Thermal management of electronic components using synthetic diamond

• US 5,648,148 A
• Filed: 05/17/1995
• Issued: 07/15/1997
• Est. Priority Date: 12/30/1993
• Status: Expired due to Fees

• Current Assignee: Saint-Gobain/Norton Industrial Ceramics Corporation
• Original Assignee: Saint-Gobain/Norton Industrial Ceramics Corporation
• Inventors: Simpson, Matthew
• Primary Examiner(s): TURNER, ARCHENE A
• Application Number:
  US08/443,188
• Time in Patent Office: 790 Days
• Field of Search: 428/212, 428/408, 428/216, 428/209, 257/77, 174/138 C
• US Class Current: 428/212
• CPC Class Codes: H01L 23/3732 Diamonds
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 156/1092 All laminae planar and face to face
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/24942 including components having same physical characteristic in differing degree
• CPC Class Codes: Y10T 428/24975 No layer or component greater than 5 mils thick
• CPC Class Codes: Y10T 428/30 Self-sustaining carbon mass or layer with impregnant or other layer

Abstract

A heat-sinked electronic component includes a first layer of synthetic diamond having a relatively low thermal conductivity. A second layer of synthetic diamond is adjacent the first layer, the second layer of synthetic diamond having a relatively high thermal conductivity, the second layer being thinner than the first layer. An electronic component is mounted on the second layer of synthetic diamond. In a disclosed embodiment, the thermal conductivity of the diamond of the second layer is at least fifteen percent higher than the thermal conductivity of the diamond of the first layer, and the first layer is at least twice as thick as second layer.

Claims

1. A heat-sinked electronic component, comprising:

a first layer of synthetic diamond having a relatively low thermal conductivity;

a second layer of synthetic diamond adjacent said first layer, said second layer of synthetic diamond having a relatively high thermal conductivity, said second layer being thinner than said first layer; and

an electronic component mounted on said second layer of synthetic diamond.

2. The heat-sinked electronic component as defined by claim 1, wherein the thermal conductivity of the diamond of said second layer is at least fifteen percent higher than the thermal conductivity of the diamond of said first layer.

3. The heat-sinked component as defined by claim 1, wherein said first layer is at least twice as thick as said second layer.

4. The heat-sinked component as defined by claim 2, wherein said first layer is at least twice as thick as said second layer.

5. The heat-sinked component as defined by claim 1, further comprising a third layer of synthetic diamond adjacent said first layer and on a surface thereof opposite said second layer, said third layer of synthetic diamond having a relatively high thermal conductivity, said third layer being thinner than said first layer;

and a further electronic component mounted on said third layer.

6. The heat-sinked electronic components as defined by claim 5, wherein the thermal conductivity of the diamond of said second layer is at least fifteen percent higher than the thermal conductivity of the diamond of said first and third layers, and wherein said first layer is at least twice as thick as said second layer, and said first layer is at least twice as thick as said third layer.

7. The heat-sinked component as defined by claim 1, wherein said first and second layers have generally cylindrical shapes.

8. The heat-sinked component as defined by claim 2, wherein said first and second layers have generally cylindrical shapes.