Method of mechanical and electrical substrate connection

• US 5,653,017 A
• Filed: 05/03/1996
• Issued: 08/05/1997
• Est. Priority Date: 02/10/1995
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Display Technology, Inc. (PixTech, Inc.)
• Inventors: Watkins, Charles, Cathey, David A., Gochnour, Derek
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US08/642,581
• Time in Patent Office: 459 Days
• Field of Search: 437/183, 228/180.21, 228/179.1, 174/52.4, 29/830
• US Class Current: 29/830
• CPC Class Codes: H01J 2329/8625 Spacing members
• CPC Class Codes: H01J 9/241 the vessel being for a flat panel display H01J9/261 takes precedence; flat discharge lamps H01J9/248
• CPC Class Codes: H01J 9/261 the vessel being for a flat panel display for flat discharge lamps H01J9/268
• CPC Class Codes: H01J 9/32 Sealing leading-in conductors
• CPC Class Codes: H01J 9/36 Joining connectors to internal electrode system
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/20753 larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H05K 3/328 by welding
• CPC Class Codes: H05K 3/368 parallel to each other H05K3/361 takes precedence
• CPC Class Codes: Y10T 29/49126 : Assembling bases

Abstract

The disclosure describes a method of attaching and electrically connecting first and second planar substrates, wherein the first and second substrates have inwardly-facing surfaces with matching patterns of bond pads. The method includes adjusting a wire bonder'"'"'s tear. length to a setting which leaves a projecting tail of severed bond wire at a terminating wedge bond connection. Further steps include making a wedge bond to an individual bond pad of the first planar substrate with bond wire from the wire bender, and then severing the bond wire adjacent said wedge bond. The adjusted tear length of the wire bender results in a tail of severed bond wire which projects from said wedge bond and said individual bond pad. Subsequent steps include positioning the first and second planar substrates with their inwardly-facing surfaces facing each other, aligning the matching bond pad patterns of the first and second planar substrates, and pressing the first and second planar substrates against each other. The bond wire tail deforms between the bond pads of the first and second planar substrates to conductively bond therebetween.

Claims

1. A method of attaching and electrically connecting first and second substrates, the first and second substrates having inwardly-facing surfaces with at least one pair of opposing first and second electrically conductive bonding areas, the method comprising:

providing a wire wedge bond onto at least one of the opposing first and second bonding areas, the wire wedge bond having a tail of severed bond wire projecting from said wedge bond and said at least one bonding area;

positioning the first and second substrates with their inwardly-facing surfaces facing each other;

aligning the first and second bonding areas of the first and second substrates, the bond wire tail being interposed between the first and second bonding areas; and

pressing the first and second substrates against each other, the bond wire tail deforming between the first and second bonding areas of the first and second substrates to conductively bond therebetween.

2. A method as recited in claim 1 wherein at least one of the substrates is a semiconductor die.

3. A method as recited in claim 1 wherein the first substrate is a semiconductor die.

4. A method as recited in claim 1 wherein the second substrate is a semiconductor die.

5. A method as recited in claim 1 and further comprising applying heat during the pressing step to bond between the first and second substrates.

6. A method as recited in claim 1 and further comprising applying vibration during the pressing step to bond between the first and second substrates.

7. A method as recited in claim 1 and being void of any separate adhesive interconnect between the bonding areas of the first and second substrates.

8. A method of attaching and electrically connecting first and second substrates, the first and second substrates having inwardly-facing surfaces, the method comprising:

providing a wire wedge bond onto at least one of the inwardly-facing surfaces of the first and second substrates, the wire wedge bond having a tail of severed bond wire projecting from said wedge bond and said at least one surface;

positioning the first and second substrates with their inwardly-facing surfaces facing each other, the bond wire tail being interposed between the first and second substrates; and

pressing the first and second substrates against each other, the bond wire tail deforming between the first and second substrates to conductively bond therebetween.

9. A method as recited in claim 8 wherein at least one of the substrates is a semiconductor die.

10. A method as recited in claim 8 wherein the first substrate is a semiconductor die.

11. A method as recited in claim 8 wherein the second substrate is a semiconductor die.

12. A method as recited in claim 8 and further comprising applying heat during the pressing step to bond between the first and second substrates.

13. A method as recited in claim 8 and further comprising applying vibration during the pressing step to bond between the first and second substrates.

14. A method as recited in claim 8 and being void of any separate adhesive interconnect on the bond wire tail.

15. A method of attaching and electrically connecting first and second substrates, the first and second substrates having inwardly-facing surfaces with at least one pair of opposing first and second electrically conductive bonding areas, the method comprising:

providing a projecting tail of a conductor from at least one of the opposing first and second bonding areas;

positioning the first and second substrates with their inwardly-facing surfaces facing each other;

aligning the first and second bonding areas of the first and second substrates, the projecting conductor tail being interposed between the first and second bonding areas; and

pressing the first and second substrates against each other, the projecting conductor tail deforming between the first and second bonding areas of the first and second substrates to conductively bond therebetween.

16. A method as recited in claim 15 wherein at least one of the substrates is a semiconductor die.

17. A method as recited in claim 15 wherein the first substrate is a semiconductor die.

18. A method as recited in claim 15 wherein the second substrate is a semiconductor die.

19. A method as recited in claim 15 and further comprising applying heat during the pressing step to bond between the first and second substrates.

20. A method as recited in claim 15 and further comprising applying vibration during the pressing step to bond between the first and second substrates.

21. A method as recited in claim 15 and being void of any separate adhesive interconnect between the bonding areas of the first and second substrates.

22. A method of attaching and electrically connecting first and second substrates, the first and second substrates having inwardly-facing surfaces, the method comprising:

providing a projecting tail of a conductor from at least one of the inwardly-facing surfaces of the first and second substrates;

positioning the first and second substrates with their inwardly-facing surfaces facing each other, the projecting conductor tail being interposed between the first and second substrates; and

pressing the first and second substrates against each other, the projecting conductor tail deforming between the first and second substrates to conductively bond therebetween.

23. A method as recited in claim 22 wherein at least one of the substrates is a semiconductor die.

24. A method as recited in claim 22 wherein the first substrate is a semiconductor die.

25. A method as recited in claim 22 wherein the second substrate is a semiconductor die.

26. A method as recited in claim 22 and further comprising applying heat during the pressing step to bond between the first and second substrates.

27. A method as recited in claim 22 and further comprising applying vibration during the pressing step to bond between the first and second substrates.

28. A method as recited in claim 22 and being void of any separate adhesive interconnect on the bond wire tail.