Process for the recycling of spent indium oxide-tin oxide sputtering targets
First Claim
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1. Process for recycling of compacted indium tin oxide sputtering targets consisting essentially of grains having a grain size of 0.1 to 10 μ
- m said process comprisingcoarse grinding said compacted targets into a powder having a particle size less than 500 μ
m, the bulk of the powder having particle size over 100 μ
m,removing any particles having a size over 250 μ
m,hot isostatic pressing said powder under temperature and pressure, said temperature being sufficiently low that no significant recrystallization takes place, said pressure being sufficiently high that a theoretical density over 93% is obtained.
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Abstract
Compacted ITO material is ground to a powder with particles in the size range of less than 500 μm, whereupon the powder thus obtained is molded into new target blanks, either alone or in a mixture with unused ITO powder, under the simultaneous action of pressure and temperature. The temperature is kept sufficiently low so that recrystallization does not take place and the original grain size is preserved.
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4 Claims
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1. Process for recycling of compacted indium tin oxide sputtering targets consisting essentially of grains having a grain size of 0.1 to 10 μ
- m said process comprising
coarse grinding said compacted targets into a powder having a particle size less than 500 μ
m, the bulk of the powder having particle size over 100 μ
m,removing any particles having a size over 250 μ
m,hot isostatic pressing said powder under temperature and pressure, said temperature being sufficiently low that no significant recrystallization takes place, said pressure being sufficiently high that a theoretical density over 93% is obtained. - View Dependent Claims (2, 3, 4)
- m said process comprising
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