Microstructure, process for manufacturing thereof and devices incorporating the same

• US 5,658,698 A
• Filed: 01/26/1995
• Issued: 08/19/1997
• Est. Priority Date: 01/31/1994
• Status: Expired due to Term

• Current Assignee: Canon Ayutthaya Limited (Canon Inc.)
• Original Assignee: Canon Ayutthaya Limited (Canon Inc.)
• Inventors: Akaike, Masatake, Yagi, Takayuki
• Primary Examiner(s): Duda, Kathleen
• Application Number:
  US08/378,610
• Time in Patent Office: 936 Days
• Field of Search: 430/9, 430/11, 430/16, 430/311, 430/322, 430/320, 310/309, 310/12
• US Class Current: 430/11
• CPC Class Codes: B81B 2203/0118 Cantilevers
• CPC Class Codes: B81C 1/0092 For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
• CPC Class Codes: B81C 1/00936 Releasing the movable structure without liquid etchant
• CPC Class Codes: B81C 2201/0107 Sacrificial metal
• CPC Class Codes: B81C 2201/0109 Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
• CPC Class Codes: B81C 2203/031 Anodic bondings
• CPC Class Codes: H01H 59/0009 making use of micromechanics
• CPC Class Codes: H02N 1/006 of the gap-closing type H02N1/004 takes precedence

Abstract

A microstructure comprising a substrate (1), a patterned structure (beam member) (2) suspended over the substrate (1) with an air-space (4) therebetween and supporting structure (3) for suspending the patterned structure (2) over the substrate (1).

The microstructure is prepared by using a sacrificial layer (7) which is removed to form the space between the substrate (1) and the patterned structure (2) adhered to the sacrificial layer. In the case of using resin as the material of the sacrificial layer, the sacrificial layer can be removed without causing sticking, and an electrode can be provided on the patterned structure.

The microstructure can have application as electrostatic actuator etc., depending on choice of shape and composition.

Claims

1. A microstructure comprising a substrate and a beam member separated from said substrate by an air space;

supporting means arranged to suspend said beam member over said substrate which supporting means is attached to that surface of said beam member which is furthest from said substrate.

2. The microstructure according to claim 1, wherein said beam member is of crystalline material.

3. The microstructure according to claim 2, wherein the crystalline material is silicon.

4. The microstructure according to claim 1, wherein said beam member is an insulating material.

5. The microstructure according to claim 4, wherein the insulating material is silicon dioxide.

6. The microstructure according to claim 4, wherein the insulating material is silicon nitride.

7. The microstructure according to claim 5, wherein said silicon dioxide is made by thermally oxidizing a silicon substrate.

8. The microstructure according to claim 5, wherein the metal film is aluminum.

9. The microstructure according to claim 1, wherein said beam member has a torsion bar portion and a cantilever portion.

10. The microstructure according to claim 9, which is configured as an electrostatic actuator, comprising a fixed electrode and a first plate electrode on said substrate together with a second plate electrode on said bridge member, electrically connected to said fixed electrode by said supporting means, said second plate electrode arranged parallel to and across from said first plate electrode.

11. The microstructure according to claim 1, wherein the supporting means is a metal film.