Manufacturing method for an integrated circuit card

• US 5,647,122 A
• Filed: 06/14/1995
• Issued: 07/15/1997
• Est. Priority Date: 06/15/1994
• Status: Expired due to Term

• Current Assignee: De La Rue Cartes et Systemes
• Original Assignee: US Philips Corporation (Koninklijke Philips N.V.)
• Inventors: Venambre, Jacques, Launay, Fran.cedilla.ois
• Primary Examiner(s): Echols, P. W.
• Assistant Examiner(s): COLEY, ADRIAN
• Application Number:
  US08/490,482
• Time in Patent Office: 762 Days
• Field of Search: 29/840, 29/841, 29/846, 29/852, 29/860, 264/272.15, 264/272.17
• US Class Current: 29/840
• CPC Class Codes: B29L 2031/3493 Moulded interconnect devices, i.e. moulded articles provided with integrated circuit traces
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01058 : Cerium [Ce]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01087 : Francium [Fr]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15157 : Top view
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: Y10T 29/49144 : by metal fusion

Abstract

The electronic card comprises an electrically insulating card support provided with a cavity for accommodating an integrated circuit and, on one surface, with metal contact pads which are electrically connected to contacts of the integrated circuit. The invention comprises the steps of: (i) the application by an MID technique (Moulded Interconnection Devices) of electrical conductor tracks, all arranged on the bottom and the lateral walls of the cavity, and each connected to one of the metal contact pads arranged on the surface of the support which comprises the cavity, (ii) the realization of electrical connections connecting the contacts of the integrated circuit arranged in the cavity to the conductor tracks on the bottom of the cavity, and (iii) filling up of the cavity with a protective resin which is subsequently polymerized.

Claims

1. A method of manufacturing an electronic card having an electrically insulating card support provided with a cavity for accommodating an integrated circuit and, on one surface of said support, metal contact pads electrically connected to contacts of said integrated circuit, said method comprising the steps of:

(i) the application of electrical conductor tracks, all provided against the bottom and the lateral walls of said cavity and each connected to one of said metal contact pads arranged on the surface of the support which comprises said cavity,

(ii) the realisation of electrical connections interconnecting the contacts of the integrated circuit positioned in the cavity and said conductor tracks at the bottom of the cavity, and

(iii) filling up of said cavity with a protective resin which is subsequently polymerized.

2. A method as claimed in claim 1, wherein the step of applying the electrical conductor tracks consists in gluing the tracks under pressure and heat with a glue which is activated by heat (hot foil embossing method).

3. A method as claimed in claim 1, wherein the step of applying the electrical conductor tracks consists in the application of a catalyst in a pad printing process in accordance with a configuration desired for the tracks, followed by a metallization through autocatalysis.

4. A method as claimed in claim 1, wherein the step of applying the electrical conductor tracks consists in a 3-dimensional photolithography process utilizing a laser hologram.

5. A method as claimed in claim 1, wherein said step of realising the electrical connections consists in gluing of the integrated circuit with its base against the bottom of said cavity by means of a glue, followed by soldering of conductor wires between the contacts of the integrated circuit and the conductor tracks.

6. A method as claimed in claim 1, wherein the card support is realised, with its cavity, by an injection-moulding technique and comprises elevations at the bottom of the cavity in locations designed for the ends of the conductor tracks.

7. A method as claimed in claim 1, wherein said step of realising the electrical connections is carried out by a flip-chip integrated circuit mounting technique selected from the group consisting of soldering, insulating glue, and conductive glue in defined locations;

the contacts of the integrated circuit being provided with elevations.

8. A process as claimed in claim 1, wherein said step of realising the electrical connections is carried out by a flip-chip integrated circuit mounting technique consisting of gluing in combination with pressure, the glue being anisotropically electrically conductive and in a form selected from the group consisting of a pre-shaped foil and a paste;

the contacts of the integrated circuit being without elevations.

9. A method as claimed in claim 8, wherein said anisotropically electrically conductive glue is prepolymerized before the step of realising the electrical connections, and wherein its final polymerization is carried out simultaneously with that of said protective resin.