Vacuum apparatus for the surface treatment of workpieces

• US 5,655,277 A
• Filed: 08/08/1996
• Issued: 08/12/1997
• Est. Priority Date: 10/17/1995
• Status: Expired due to Term

• Current Assignee: TEL Solar AG (OC Oerlikon Corporation AG)
• Original Assignee: Balzers Aktiengesellschaft (OC Oerlikon Corporation AG)
• Inventors: Wagner, Rudolf, Bruderer, Markus, Galdos, Aitor
• Primary Examiner(s): Briggs, William R.
• Application Number:
  US08/693,987
• Time in Patent Office: 369 Days
• Field of Search: 29/33 P, 29/25.01, 29/25.02, 29/563, 204/192.1, 204/298.25, 204/298.28, 414/217, 414/937, 414/939, 414/940, 414/941
• US Class Current: 29/33.00P
• CPC Class Codes: C03C 17/001 General methods for coating; Devices therefor
• CPC Class Codes: C23C 14/56 Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
• CPC Class Codes: Y10S 414/139 including wafer charging or discharging means for vacuum chamber
• CPC Class Codes: Y10T 29/5196 Multiple station with conveyor

Abstract

Vacuum processing plant with a small footprint for the surface treatment of large-area substrates in a virtually upright position, has a vacuum chamber containing a substrate carrier rotatable about a central axis and with at least one processing station mounted on its periphery. A transfer chamber is also mounted on its periphery and connects it to a load-lock chamber. A first transport mechanism moves the substrates from the transfer chamber in a radial direction in and out of the vacuum chamber, a second transport mechanism moves the substrates in a direction perpendicular to that of the first transport mechanism, between the transfer chamber and the load-lock chamber. A third transport mechanism moving in parallel with the second one doubles the transport capacity between the load-lock chamber and the transfer chamber.

Claims

1. Vacuum process system for surface treatment of workpieces (21) comprising:

a vacuum chamber (6b) that envelopes a substrate holder (8) that rotates around a central axis (14) with at least one process station (1-5) arranged around the periphery of said substrate holder,

a substrate transfer chamber (6a) that communicates with the vacuum chamber via a transfer opening (15) and which features a first substrate handling and transporting mechanism (9,

     17) arranged radially to the central axis (14),

at least one loading chamber (7a, 7b) with a loading chamber door (12a, 12b) on the side under atmospheric pressure and a loading chamber valve (11a, 11b) on the side under vacuum for loading or unloading the workpieces (21) for which purpose the loading chamber (7a, 7b) features a second substrate handling and transporting mechanism (10, 18, 19b,

     20),

characterized by said transfer chamber (6a) being arranged tangentially on the external periphery of the vacuum chamber (6b), being in communication with the latter via a transfer opening (15) so that with the first transporting mechanism (9,

     17) workpieces (21) can be fed through the transfer opening (15) for loading the rotatable substrate holder (8) and being further characterized by the loading chamber (7a, 7b) being in communication tangentially to the vacuum chamber (6b) with the transfer chamber (6a) and the transfer chamber (6a) featuring a third transporting mechanism (10, 18, 19a,

     20) at a right angle to the first transporting mechanism (9,

     17), where the second and third transporting mechanism is arranged in the same tangential direction.

2. Vacuum process system according to claim 1 with at least two adjacent loading chambers (7a) and (7b) arranged on the transfer chamber (6a), with control facilities for selective operation of each lock chamber as a load lock chamber or unload lock chamber.

3. Vacuum process system according to claim 2, with the load or unload lock valves of chamber (7a, 7b) arranged directly adjacent to each other.

4. Vacuum process system according to one of the claim 1 with a second and third transporting mechanism for each loading chamber (7a, 7b) arranged in a tangential line to the vacuum chamber (6b), with the transporting mechanism preferably featuring a track (19a, 19b) for a mobile substrate holder carriage (10a, 10b) and a break in this track between the loading chamber valve (11a, 11b) on the vacuum side.

5. Vacuum process system according to one of the claim 1, where the transfer chamber (6a), arranged radially to the central axis (14) of the system and perpendicularly to the tangential alignment of the transfer and load lock chamber with transporting mechanism, is equipped with a first substrate holder (9, 17) that can be shifted in the radial direction, and with the substrate holder featuring a substrate gripping device (9) for transporting the workpiece (21) between the substrate holder drum (8) and the substrate holder (10a, 10b) in a radial direction.

6. Vacuum process system according to one of the claim 1 with a mobile substrate holder (10a, 10b) in the form of a carriage that can be moved between transfer chamber (6a) and the lock chamber (7a, 7b), preferably with a motor driven dual lever arm (18) arranged on the transfer chamber (6a) so that the arm can reach through the open loading chamber valve (11a, 11b) into the loading chamber (7a, 7b).

7. Vacuum process system according to one of the claim 1, for processing workpieces (21) that are plate shaped and large-surfaced, preferably with a diameter greater than 20 cm, and in particular greater than 40 cm.

8. Vacuum process system according to one of the claim 1 in which system the workpieces (21) are arranged essentially vertically and are preferably resting on the holder (8, 10) having a slope relative to the vertical of less than 10°

, preferably within the range of 4°

to 8°

.

9. Utilization of the vacuum process system according to claim 1 for the surface treatment of glass plates used in the production of flat panel displays.