Ultrasonic bonding process
First Claim
Patent Images
1. A method of forming an bond structure, comprising the steps of:
- providing a conductive metal bond site;
providing a conductive metal wire having a bond end;
contacting the bond end of the wire to the bond site such that the bond end and the bond site present an interface therebetween; and
applying ultrasonic energy at the interface at a frequency of approximately 162 KHz to form an electrical bond between the bond site and wire bond end.
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Accused Products
Abstract
A method for bonding a metal wire (17) to a metal bond site (16) utilizes an ultrasonic power source (12) that is at approximately 162 KHz. A mash force is applied from a pressure source (13) during bonding. A metal exchange takes place between the metal wire (17) and the bond site (16) during the application of the ultrasonic power to produce a strong bond between the metal wire (17) and the bond site (16).
99 Citations
19 Claims
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1. A method of forming an bond structure, comprising the steps of:
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providing a conductive metal bond site; providing a conductive metal wire having a bond end; contacting the bond end of the wire to the bond site such that the bond end and the bond site present an interface therebetween; and applying ultrasonic energy at the interface at a frequency of approximately 162 KHz to form an electrical bond between the bond site and wire bond end. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of forming a metallic bond structure, comprising the steps of:
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providing a conductive metal bond site; providing a conductive metal wire having a bond end; contacting the bond end of the wire to the bond site such that the bond end and the bond site present an interface therebetween; applying ultrasonic energy at the interface at a frequency of approximately 162 KHz to form an electrical bond between the bond site and wire bond end; and applying a mash force to the metal wire on the bond site during the time the ultrasonic energy is applied at the interface. - View Dependent Claims (9, 10, 11, 12, 13)
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14. A method of forming an aluminum bond structure, comprising the steps of:
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providing a conductive aluminum bond site; providing a conductive aluminum wire having a bond end; contacting the bond end of the wire to the bond site such that the bond end and the bond site present an interface therebetween; and applying ultrasonic energy at the interface at a frequency between 150 and 165 KHz to form an electrical bond between the bond site and wire bond end. - View Dependent Claims (15, 16, 17, 18, 19)
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Specification