Process for preparation of small glass electrode

• US 5,660,741 A
• Filed: 06/05/1995
• Issued: 08/26/1997
• Est. Priority Date: 12/06/1990
• Status: Expired due to Fees

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Suzuki, Hiroaki, Sugama, Akio, Kojima, Naomi
• Primary Examiner(s): Tung, T.
• Application Number:
  US08/463,925
• Time in Patent Office: 813 Days
• Field of Search: 204/420, 204/435, 65/102, 216/39, 216/41, 216/97, 216/99, 156/654.1, 156/657.1, 156/659.11, 156/662.1
• US Class Current: 216/97
• CPC Class Codes: G01N 27/36 Glass electrodes
• CPC Class Codes: G01N 27/4035 Combination of a single ion-sensing electrode and a single reference electrode G01N27/406 and G01N27/413 take precedence

Abstract

A small glass electrode and process for preparation thereof are disclosed. This small glass electrode is characterized in that said glass electrode, which has a bonded structure comprises a reference electrode composed of silver/silver chloride, a glass substrate having a pad embedded therein, said pad being composed of gold or platinum and circuit-connected to the reference electrode, and a silicon substrate having a (100) plane selectively etched by the anisotropic etching technique and comprising a groove for injecting an electrolyte composed of an aqueous solution containing chlorine such as KCl, or HCl, at least one hole for holding the electrolyte and a glass film formed in a portion corresponding to the reference electrode. By this structure, the small glass electrode can be easily manufactured at a low cost.

Claims

1. A process for preparing a small glass electrode, comprising the steps of:

selectively etching a glass substrate to form an etched portion on the surface of the glass substrate,

forming a reference electrode composed of silver/silver chloride in a portion of said etched portion of said glass substrate such that the reference electrode is embedded to extend into the glass substrate,

forming a pad composed of gold and circuit-connected to said reference electrode, in another portion of said etched portion of said glass substrate,

anisotropically etching a first main surface of a silicon substrate having a (100) plane on said first main surface to form an electrolyte-injecting groove on said first main surface of said silicon substrate, and a hole extending from said first main surface to a second, opposite main surface of said silicon substrate, said groove being in communication with said hole and extending to an end of said silicon substrate, said anisotropical etching being carried out using a silicon oxide film as a mask,

forming a glass film acting as a sensing film on said second main surface of said silicon substrate from said silicon oxide film, said glass film covering and closing said hole on said second main surface of said silicon substrate so as to form an electrolyte-holding hole, and

bonding the glass substrate and the silicon substrate to each other to form a unitary structure, in such a way that said etched portion of said glass substrate and said first main surface of said silicon substrate face each other and said electrolyte-holding hole and electrolyte-injecting groove are substantially enclosed within the unitary structure.

2. A process according to claim 1, wherein said bonding is carried out by anodic bonding.

3. A preparation process according to claim 2, which further comprises a step of injecting an electrolyte from the electrolyte-injecting groove.

4. A preparation process according to claim 1, which further comprises a step of injecting an electrolyte from the electrolyte-injecting groove.

5. A process for preparing a small glass electrode, comprising the steps of:

selectively etching a glass substrate to form an etched portion on the surface of the glass substrate,

forming a reference electrode composed of silver/silver chloride in a portion of said etched portion of said glass substrate such that the reference electrode is embedded to extend into the glass substrate,

forming a pad composed of gold and circuit-connected to said reference electrode, in another portion of said etched portion of said glass substrate,

anisotropically etching a first main surface of a silicon substrate having a (100) plane on said first main surface to form an electrolyte-injecting groove on said first main surface of said silicon substrate, and a hole, said hole extending from said first main surface to a second, opposite main surface of said silicon substrate, said groove being in communication with said hole and extending to an end of said silicon substrate, said anisotropical etching being carried out using a silicon oxide film as a mask,

removing the silicon oxide film from the silicon substrate,

forming a glass film acting as a sensing film on said second main surface of said silicon substrate, said glass film covering and closing said hole on said second main surface of said silicon substrate so as to form an electrolyte-holding hole, and

bonding the glass substrate and silicon substrate to each other to form a unitary structure, in such a way that said etched portion of said glass substrate and said first main surface of said silicon substrate face each other and said electrolyte-holding hole and electrolyte-injecting groove are substantially enclosed within the unitary structure.

6. A process according to claim 5, wherein said bonding is carried out by the anodic bonding.

7. A preparation process according to claim 6, which further comprises a step of injecting an electrolyte from the electrolyte-injecting groove.

8. A process according to claim 5, wherein said glass film acting as a sensing film is composed of an upper glass layer and a lower glass layer, the glass film being made of one of sodium-calcium glass and lithium glass with the upper glass layer being sputtered or vacuum deposited on the lower glass layer, the upper and lower glass layers having the same composition.

9. A preparation process according to claim 5, which further comprises a step of injecting an electrolyte from the electrolyte-injecting groove.