Demountable heat sink

• US 5,654,876 A
• Filed: 01/05/1996
• Issued: 08/05/1997
• Est. Priority Date: 01/05/1996
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Singh, Pratap, Sathe, Sanjeev Balwant
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US08/583,322
• Time in Patent Office: 578 Days
• Field of Search: 165/80.2, 165/80.3, 165/185, 174/16.3, 257/707, 257/712-713, 257/718, 257/719, 257/726, 257/727, 361/690, 361/704, 361/707, 361/709-722
• US Class Current: 361/704
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/4006 with bolts or screws

Abstract

A demountable, and thus re-usable, conductive heat sink for dissipation of excess heat of an electronic component. The heat sink uses a T-bolt and T-slot for attachment to the electronic component and the printed circuit board, respectively. This attachment eliminates the typical concerns associated with the placement of traces on the PCB to accommodate the holes placed therein for the attachment of conventional heat sinks. The improved designed also facilitates demounting of the heat sink from the printed circuit board and the electronic component without damage thereto.

Claims

1. An apparatus comprising:

a heat sink;

a printed circuit board;

a bolt having upper and lower portions;

retaining means for retaining the lower portion, the retaining means including a non-threaded slot that allows the lower portion to be placed therein and retained from vertical movement via the dimensions of the slot, the retaining means being attached to the printed circuit board, and

securing means for securing the heat sink to the upper portion, and for applying an upward force to the lower portion such that the lower portion is retained from horizontal movement via the non-threaded slot.

2. The apparatus of claim 1 further comprising:

a spring residing between the retaining means and the bottom of the heat sink.

3. The apparatus of claim 2 wherein the non-threaded slot has a dimension that is substantially similar to that of the lower portion.

4. The apparatus of claim 3 wherein the upper and lower portions of the bolt are a threaded end and a T shaped end, respectively.

5. The apparatus of claim 4 wherein the non-threaded slot is T shaped.

6. The apparatus of claim 5 wherein the securing means is a nut and washer.

7. The apparatus of claim 1 wherein the heat sink is attached using a plurality of bolts, retaining means, and securing means.

8. A method of attaching a heat sink to an electronic component mounted to a printed circuit board, the method comprising the steps of:

attaching the electronic component to the printed circuit board;

attaching retaining means to the surface of the printed circuit board, the retaining means for receiving and retaining a lower portion of a bolt, the retaining means including a non-threaded slot that allows the lower portion to slide therein and be retained from vertical movement via the dimensions of the slot;

inserting the lower portion of a bolt into the non-threaded slot;

inserting the upper portion of the bolt into receiving means of the heat sink; and

securing the bolt to the heat sink with securing means, thereby attaching the heat sink to the electronic component and the printed circuit board, the securing means retaining the lower portion from horizontal movement.

9. The method of claim 8 further comprising the step of:

inserting a spring residing between the retaining means and the bottom of the heat sink.

10. The method of claim 9 wherein the non-threaded slot has a dimension that is substantially similar to that of the lower portion.

11. The method of claim 10 wherein the upper and lower portions of the bolt are a threaded end and a T shaped end, respectively.

12. The method of claim 11 wherein the non-threaded slot is T shaped.

13. The method of claim 12 wherein the securing means is a nut and washer.