituted polyacetylenes formed from soluble precursors, blends of said substituted and unsubstituted polymers, and copolymers made from the monomers used to form said polymers and wherein said electrically conducting polymer is soluble in said pressure sensitive adhesive formulation.
Specification