Micromechanical contact load force sensor for sensing magnitude and distribution of loads and tool employing micromechanical contact load force sensor
First Claim
Patent Images
1. A micromechanical contact load force sensor comprising:
- an array of deformable capacitive elements connected in electrical communication in columns along an insulating substrate and in electrical communication in rows through a semiconductor material bonded to said substrate,said semiconductor material provided as an array of unitary bodies each extending continuously from said insulating substrate adjacent capacitive gaps to an array of isolated bearing surfaces above said capacitive gaps, each bearing surface positioned above an associated capacitive element of said array of capacitive elements to define an array of load cells, wherein a change in capacitance is effected by deformation of one of said unitary bodies above said capacitive gaps.
2 Assignments
0 Petitions
Accused Products
Abstract
A micromechanical contact load force sensor is disclosed. The force sensor comprises an array of capacitive load cells on a substrate. The force sensor is able to sense high loads, on the order on 109 N/m2, and distribute the load over a suitable number of the cells of the array while minimizing crosstalk between adjacent cells. The force sensor is useful in biological and robotic applications.
-
Citations
36 Claims
-
1. A micromechanical contact load force sensor comprising:
-
an array of deformable capacitive elements connected in electrical communication in columns along an insulating substrate and in electrical communication in rows through a semiconductor material bonded to said substrate, said semiconductor material provided as an array of unitary bodies each extending continuously from said insulating substrate adjacent capacitive gaps to an array of isolated bearing surfaces above said capacitive gaps, each bearing surface positioned above an associated capacitive element of said array of capacitive elements to define an array of load cells, wherein a change in capacitance is effected by deformation of one of said unitary bodies above said capacitive gaps. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A micromechanical contact load force sensor comprising:
-
an insulating substrate; an array of capacitive load cells formed on said insulating substrate, comprising; a plurality of first capacitive plates formed on said insulating substrate in a spaced array, said first capacitive plates further being in electrical communication in columns, a semiconductor material bonded to said insulating substrate, a plurality of second capacitive plates supported by said semiconductor material to overlie associated ones of said first capacitive plates with a capacitive gap therebetween, said semiconductor material extending as a deformable continuous mass from said insulating substrate on opposed sides immediately adjacent said capacitive gaps to a bearing surface above each of said first and second capacitive plates, said semiconductor material electrically isolated in columns, said semiconductor material having a plurality of valleys provided therein between adjacent bearing surfaces to separate said adjacent bearing surfaces while allowing electrical communication in rows through said semiconductor material, said semiconductor material extending as a continuous mass from a low point of each of said plurality of valleys to said insulating substrate. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
-
-
20. A tool for sensing magnitude and distribution of loads comprising:
-
a support surface; a tactile array of capacitive load cells comprising; an insulating substrate supported by said support surface; a plurality of first capacitive plates formed on said insulating substrate in a spaced array, said first capacitive plates further being in electrical communication in columns, a semiconductor material bonded to said insulating substrate, a plurality of second capacitive plates supported by said semiconductor material to overlie associated ones of said first capacitive plates with a capacitive gap therebetween, said semiconductor material extending as a deformable continuous mass from said insulating substrate on opposed sides immediately adjacent said capacitive gaps to a bearing surface above each of said first and second capacitive plates, said semiconductor material electrically isolated in columns, said semiconductor material having a plurality of valleys provided therein between adjacent bearing surfaces to separate said adjacent bearing surfaces while allowing electrical communication in rows through said semiconductor material, said semiconductor material extending as a continuous mass from a low point of each of said plurality of valleys to said insulating substrate. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
-
Specification