Packaged strain actuator

• US 5,656,882 A
• Filed: 09/10/1996
• Issued: 08/12/1997
• Est. Priority Date: 01/27/1994
• Status: Expired due to Term

• Current Assignee: Cymer Incorporated (ASML Holding NV)
• Original Assignee: Active Control eXperts, Inc. (ASML Holding NV)
• Inventors: Lundstrom, Mark E., Moore, Jeffrey W., Lazarus, Kenneth B., Crawley, Edward F.
• Primary Examiner(s): BUDD, MARK OSBORNE
• Application Number:
  US08/711,249
• Time in Patent Office: 336 Days
• Field of Search: 310/316, 310/317, 310/319, 310/328, 310/330-332, 310/334, 310/338, 310/339, 310/340
• US Class Current: 310/328
• CPC Class Codes: G03F 7/70725 control
• CPC Class Codes: G03F 7/70758 Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
• CPC Class Codes: G03F 7/709 Vibration, e.g. vibration detection, compensation, suppression or isolation
• CPC Class Codes: H04R 17/08 signals being recorded or played back by vibration of a stylus in two orthogonal directions simultaneously
• CPC Class Codes: H10N 30/02 Forming enclosures or casings
• CPC Class Codes: H10N 30/204 using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
• CPC Class Codes: H10N 30/2041 Beam type
• CPC Class Codes: H10N 30/2042 Cantilevers, i.e. having one fixed end
• CPC Class Codes: H10N 30/2044 having multiple segments mechanically connected in series, e.g. zig-zag type
• CPC Class Codes: H10N 30/208 using shear or torsion displacement, e.g. d15 type devices
• CPC Class Codes: H10N 30/87 Electrodes or interconnections, e.g. leads or terminals
• CPC Class Codes: H10N 30/88 Mounts; Supports; Enclosures; Casings
• CPC Class Codes: Y10T 29/42 Piezoelectric device making
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.

Abstract

A modular actuator assembly includes one or more plates or elements of electro-active material bonded to an electroded sheet, preferably by a structural polymer to form a card. The card is sealed, and may itself constitute a practical device, such as a vane, shaker, stirrer, lever, pusher or sonicator for direct contact with a solid or immersion in a fluid, or may be bonded by a stiff adhesive to make a surface-to-surface mechanical coupling with a solid workpiece, device, substrate, machine or sample. The structural polymer provides a bending stiffness such that the thin plate does not deform to its breaking point, and a mechanical stiffness such that shear forces are efficiently coupled from the plate to the workpiece. In further embodiments, the card may include active circuit elements for switching, powering or processing signals, and/or passive circuit elements for filtering, matching or damping signals, so that few or no connections to outside circuitry are required. The actuator assembly can be manufactured in quantity, to provide a versatile actuator with uniform mechanical and actuation characteristics, that introduces negligible mass loading to the workpiece. The cards themselves may be arranged as independent mechanical actuators, rather than strain-transfer actuators, in which the induced strain changes the position of the card. Various arrangements of pinned or cantilevered cards may act as a pusher, bender or other motive actuator, and structures such as powered bellows may be formed directly by folding one or more suitably patterned cards.

Claims

1. A piezoceramic package comprising a plurality of layers laminated about a sheet of piezoceramic material, and including

said sheet of piezoceramic material having a first surface and a second surface opposite to said first surface

a flexible circuit, covering all of an active surface selected from among said first surface and said second surface of said piezoceramic material, the flexible circuit including a non-conductive polymer film layer and a conductive lead layer,

said polymer film layer having a first surface attached to said conductive lead layer and a second surface opposite to said first surface and

said lead layer including at pattern of lead segments extending in a path across said film layer and protruding thereabove,

a bonding layer of curable material bonding said flexible circuit to said active surface of said sheet such that said sheet of piezoceramic material is strengthened and protected by said bonding layer, and said bonding layer together with said flexible circuit forms a protective skin covering said active surface of said piezoceramic sheet,

said lead segments of said lead layer protruding into said bonding layer and contacting said active surface of said piezoceramic material through microvoids created in said bonding layer under said lead segments to establish direct electrical contact with said active surface while being bonded thereto, and

said curable material of said bonding layer filling between said lead segments of said lead layer to firmly bond the first side of said polymer film layer to said active surface of said sheet of piezoceramic material

such that in-plane strain in said sheet of piezoceramic material is effectively shear coupled between said piezoceramic material and said second surface of said polymer film layer.

2. A piezoceramic package according to claim 1, wherein the curable material is a highly cross-linkable polymer.

3. A piezoceramic package according to claim 1, wherein the sheet of piezoceramic material is a plate having a thickness under approximately one millimeter.

4. A piezoceramic package according to claim 3, wherein the piezoelectric plate has first and second cross dimensions, each cross dimension being greater than about one centimeter.

5. A piezoceramic package according to claim 1, wherein the bonding layer is a planarizing layer of curable sheet material having a pattern complementary to the lead pattern.

6. A piezoceramic package according to claim 3, wherein the piezoceramic sheet has a sheet plane, and flex circuits are bonded to the sheet in a pattern for applying an electric field in said sheet plane.

7. A piezoceramic package according to claim 3, wherein the piezoceramic sheet has a sheet plane, and flex circuits contact the sheet to apply an electric field which varies in a direction normal to said surface plane.

8. A piezoceramic package according to claim 1, wherein the lead layer has a comb pattern.

9. A piezoceramic package according to claim 1, comprising two different piezoceramic sheets in two different respective recesses, which are actuated in different directions to produce torsional actuation of the package.

10. A piezoceramic package according to claim 1, further comprising a circuit element within the package.

11. A piezoceramic package according to claim 10, wherein the circuit element includes at least one of a shunt, a filter, an impedance matcher, a storage element, a power source, an amplifier, and a switch.

12. A piezoceramic package according to claim 10, wherein the circuit element includes a controller.

13. A piezoceramic package according to claim 1, wherein first and second piezoceramic sheets are located in different layers of the package and actuated for moving in different senses to bend the package.

14. A piezoceramic package according to claim 1, constituting a device selected from among a vane, airfoil, shaker, stepper, stirrer, damper and sonicator.

15. A piezo ceramic package according to claim 1, wherein thickness of the package is less than twice a combined thickness of piezoceramic plates stacked in the package.

16. A piezoceramic package according to claim 1, wherein the package forms a mechanical article selected from among a stack, flexure, shell, plate and bender.

17. A piezoceramic package according to claim 1, configured as one of a pusher, flap, lever, bender, bellows and combination thereof.