Filtered feedthrough assembly having a mounted chip capacitor for medical implantable devices and method of manufacture therefor

• US 5,650,759 A
• Filed: 11/09/1995
• Issued: 07/22/1997
• Est. Priority Date: 11/09/1995
• Status: Expired due to Term

• Current Assignee: Greatbatch Limited (Greatbatch Incorporated)
• Original Assignee: Greatbatch-Hittman, Inc. (Integer Holdings Corporation Inc)
• Inventors: Gelb, Allan S., Foreman, Thomas N., Gelb, Marcia J., Hittman, Fred
• Primary Examiner(s): Lee, Benny
• Assistant Examiner(s): Bettendorf, Justin P.
• Application Number:
  US08/555,396
• Time in Patent Office: 621 Days
• Field of Search: 333/181-185, 439/620, 361/302, 607/37
• US Class Current: 333/182
• CPC Class Codes: A61N 1/3754 Feedthroughs
• CPC Class Codes: H03H 1/0007 of radio frequency interference filters

Abstract

A filtered feedthrough assembly (100, 100'"'"', 100", 200, 200", 300) for use in implantable medical devices is provided. The filtered feedthrough assembly provides at least one chip capacitor (110, 210) or an LC circuit coupled between a lead wire (12) and an end surface (18) of a metallic ferrule (14). The chip capacitor is secured in position by means of a [non-conductive film (122) and] conductive material (120) applied to opposing ends of the chip capacitor. The end portion of the feedthrough and chip capacitor may be encapsulated by an encapsulant (102) to provide a moisture resistant coating therefor.

Claims

1. A filtered feedthrough assembly for medical implantable devices, comprising:

a metallic ferrule having opposing first and second ends and a centrally disposed through opening extending between said first and second ends, said ferrule having a first flange formed on said first end for coupling to a medical implantable device and a second flange formed on said second end;

at least one elongate lead wire having a circular cross-sectional contour extending through said ferrule through opening;

means for forming a hermetic seal between said lead wire and said ferrule disposed within said ferrule through opening;

at least one chip capacitor having a parallelepiped contour extending from said lead wire to said second flange of said ferrule, said chip capacitor having a pair of metallized contacts formed on opposing end portions of said chip capacitor, each of said metallized contacts having conductive segments disposed on at least an end most portion of each side of said chip capacitor, said chip capacitor having one conductive segment of a respective endmost side portion disposed in contiguous relationship with said lead wire and one conductive segment on a lower side of said opposing end portion disposed contiguous said second flange of said ferrule; and

,

means for electrically coupling said metallized contacts to said lead wire and said second flange of said ferrule respectively.

2. The filtered feedthrough assembly as recited in claim 1 further comprising a non-conductive adhesive disposed on a bottom surface of said chip capacitor between said pair of metallized contacts.

3. A filtered feedthrough assembly for medical implantable devices, comprising:

a metallic ferrule having opposing first and second ends and a centrally disposed through opening extending between said first and second ends, said ferrule having a first flange formed on said first end for coupling to a medical implantable device and a second flange formed on said second end;

at least one elongate lead wire having a circular cross-sectional contour extending through said ferrule through opening;

means for forming a hermetic seal between said lead wire and said ferrule disposed within said ferrule through opening, said hermetic seal means having an end surface disposed in coplanar relationship with said second flange of said ferrule;

filter support means disposed at said end surface of said hermetic seal means, said filter support means including a insulative substrate having at least one aperture formed therein for passage of said lead wire therethrough;

at least one chip capacitor having a parallelepiped contour disposed on said filter support means extending from said lead wire to said second flange of said ferrule, said chip capacitor having a pair of metallized contacts formed on opposing end portions of said chip capacitor; and

,

means for electrically coupling said metallized contacts to said lead wire and said second flange of said ferrule respectively.

4. The filtered feedthrough assembly as recited in claim 3 where said hermetic seal means is formed of an insulative material composition.

5. The filtered feedthrough assembly as recited in claim 4 where said insulative material composition is a glass composition.

6. The filtered feedthrough assembly as recited in claim 4 where said insulative material composition is a ceramic material.

7. The filtered feedthrough assembly as recited in claim 3 where said filter support means includes a metallized annulus formed on said substrate surrounding said at least one aperture for electrical coupling with a first of said pair of metallized contacts and said at least one lead wire.

8. The filtered feedthrough assembly as recited in claim 7 where said filter support means includes a metallized region formed on said substrate adjacent a perimeter edge thereof for electrical coupling with a second of said pair of metallized contacts and said ferrule.

9. The filtered feedthrough assembly as recited in claim 3 where said insulative substrate and said hermetic seal means are integrally formed in one piece formation.

10. A multi-lead filtered feedthrough assembly for medical implantable devices, comprising:

a metallic ferrule having opposing first and second ends and a centrally disposed through opening extending between said first and second ends, said ferrule having a first flange formed on said first end for coupling to a medical implantable device and a second flange formed on said second end;

a plurality of elongate lead wires extending through said ferrule through opening, each of said plurality of lead wires having a circular cross-sectional contour;

means for forming a hermetic seal between said plurality of lead wires and said ferrule disposed within said ferrule through opening, said hermetic seal means having an end surface disposed in coplanar relationship with said second flange of said ferrule;

filter support means disposed at said end surface of said hermetic seal means, said filter support means including a insulative substrate having a plurality of apertures formed therein for respective passage of said plurality lead wires therethrough;

a plurality of chip capacitors, each of said plurality of chip capacitors being disposed on said filter support means and having a parallelepiped contour and extending from a respective one of said plurality of lead wires to said second flange of said ferrule, each of said chip capacitors having a pair of metallized contacts formed on opposing end portions of said chip capacitor; and

,

means for electrically coupling said metallized contacts of each of said chip capacitors respectively to a respective one of said lead wires and said ferrule.

11. The filtered feedthrough assembly as recited in claim 10 where said insulative substrate and said hermetic seal means are integrally formed in one piece formation.

12. The multi-lead filtered feedthrough assembly as recited in claim 10 further comprising a plurality of bands of a nonconductive material disposed on an end surface of said hermetic seal means, each of said plurality of bands of nonconductive material being disposed adjacent one side of a respective one of said plurality of chip capacitors.

13. The multi-lead filtered feedthrough assembly as recited in claim 12 where each of said plurality of bands of nonconductive material is formed by a polyimide composition.

14. The multi-lead filtered feedthrough assembly as recited in claim 12 where each of said plurality of bands of nonconductive material is formed by an epoxy composition.

15. The multi-lead filtered feedthrough assembly as recited in claim 10 where said extension of each of said chip capacitors forms an angle θ

with respect to a respective radial line extending from a central axis of said ferrule through a respective lead wire, said angle θ

being within a range 0°

<

θ

<

90°

.

16. The filtered feedthrough assembly as recited in claim 10 where said filter support means includes a plurality of metallized annuluses respectively formed on said substrate surrounding said plurality of apertures, each of said metallized annuluses providing electrical coupling with a first of said pair of metallized contacts of a respective one of said plurality of chip capacitors and a respective one of said plurality of lead wires.

17. The filtered feedthrough assembly as recited in claim 16 where said filter support means includes a metallized region formed on said substrate adjacent a perimeter edge thereof for electrical coupling with a second of said pair of metallized contacts of each of said plurality of chip capacitors and said ferrule.

18. A multi-lead filtered feedthrough assembly for medical implantable devices, comprising:

a longitudinally extended metallic ferrule having opposing first and second ends and a centrally disposed through opening extending between said first and second ends, said ferrule having a flange formed on said first end for coupling to a medical implantable device;

a plurality of elongate lead wires extending through said ferrule through opening in radially spaced relationship with respect to a longitudinal axis of said ferrule, each of said plurality of lead wires having a circular cross-sectional contour;

means for forming a hermetic seal between said plurality of lead wires and said ferrule disposed within said ferrule through opening, said hermetic seal means having an end surface disposed in coplanar relationship with said second end of said ferrule;

a plurality of chip capacitors disposed on said end surface of said hermetic seal means, each of said plurality of chip capacitors having a parallelepiped contour and extending from a respective one of said plurality of lead wires to said ferrule, said extension of each of said chip capacitors forming an angle θ

with respect to a respective radial line extending from said longitudinal axis of said ferrule through a respective lead wire, said angle θ

being within a range 0°

<

θ

<

90°

, each of said chip capacitors having a pair of metallized contacts formed on opposing end portions of said chip capacitor; and

means for electrically coupling said metallized contacts of each of said chip capacitors respectively to a respective one of said lead wires and said ferrule.

19. The multi-lead filtered feedthrough assembly as recited in claim 18 further comprising a plurality of bands of a nonconductive material disposed on said end surface of said hermetic seal means, each of said plurality of bands of nonconductive material being disposed adjacent one side of a respective one of said plurality of chip capacitors.

20. The multi-lead filtered feedthrough assembly as recited in claim 19 where each of said plurality of bands of nonconductive material is formed by an epoxy composition.

21. The multi-lead filtered feedthrough assembly as recited in claim 19 where each of said plurality of bands of nonconductive material is formed by a polyimide composition.

22. The multi-lead filtered feedthrough assembly as recited in claim 18 where each of said metallized contacts have conductive segments disposed on at least an end most portion of each side of said chip capacitor, each of said chip capacitors having one endmost side portion disposed in contiguous relationship with a respective one of said plurality of lead wires.

23. A method of adding chip capacitor filters to a feedthrough assembly for use in medical implantable devices, comprising the steps of:

a. providing an insulative substrate, said substrate having at least one aperture and at least one channel extending from said aperture to a perimeter edge thereof;

b. providing at least one parallelepiped shaped chip capacitor, said chip capacitors having a pair of metallized contacts formed on opposing end portions of said chip capacitor;

c. installing said chip capacitor on said insulative substrate in said channel;

d. providing a feedthrough assembly having a ferrule, at least one lead wire extending through an opening formed in said ferrule, and means for hermetically sealing said lead wire and said ferrule, said hermetic sealing means having an end surface disposed in coplanar relationship with an end of said ferrule;

e. positioning said substrate on said end surface of said hermetic sealing means with said lead wire passing through said aperture; and

,

f. electrically coupling said pair of metallized contacts respectively to said lead wire and said ferrule.

24. The method as recited in claim 23 where said step of installing said chip capacitor is followed by the step of electrically testing said chip capacitor.

25. A method of adding chip capacitor filters to a multi-lead feedthrough assembly for use in medical implantable devices, comprising the steps of:

a. providing a feedthrough assembly having a ferrule, a plurality of lead wires extending through an opening formed in said ferrule, and means for hermetically sealing said plurality of lead wires and said ferrule;

b. providing a plurality of parallelepiped shaped chip capacitors, each of said chip capacitors having a pair of metallized contacts formed on opposing end portions of said chip capacitor, each of said pair of metallized contacts having conductive segments disposed on at least an end most portion of each side of said chip capacitor;

c. installing each of said plurality of chip capacitors between a respective lead wire and an end surface of a flange of said ferrule, said step of installing each chip capacitor includes applying a nonconductive film to a bottom surface of a respective chip capacitor, positioning a respective chip capacitor to extend between a respective one of said lead wires and said ferrule, applying an electrically conductive material to bridge between a first of said pair of metallized contacts and said respective lead wire, applying an electrically conductive material to bridge between a second of said pair of metallized contacts and said ferrule, and heating said feedthrough with said positioned chip capacitors at a first predetermined temperature to at least partially cure said nonconductive film;

d. electrically testing said installation of each of said chip capacitors; and

,

e. heating said feedthrough with said positioned chip capacitors at a second predetermined temperature, said second predetermined temperature being higher than said first predetermined temperature.

26. The method as recited in claim 25 where the step of applying an electrically conductive material includes the step of applying an electrically conductive adhesive.

27. A method of adding chip capacitor filters to a multi-lead feedthrough assembly for use in medical implantable devices, comprising the steps of:

a. providing a feedthrough assembly having a ferrule, a plurality of lead wires extending through an opening formed in said ferrule, and means for hermetically sealing said plurality of lead wires and said ferrule;

b. providing a plurality of parallelepiped shaped chip capacitors, each of said chip capacitors having a pair of metallized contacts formed on opposing end portions of said chip capacitor, each of said pair of metallized contacts having conductive segments disposed on at least an end most portion of each side of said chip capacitor; and

,

c. installing each of said plurality of chip capacitors between a respective lead wire and an end surface of a flange of said ferrule, said step of installing each chip capacitor includes placing one of said side conductive segments of said first metallized contact of each chip capacitor contiguous a respective lead wire and placing one conductive segment of a lower side of said opposing end portion contiguous said end surface of said flange of said ferrule.

28. A method of adding chip capacitor filters to a multi-lead feedthrough assembly for use in medical implantable devices, comprising the steps of:

a. providing a feedthrough assembly having a ferrule, a plurality of lead wires extending through an opening formed in said ferrule, and means for hermetically sealing said plurality of lead wires and said ferrule;

b. providing a plurality of parallelepiped shaped chip capacitors, each of said chip capacitors having a pair of metallized contacts formed on opposing end portions of said chip capacitor, each of said pair of metallized contacts having conductive segments disposed on at least an end most portion of each side of said chip capacitor; and

,

c. installing each of said plurality of chip capacitors between a respective lead wire and an end surface of a flange of said ferrule, said step of installing each chip capacitor includes extending each chip capacitor from a respective lead wire to said ferrule to form an angle θ

with respect to a respective radial line extending from a central axis of said ferrule through said lead wire, said angle θ

being within a range 0°

<

θ

<

90°

.

29. The method as recited in claim 28 where the step of installing each chip capacitor is preceded by the step of applying a plurality of bands of an insulating material to said end surface of said hermetic sealing means.

30. The method as recited in claim 29 where the step of applying a plurality of bands of an insulating material is followed by the step of heating said feedthrough to cure said insulating material.

31. A filtered feedthrough assembly for medical implantable devices, comprising:

a metallic ferrule having opposing first and second ends and a centrally disposed through opening extending between said first and second ends, said ferrule having a first flange formed on said first end for coupling to a medical implantable device and a second flange formed on said second end;

at least one elongate lead wire having a circular cross-sectional contour extending through said ferrule through opening;

means for forming a hermetic seal between said lead wire and said ferrule disposed within said ferrule through opening, said hermetic seal means having an end surface disposed in coplanar relationship with said second flange of said ferrule;

filter support means disposed at said end surface of said hermetic seal means, said filter support means including a insulative substrate having at least one aperture formed therein for passage of said lead wire therethrough, said substrate having at least one channel formed thereon extending from said aperture to a perimeter edge thereof;

at least one chip capacitor having a parallelepiped contour disposed in said channel and extending from said lead wire to said ferrule, said chip capacitor having a pair of metallized contacts formed on opposing end portions of said chip capacitor; and

,

means for electrically coupling said metallized contacts to said lead wire and said second flange of said ferrule respectively.

32. The filtered feedthrough assembly as recited in claim 31 where said filter support means includes a metallized annulus formed on said substrate surrounding said aperture for electrical coupling with a first of said pair of metallized contacts and said lead wire.

33. The filtered feedthrough assembly as recited in claim 32 where said filter support means includes a metallized region formed on said substrate adjacent said perimeter edge thereof for electrical coupling with a second of said pair of metallized contacts and said ferrule.

34. The filtered feedthrough assembly as recited in claim 31 where said substrate is formed of a ferrite material.

35. The filtered feedthrough assembly as recited in claim 31 where said substrate is formed of a ceramic material.

36. The filtered feedthrough assembly as recited in claim 35 where said substrate has a recess surrounding said aperture.

37. The filtered feedthrough assembly as recited in claim 36 where said filter support means further includes a ferrite bead disposed in said recess and surrounding said lead wire.

38. The filtered feedthrough assembly as recited in claim 31 further comprising a plurality of lead wires and a plurality of chip capacitors respectively coupled thereto, each of said plurality of chip capacitors being disposed in a respective channel formed on said substrate.

39. The filtered feedthrough assembly as recited in claim 31 where said insulative substrate and said hermetic seal means are integrally formed in one piece formation.

40. A multi-lead filtered feedthrough assembly for medical implantable devices, comprising:

a metallic ferrule having opposing first and second ends and a centrally disposed through opening extending between said first and second ends, said ferrule having a first flange formed on said first end for coupling to a medical implantable device and a second flange formed on said second end;

a plurality of elongate lead wires extending through said ferrule through opening, each of said plurality of lead wires having a circular cross-sectional contour;

means for forming a hermetic seal between said plurality of lead wires and said ferrule disposed within said ferrule through opening;

a plurality of chip capacitors, each of said plurality of chip capacitors having a parallelepiped contour and extending from a respective one of said plurality of lead wires to said second flange of said ferrule, each of said chip capacitors having a pair of metallized contacts formed on opposing end portions of said chip capacitor, each of said metallized contacts having conductive segments disposed on at least an end most portion of each side of said chip capacitor, each of said chip capacitors having one conductive segment of a respective endmost side portion disposed in contiguous relationship with a respective one of said plurality of lead wires and one conductive segment on a lower side of said opposing end portion disposed contiguous said second flange of said ferrule; and

,

means for electrically coupling said metallized contacts of each of said chip capacitors respectively to a respective one of said lead wires and said ferrule.