Packaging for electronic circuits using a capacitor as a structural member

• US 5,659,455 A
• Filed: 03/27/1996
• Issued: 08/19/1997
• Est. Priority Date: 03/28/1995
• Status: Expired due to Fees

• Current Assignee: Herbert, Edward
• Original Assignee: Herbert, Edward
• Inventors: Herbert, Edward
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Vu, Phuong T.
• Application Number:
  US08/625,407
• Time in Patent Office: 510 Days
• Field of Search: 361/271-273, 361/274.1, 361/274.2, 361/274.3, 361/275.1, 361/275.2, 361/275.3, 361/275.4, 361/301.1-301.4, 361/302, 361/303-304 , 361/306.1, 361/306.2, 361/306.3, 361/308.1, 361/517-522, 361/534-540, 174/35 TS, 174/35 R
• US Class Current: 361/306.1
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

A package for electronic circuits can be made using a bottom plate, a top plate, and side walls which are stick capacitors. The top and bottom plates can be used as two of the terminations for the electronic circuit to provide a low impedance connection for heavy currents. The contact areas of the stick capacitor are bonded to the top and bottom plates, such as by reflow soldering. The top and bottom plates and the stick capacitor side walls provide a completely enclosed equivalent of a Faraday shield for superior EMI enclosure. Although the top and bottom are isolated electrically at DC by the dielectric layers of the capacitor, they are effectively short circuited at higher AC frequency. The stick capacitors can be drilled through to provide for additional conductors to the electronic circuit. In another embodiment of the invention, a stiffener for a printed circuit board comprises a stick capacitor as a filler for a laminated beam in which the top and bottom stress members are conductors.

Claims

1. A package for an electronic circuit comprising

a base plate, the base plate defining the bottom of the package,

side walls,

the side walls defining the periphery of the package,

the side walls further defining at least a space for enclosing at least the electronic circuit,

the side walls further having a top surface and a bottom surface,

the bottom surface of the side walls being bonded to the base plate,

at least a portion of the side walls comprising a stick capacitor,

the stick capacitor having a first electrode and a second electrode

the first electrode and the second electrode being separated by a dielectric,

the first electrode being terminated at a metallized surface at the bottom of the stick capacitor in alignment with the bottom of the side walls

the metallized surface at the bottom of the stick capacitor being bonded to the base plate

the second electrode being terminated at a metallized surface at the top of the stick capacitor in alignment with the top of the side walls, and

a top plate, the top plate defining the top of the package,

the top plate further being bonded to the top surface of the side walls and the metallized surface at the top of the stick capacitor.

2. The package for an electronic circuit of claim 1

wherein at least one of the bottom plate and the top plate is a good conductor of electricity, and

wherein at least one of the bottom plate and the top plate comprises an electrical termination for the electronic circuit.

3. The package for an electronic circuit of claim 1

wherein the stick capacitor has at least one hole drilled through from the outside of the package to the inside of the package

for at least one of an electrical conductor, a mechanism, a fluid conduit, and access for adjustment.

4. A stiffener for a printed circuit board comprising

a bottom plate,

the bottom plate having a plurality of attachment means for attaching the stiffener to the printed circuit board,

a stick capacitor,

the stick capacitor having a first electrode and a second electrode

the first electrode and the second electrode being separated by a dielectric,

the first electrode being terminated at a metallized surface at the bottom of the stick capacitor

the metallized surface at the bottom of the stick capacitor being bonded to the base plate

the second electrode being terminated at a metallized surface the top of the stick capacitor, and

a top plate,

the top plate being bonded to the metallized surface at the top of the stick capacitor

the top plate further having downward extension to the printed circuit board

the downward extension of the top plate further having a plurality of attachment means for attaching the downward extension of the top plate to the printed circuit board.