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Method for forming a monolithic electronic module by dicing wafer stacks

  • US 5,656,553 A
  • Filed: 05/30/1996
  • Issued: 08/12/1997
  • Est. Priority Date: 08/22/1994
  • Status: Expired due to Fees
First Claim
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1. A method for forming an electronic module comprising the steps of:

  • (a) providing a plurality of wafers, each wafer having at least one planar array of multiple chips which has a peripheral shape;

    (b) forming a wafer stack by stacking the plurality of wafers so that the at least one planar array of multiple chips of each wafer having the predefined peripheral shape align within the wafer stack; and

    (c) dicing the wafer stack along the predefined peripheral shape.

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