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Die sorter

  • US 5,654,204 A
  • Filed: 07/20/1994
  • Issued: 08/05/1997
  • Est. Priority Date: 07/20/1994
  • Status: Expired due to Term
First Claim
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1. A method of manufacture for a semiconductor integrated circuit comprising the steps of:

  • providing a fabricated wafer comprising a plurality of semiconductor integrated circuits, said plurality of semiconductor integrated circuits being substantially untested;

    separating each of said semiconductor integrated circuits from said fabricated wafer; and

    probing each of said semiconductor integrated circuits.

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