Encapsulated, integrated power magnetic device and method of manufacture therefor

• US 5,659,462 A
• Filed: 04/12/1996
• Issued: 08/19/1997
• Est. Priority Date: 04/12/1996
• Status: Expired due to Term

• Current Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Weld, John David, Roessler, Robert Joseph, Lotfi, Ashraf Wagih, Chen, Shiaw-Jong Steve
• Primary Examiner(s): Krishnan, Aditya
• Application Number:
  US08/640,583
• Time in Patent Office: 494 Days
• Field of Search: 340/870.28, 340/870.29, 340/870.3, 340/825.72, 363/21, 363/20, 363/131-132, 363/147
• US Class Current: 363/21.04
• CPC Class Codes: B23Q 3/00 Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine work-tables or other parts, e.g. faceplates, normally not incorporating means for securing work B23Q1/00; automatic position control B23Q15/00 ; food cutting boards A47J47/00; workpiece support for dies B21D37/02; rotary tool heads for turning-machines B23B3/24, B23B3/26; non-driven tool holders B23B29/00; general features of turrets B23B29/24 ; drawbars in spindles B23B31/261; for electrical discharge machining B23H11/003; for welding B23K37/04; means for securing grinding wheels B24B45/00; mountings for abrasive wheels B24D5/16; tools or bench devices for fastening, connecting, disengaging or holding B25B ; chucks for percussive tools B25D17/084; work benches for manual work B25H1/00; devices for securing circular saw blades B27B5/32; for assembling or manufacturing aircrafts B64F5/10; for holding semiconductors or wafers H01L21/67; devices for holding circuit boards H05K13/0061
• CPC Class Codes: H01F 2019/085 Transformer for galvanic isolation
• CPC Class Codes: H01F 41/0206 Manufacturing of magnetic cores by mechanical means magnetic cores per se H01F27/24
• CPC Class Codes: H01F 41/08 Winding conductors onto closed formers or cores, e.g. threading conductors through toroidal cores
• CPC Class Codes: H02M 3/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H02M 3/335 using semiconductor devices only
• CPC Class Codes: Y10T 29/49073 by assembling coil and core
• CPC Class Codes: Y10T 29/49075 including permanent magnet or core
• CPC Class Codes: Y10T 29/49078 Laminated
• CPC Class Codes: Y10T 29/53196 Means to apply magnetic force directly to position or hold work part
• CPC Class Codes: Y10T 29/53265 with work-holder for assembly

Abstract

A power magnetic device, a method of manufacture therefor and a power converter. The power magnetic device includes: (1) an isolation transformer having a primary winding and a secondary winding, (2) a switch coupled to the primary winding, (3) a rectifier coupled to the secondary winding and (4) an encapsulant substantially surrounding the isolation transformer, the switch and the rectifier to join the isolation transformer, the switch and the rectifier into an integrated package, the integrated package having: (a) a first power input coupled to a first end of the primary winding, (b) a second power input coupled to the switch, (c) first and second power outputs coupled to the rectifier circuit and (d) a control input coupled to the switch, the control input allowing the switch to be controlled to couple the primary winding to a source of electrical power, the power magnetic device thereby capable of employing the isolation transformer and the rectifier to convert electrical power into DC electrical power.

Claims

1. A power magnetic device, comprising:

an isolation transformer having a primary winding and a secondary winding;

a switch coupled to said primary winding;

a rectifier coupled to said secondary winding; and

an encapsulant substantially surrounding said isolation transformer, said switch and said rectifier to join said isolation transformer, said switch and said rectifier into an integrated package, said integrated package having;

a first power input coupled to a first end of said primary winding,

a second power input coupled to said switch,

first and second power outputs coupled to said rectifier circuit, and

a control input coupled to said switch, said control input allowing said switch to be controlled to couple said primary winding to a source of electrical power, said power magnetic device thereby capable of employing said isolation transformer and said rectifier to convert electrical power into DC electrical power.

2. The power magnetic device as recited in claim 1 further comprising a heat sink coupled to said secondary winding of said isolation transformer for thermal transfer therebetween.

3. The power magnetic device as recited in claim 1 further comprising a lead frame containing said first and second power inputs and outputs and said control input and wherein a first terminal of said switch is soldered to said lead frame and second and third terminals of said switch are wire bonded to said lead frame.

4. The power magnetic device as recited in claim 1 wherein said switch is a field-effect transistor (FET).

5. The power magnetic device as recited in claim 1 wherein said rectifier comprises a plurality of diodes.

6. The power magnetic device as recited in claim 1 wherein said encapsulant is a thermosetting epoxy molding compound.

7. The power magnetic device as recited in claim 1 further comprising power supply circuitry, said power magnetic device and power supply circuitry surrounded by said encapsulant thereby forming a power supply module.

8. A method of manufacturing a power magnetic device, comprising the steps of:

providing an isolation transformer having a primary winding and a secondary winding;

coupling a switch to said primary winding;

coupling a rectifier to said secondary winding; and

substantially surrounding said isolation transformer, said switch and said rectifier with an encapsulant to join said isolation transformer, said switch and said rectifier into an integrated package, said integrated package having;

a first power input coupled to a first end of said primary winding,

a second power input coupled to said switch,

first and second power outputs coupled to said rectifier circuit, and

a control input coupled to said switch, said control input allowing said switch to be controlled to couple said primary winding to a source of electrical power, said power magnetic device thereby capable of employing said isolation transformer and said rectifier to convert electrical power into DC electrical power.

9. The method as recited in claim 8 further comprising the step of coupling a heat sink to said secondary winding of said isolation transformer for thermal transfer therebetween.

10. The method as recited in claim 8 wherein a lead frame contains said first and second power inputs and outputs and said control input, said method further comprising the steps of:

soldering a first terminal of said switch to said lead frame; and

wire bonding second and third terminals of said switch to said lead frame.

11. The method as recited in claim 8 wherein said switch is a field-effect transistor (FET).

12. The method as recited in claim 8 wherein said rectifier comprises a plurality of diodes.

13. The method as recited in claim 8 wherein said encapsulant is a thermosetting epoxy molding compound.

14. The method as recited in claim 8 further comprising the step of coupling power supply circuitry to said power magnetic device, said power magnetic device and power supply circuitry surrounded by said encapsulant thereby forming a power supply module.

15. A power converter, comprising:

control circuitry for applying control signals to a power train; and

a power train having a power train input couplable to a source of electrical power and a power train DC output couplable to an electrical load, said power train including;

an integrated power magnetic device having;

an isolation transformer having a primary winding and a secondary winding;

a switch coupled to said primary winding;

a rectifier coupled to said secondary winding;

an encapsulant substantially surrounding said isolation transformer, said switch and said rectifier to join said isolation transformer, said switch and said rectifier into an integrated package, said integrated package having;

a first power input coupled to a first end of said primary winding,

a second power input coupled to said switch,

first and second power outputs coupled to said rectifier circuit, and

a control input coupling said control circuitry to said switch, said control input allow circuitry to control circuitry to control said switch to couple said primary winding to said source of electrical power, said power magnetic device thereby capable of employing said isolation transformer and said rectifier to convert electrical power into DC electrical power.

16. The power converter as recited in claim 15 further comprising a heat sink coupled to said secondary winding of said isolation transformer for thermal transfer therebetween.

17. The power converter as recited in claim 15 further comprising a lead frame containing said first and second power inputs and outputs and said control input and wherein a first terminal of said switch is soldered to said lead frame and second and third terminals of said switch are wire bonded to said lead frame.

18. The power converter as recited in claim 15 wherein said switch is a field-effect transistor (FET).

19. The power converter as recited in claim 15 wherein said rectifier comprises a plurality of diodes.

20. The power converter as recited in claim 15 wherein said encapsulant is a thermosetting epoxy molding compound.

21. The power converter as recited in claim 15 wherein said power train comprises a low-pass filter.