Process for producing semiconductor devices using resin tablets

• US 5,645,787 A
• Filed: 06/05/1995
• Issued: 07/08/1997
• Est. Priority Date: 03/20/1991
• Status: Expired due to Fees

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: Kanai, Shinichi, Kimura, Syoichi, Toyoda, Yoshio, Asao, Hiroyuki, Taruno, Tomohiro
• Primary Examiner(s): Bleutoe, John C.
• Assistant Examiner(s): WILSON, DONALD R
• Application Number:
  US08/464,386
• Time in Patent Office: 764 Days
• Field of Search: 264/272.17, 264/328.4, 264/328.5, 264/331.12, 428/80
• US Class Current: 264/272.17
• CPC Class Codes: B29B 11/14 characterised by structure or composition
• CPC Class Codes: B29B 13/022 Melting the material to be shaped
• CPC Class Codes: B29B 9/10 by moulding the material, i.e. treating it in the molten state
• CPC Class Codes: B29C 2043/3689 on a support table, e.g. flat disk-like tables having moulds on the periphery
• CPC Class Codes: B29C 2949/0715 the preform having one end closed
• CPC Class Codes: B29C 35/16 Cooling cooling extruded material B29C48/911; cooling preforms for blow moulding B29C49/6427; cooling blown articles B29C49/66; cooling tyres during post cure inflation B29D30/0643
• CPC Class Codes: B29C 43/00 Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor by liberation of internal stresses B29C61/006
• CPC Class Codes: B29C 43/003 characterised by the choice of material
• CPC Class Codes: B29C 43/08 with circular movement , e.g. mounted on rolls, turntables
• CPC Class Codes: B29C 43/34 Feeding the material to the mould or the compression means B29C43/085 takes precedence
• CPC Class Codes: B29C 45/462 Injection of preformed charges of material
• CPC Class Codes: B29C 48/00 Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor extrusion blow-moulding B29C49/04
• CPC Class Codes: B29C 48/001 Combinations of extrusion moulding with other shaping operations
• CPC Class Codes: B29C 48/0011 combined with compression moulding
• CPC Class Codes: B29C 48/04 Particle-shaped making granules B29B9/00
• CPC Class Codes: B29C 48/07 Flat, e.g. panels
• CPC Class Codes: B29C 48/08 flexible, e.g. films
• CPC Class Codes: B29C 49/071 Preforms or parisons characterised by their configuration, e.g. geometry, dimensions or physical properties
• CPC Class Codes: B29K 2063/00 Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
• CPC Class Codes: B29K 2105/0067 Melt
• CPC Class Codes: B29K 2105/065 : containing impurities
• CPC Class Codes: B29K 2105/251 : Particles, powder or granules expandable particles B29K2105/046
• CPC Class Codes: B29K 2105/255 : Blocks or tablets
• CPC Class Codes: H01L 21/56 : Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 23/295 : containing a filler H01L23/296 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A resin tablet for sealing by transfer molding a semiconductor, which is obtained by cooling and solidifying a molten resin composition, is disclosed. The tablet has a compressibility of not less than 98% and a metallic impurity content of less than 50 ppm, preferably with the amount of fine powders of 250 mesh or smaller adhered thereto being controlled below 0.05% by weight based on the tablet and a water content being controlled below 0.1% by weight.

Claims

1. A process for producing a semiconductor device comprising sealing a semiconductor chip with a resin tablet having a compressibility of not less than 98% and a metallic impurity content of less than 50 ppm which is obtained by cooling and solidifying a molten resin composition, by transfer molding.

2. A process as claimed in claim 1, wherein the resin tablet comprises a resin composition comprising a resin, a filler and a curing agent.

3. A process as claimed in claim 1, wherein the resin composition is an epoxy resin composition.

4. A process as claimed in claim 1, wherein the resin tablet comprises less than 0.05% by weight, based on the entire weight of the tablet of fine powders adhered to said resin tablet, and wherein said fine powders have a mesh size of 250 or smaller.

5. A process as claimed in claim 1, wherein said tablet has a water content of less than 0.1% by weight.

6. A process as claimed in claim 1, wherein said tablet has an outer diameter of not more than 20 mm and a length to outer ratio of not less than 1.

7. A process as claimed in claim 1, wherein said tablet has an outer diameter of not less than 20 mm and a length to outer diameter ratio of not more than 1.

8. A process as claimed in claim 1, wherein said tablet is composed of a plurality of tablets, laminated by adhesion or fusion, each having an outer diameter of not less than 20 mm and a length to outer diameter ratio of not more than 1.

9. A process as claimed in claim 1, wherein said tablet is a hollow tablet having an outer diameter of not less than 20 mm and an inner diameter of not more than 20 mm, said outer diameter and said inner diameter not simultaneously being 20 mm.