Optical circuit on printed circuit board

• US 5,659,641 A
• Filed: 12/22/1995
• Issued: 08/19/1997
• Est. Priority Date: 12/22/1995
• Status: Expired

• Current Assignee: Corning Incorporated
• Original Assignee: Corning Incorporated
• Inventors: Schmidt, Gerald B., DeMeritt, Jeffery A., Walker, Robert J., Jakobson, Paul A.
• Primary Examiner(s): Palmer, Phan T. H.
• Application Number:
  US08/587,774
• Time in Patent Office: 606 Days
• Field of Search: 385/14, 385/134, 385/135, 385/136, 385/137, 385/138, 385/139
• US Class Current: 385/14
• CPC Class Codes: G02B 6/4453 Cassettes
• CPC Class Codes: H01S 3/06704 Housings; Packages
• CPC Class Codes: H05K 1/02 Details

Abstract

Apparatus for packaging a fiber optic device along with electronic and opto-electronic components upon a printed circuit board. Bend members having arcuate shaped guide surfaces for directing fibers between various components are strategically mounted upon the top surface of the board. Passive fiber optic components are also mounted upon support means between bend members so that the fibers entering and exiting the passive component run tangent to the bend radius of the bend members. The radius of curvature of the bend members is within the bend tolerance of the fibers used in the device. The bend members and support members are formed of a material having a thermal coefficient of expansion that is about equal to that of the board material whereby thermally induced stresses on the board mounted components are minimized.

Claims

1. Apparatus for mounting fiber optic circuits upon a printed circuit board that includes

a printed circuit board containing both electrical and optical circuitry on the upper surfaces of said board,

bend members each containing an arcuate guide surface having a predetermined radius of curvature that is within the bend tolerance of optical fibers used in said optical circuitry,

mounting means for selectively attaching said bend members at predetermined spaced apart locations on the upper surface of the board,

support members attached to the upper surface of said board for mounting optical circuit components between spaced apart bend members,

a pair of spaced apart mandrels mounted upon the upper surface of said board about which spliced sections of said fiber optic circuitry are wound, each mandrel being formed by a plurality of circumferentially aligned bend members,

said bend members and said support members being formed of a material that has a thermal coefficient of expansion that is about equal to that of said optical fibers.

2. The apparatus of claim 1 wherein said optical circuitry include coupler means for optically connecting active optical circuit components that are mounted on said board to said fiber optic circuit and run means on said board for electrically connecting the active component to an electrical header mounted on said board.

3. The apparatus of claim 2 that further includes electrical circuit means mounted on said board for electrically supporting said active optical circuit components.

4. The apparatus of claim 3 wherein at least one of said active components is a photodetector diode and the electrical support circuitry is mounted on said board in close proximity to said photodetector diode to enhance the operation of said diode.

5. The apparatus of claim 1 wherein the thermal coefficient of expansion of said members and said optical fibers are about equal to that of the circuit board.

6. The apparatus of claim 1 wherein said fiber optic circuit includes at least one wound fiber gain coil that is secured to the circuit board between two resilient discs.

7. The apparatus of claim 1 wherein at least one of said support members further include a linear guide surface for directing the entering and exiting optical fibers of the passive component supported therein along a path that is tangential with the guide surfaces of the spaced apart bend members.

8. The apparatus of claim 1 wherein said arcuate shaped guide surfaces of said bend members subtend an arc of about 90°

or less.

9. Apparatus for mounting a fiber optic circuit upon a printed circuit board that includes

a printed circuit board,

bend members each containing an arcuate guide surface having a predetermined radius of curvature that is within the bend tolerance of optical fibers used in the optic circuit,

mounting means for selectively attaching the bend members at predetermined spaced apart locations on the upper surface of the board;

support members attached to the upper surface of said board for mounting passive optical circuit components between two spaced apart bend members, said bend members and said support members being formed of a material that has a thermal coefficient of expansion that is about equal to that of said board, wherein said optical circuits include coupler means for optically connecting active optical circuit components that are mounted on said board to said fiber optic circuit and run means on said board for electrically connecting the active component to an electrical header mounted on said board, and

a pump laser that is coupled to the fiber optic circuit and the electrical header.

10. The apparatus of claim 9 wherein said board contains an opening that passes through said board, a heat sink mounted upon the lower surface of said board that spans said opening, and means for mounting said laser pump in said opening upon said heat sink.

11. The apparatus of claim 10 wherein the heat sink contains a flat bottom surface that is parallel to the lower surface of said board, said bottom surface of the heat sink being a predetermined distance from the lower surface of said board whereby said bottom surface provides a mounting and locating surface for said board.

12. The apparatus of claim 9 that includes stiffening means attached to said board for resisting both thermal and mechanically induced stresses.

13. The apparatus of claim 9 that includes light input and light output terminals mounted on said board that are connected to said fiber optic circuit.

14. The apparatus of claim 9 that further includes a base for supporting said board and a cover fitted to said base for enclosing said board.

15. Apparatus for mounting a fiber optic circuit upon a printed circuit board that includes

a printed circuit board,

bend members each containing an arcuate guide surface having a predetermined radius of curvature that is within the bend tolerance of optical fibers used in the optic circuit, wherein said arcuate shaped guide surfaces of said bend members subtend an arc of 90°

or less,

mounting means for selectively attaching the bend members at predetermined spaced apart locations on the upper surface of the board.

support members attached to the upper surface of said board for mounting passive optical circuit components between two spaced apart bend members, said bend members and said support members being formed of a material that has a thermal coefficient of expansion that is about equal to that of said board, and

a pair of spaced apart mandrels mounted upon said board about which spliced sections of the fiber optic circuit are wound, each mandrel being formed by a plurality of circumferentially aligned bend members.

16. The apparatus of claim 15 wherein a wound fiber gain coil is mounted inside at least one of said mandrels.

17. Apparatus for mounting fiber optic circuitry upon a printed circuit board that includes

a printed circuit board having a flat planar upper surface containing electrical circuitry thereon,

support members attached to the upper surface of the circuit board for mounting optical components containing optical fibers for carrying optical signals into and out of said components,

bend members mounted upon the upper surface of said board containing arcuate guide surfaces for physically engaging the optical fibers on the inside of each bend and directing said optical fibers toward and away from said optical components, each guide surface having a radius of curvature that is within the bend tolerance of the optical fibers, and

said bend members and said support members being formed of a material that has a thermal coefficient of expansion about equal to that of the optical fibers.

18. The apparatus of claim 17 wherein the thermal coefficient of expansion of said board is about equal to that of the optical fibers.

19. The apparatus of claim 17, that further includes linear guides for further directing said optical fibers toward and away from said optical components along a path that is tangential to the arcuate guide surfaces on the bend members.