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Performance prediction method for semiconductor power modules and ICS

  • US 5,654,896 A
  • Filed: 10/31/1994
  • Issued: 08/05/1997
  • Est. Priority Date: 10/31/1994
  • Status: Expired due to Term
First Claim
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1. A method of predicting the future performance of a semiconductor integrated circuit device comprising the steps of:

  • (a) providing a semiconductor device, said semiconductor device being mounted by an interface material on an island;

    (b) providing power to said semiconductor device, said power causing thermal expansion of said die island, said interface material, and said semiconductor device;

    (c) initializing a system data base by providing a plurality of starting values from said semiconductor device into a system database, said starting values representing a plurality of device parameters;

    (d) measuring a plurality of snap-shot values for each of said device parameters while said device is in said powered state;

    (e) calculating a plurality of operating limits for each of said device parameters, said operating limits based upon said starting values and snap-shot values;

    (f) testing said snap-shot values against said operating limits to produce a plurality of results;

    (g) selecting an output dependent upon said results;

    (h) if said output is not an alarm state, repeating steps (d) to (g) until said output is said alarm state; and

    (i) predicting a performance based on said results.

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