Thermal management of electronic components using synthetic diamond
First Claim
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1. A heat-sinked electronic component, comprising:
- a first layer of synthetic diamond having a relatively low thermal conductivity;
a second layer of synthetic diamond adjacent said first layer, said second layer of synthetic diamond having a relatively high thermal conductivity, said second layer being thinner than said first layer; and
an electronic component mounted on said second layer of synthetic diamond.
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Abstract
A heat-sinked electronic component includes a first layer of synthetic diamond having a relatively low thermal conductivity. A second layer of synthetic diamond is adjacent the first layer, the second layer of synthetic diamond having a relatively high thermal conductivity, the second layer being thinner than the first layer. An electronic component is mounted on the second layer of synthetic diamond. In a disclosed embodiment, the thermal conductivity of the diamond of the second layer is at least fifteen percent higher than the thermal conductivity of the diamond of the first layer, and the first layer is at least twice as thick as second layer.
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Citations
8 Claims
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1. A heat-sinked electronic component, comprising:
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a first layer of synthetic diamond having a relatively low thermal conductivity; a second layer of synthetic diamond adjacent said first layer, said second layer of synthetic diamond having a relatively high thermal conductivity, said second layer being thinner than said first layer; and an electronic component mounted on said second layer of synthetic diamond. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification