Resist hardening process having improved thermal stability

• US 5,648,198 A
• Filed: 12/13/1994
• Issued: 07/15/1997
• Est. Priority Date: 12/13/1994
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Shibata, Tsuyoshi
• Primary Examiner(s): McPherson, John A.
• Application Number:
  US08/354,921
• Time in Patent Office: 945 Days
• Field of Search: 430/328, 430/296, 430/313, 430/325, 430/330, 430/396, 156/659.11
• US Class Current: 430/296
• CPC Class Codes: G03F 7/2024 of the already developed image
• CPC Class Codes: G03F 7/40 Treatment after imagewise removal, e.g. baking
• CPC Class Codes: G03F 7/405 Treatment with inorganic or organometallic reagents after imagewise removal
• CPC Class Codes: Y10S 438/949 Energy beam treating radiation resist on semiconductor

Abstract

The present invention is directed to a method of hardening a photoresist formed on a patterned layer during photolithograpy, without causing undesirable shrinkage of the resist features. The patterned layer is disposed on a semiconductor substrate, and the photoresist layer is disposed on the patterned layer in a conventional manner. The photoresist layer is irradiated and developed in a conventional manner to have the desired pattern formed therein. The larger features of the developed photoresist layer are irradiated without heat to thereby harden these features, without irradiating the smaller features. The hardening may be performed by screening the smaller features from the radiation applied to the photoresist layer, or by scanning a beam across only the larger features. The radiation may be UV light or an electron beam. Alternatively, all of the features of the photoresist may be hardened by exposure to a basic atmosphere immediately before, during or immediately after irradiation with UV light. In both cases, the features are hardened without shrinkage. After the features are hardened, the photoresist and patterned layer are etched in a conventional manner to transfer the pattern to the patterned layer.

Claims

1. A method for patterning a layer disposed on a semiconductor substrate, said method comprising:

disposing a photoresist on the layer;

forming a pattern in the photoresist, the pattern including at least a first feature having a first width and a second feature having a second width which is greater than the first width;

irradiating the second feature with radiation and not irradiating the first feature with the radiation; and

etching the layer having the photoresist thereon to pattern the layer.

2. The method recited in claim 1, the irradiating step including applying UV radiation to the second feature, the method further including simultaneously screening the first feature from the UV radiation.

3. The method recited in claim 2, the UV radiation having a wavelength less than 300 nm.

4. The method recited in claim 2, the UV radiation having an intensity of at least 120 mW/m².

5. The method recited in claim 2, the UV radiation having a wavelength less than 400 nm.

6. The method recited in claim 2, the UV radiation having an intensity of at least 120 mW/m² and a wavelength less than 400 nm.

7. The method recited in claim 1, the irradiating step including scanning the second feature with an electron beam.

8. The method recited in claim 7, the electron beam having a dose of 40 μ

C.

9. The method recited in claim 4, the electron beam having an acceleration voltage of 14 keV.

10. The method recited in claim 4, the electron beam having a dose of 40 μ

C and an acceleration voltage of 14 keV.

11. The method recited in claim 1, the photoresist formed to have a plurality of first features each having a substantially identical first width, the first width being substantially equal to the spacing between the first features.

12. The method recited in claim 1 wherein during the irradiating step the temperature of the photoresist is maintained at less than 90°

C.

13. The method recited in claim 1, the photoresist formed of polyvinylphenol.

14. The method recited in claim 1, the first width being about 0.3 μ

m and the second width being greater than 1 μ

m.

15. The method recited in claim 1, the layer being formed of a material selected from the group consisting of a metal, an oxide and a semiconductor.

16. The method recited in claim 1, the first width being 0.5 μ

m or less.

17. The method recited in claim 1, the first width being 0.3 μ

m or less.

18. The method recited in claim 1, the second width being greater than 1.0 μ

m.

19. The method recited in claim 1, the first width being 0.5 μ

m or less and the second width being greater than 1.0 μ

m.

20. The method recited in claim 1, the first width being 0.3 μ

m or less and the second width being greater than 1.0 μ

m.

27. The method recited in claim 6, the first features having a width of about 0.3 μ

m and the second feature having a width of at least 1 μ

m.

28. The method recited in claim 27, the radiation comprising UV light having a wavelength of less than 300 nm.

29. The method recited in claim 27, the radiation comprising an electron beam.

30. The method recited in claim 27, further comprising maintaining the second feature at a temperature less than 90°

.

21. A method for hardening a photoresist developed upon a layer formed upon a semiconductor substrate, the photoresist developed to have a plurality of first features spaced from each other and having substantially the same width and at least one second feature spaced from said first features and having a width which is greater than the width of the first features, said method including:

disposing a mask over said first features and

projecting radiation upon the photoresist, wherein,

the radiation irradiates and thereby hardens the second feature, and the mask is opaque to the radiation such that the radiation does not irradiate the first features.

22. The method recited in claim 21, the first features having a width of about 0.3 μ

m and the second feature having a width of at least 1 μ

m.

23. The method recited in claim 21, the radiation comprising UV light having a wavelength less than 300 nm.

24. The method recited in claim 21, the radiation comprising an electron beam.

25. The method recited in claim 21, further comprising maintaining the second feature at a temperature less than 90°

C.

26. A method for hardening a photoresist developed upon a layer formed upon a semiconductor substrate, the photoresist developed to have a plurality of first spaced features having substantially the same width and at least one second feature spaced from said first features and having a width which is greater than the width of the first features, said method including:

directing radiation at a location at one side of the second feature and

scanning the radiation over the second feature without scanning the first features, wherein,

the radiation irradiates and thereby hardens the second feature, and does not irradiate the first features.