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Ultrasonic bonding process

  • US 5,660,319 A
  • Filed: 01/17/1995
  • Issued: 08/26/1997
  • Est. Priority Date: 01/17/1995
  • Status: Expired due to Term
First Claim
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1. A method of forming an bond structure, comprising the steps of:

  • providing a conductive metal bond site;

    providing a conductive metal wire having a bond end;

    contacting the bond end of the wire to the bond site such that the bond end and the bond site present an interface therebetween; and

    applying ultrasonic energy at the interface at a frequency of approximately 162 KHz to form an electrical bond between the bond site and wire bond end.

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